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Viant Technology Inc.(DSP)
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芝能汽车
·
2025-04-19
汽车电子芯片国产化加速,GS32-DSP能否替代C2000?
芝能智芯出品德州仪器(TI)的C2000系列微控制器在汽车电子领域凭借其高性能实时控制能力和灵活的设计,成为电机控制、数字电源管理及车辆状态监测的核心解决方案。从车身电子控制系统到汽车照明、动力域控制器,C2000以高精度PWM、快速信号处理和硬件加速单元为汽车行业提供了高效、安全的支持。但随着中国汽车产业的发展,从车企、零部件到各种材料都在进行深度本土化,芯片也不例外,在经历了缺芯之后,中国车企都开始扶持芯片的自主化。本土MCU厂商正通过技术突围挑战C2000的市场地位。深圳格见构知半导体有限公司(以下简称“格见半导体”)推出的GS32-DSP系列产品,以提高芯片性能、扩大资源、降低成本为核心策略,Pin2Pin兼容TI C2000为市场战略,为国内汽车电子产业提供了更具竞争力的替代选择。C2000在汽车电子中的有哪些技术优势与应用场景?格见半导体的产品矩阵是否能撼动其地位?国产MCU在替代C2000过程中的竞争力与前景又如何?探讨这些问题,其实最终可以展望预测中国汽车电子产业的未来十年的趋势。Part 1C2000在汽车电子领域的主要应用C2000广泛应用于电机控制、数字电源、工业自动化、新能源和汽车电子等诸多场景。其特点是集成了丰富的信号处理功能,如高精度PWM、快速ADC和硬件加速单元,在过去很长一段时间内,都是实时控制领域应用的理想选择。● 在汽车电子中,C2000的其主要场景包括:电机控制、数字电源控制、车辆状态监测等。芯片集成了逻辑块,降低了对外围电路的依赖,简化了系统设计。Part 2国产MCU产业竞争力分析随着中国新能源汽车市场的快速崛起和国产化政策的推动,本土MCU厂商正加速技术突围,挑战C2000的统治地位。格见半导体GS32-DSP系列产品通过Pin-to-Pin兼容策略和技术创新,也是为国内汽车电子企业提供了另外一种选择,一种强有力的替代
汽车电子芯片国产化加速,GS32-DSP能否替代C2000?
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芝能汽车
·
2025-04-03
国产芯片替代C2000?GS32-DSP系列正在重塑数字电源市场的选择
芝能智芯出品新能源汽车除了电动化,整个电子电气架构也发生了很多变化,越来越多的功能需要通过微控制器(MCU)来实现。电动汽车的核心模块,比如牵引逆变器、电池管理系统BMS、车载充电机OBC和新能源领域的数字电源管理,甚至各种安全功能,都需要MCU来实现。德州仪器(TI)的C2000系列正是一款典型的高性能MCU代表,因为布局市场早——1995年推出,有丰富的外设支持和广泛的应用领域,是TI最具代表性的产品线之一。在国产新能源的产业升级中少不了这款产品的身影。面对国内市场快速增长、国产化趋势以及自主可控需求,中国本土微控制器(MCU)厂商迅速崛起,逐渐挑战了C2000的主导地位。前段时间拜访了深圳格见构知半导体有限公司(简称“格见半导体”),这是一家成立于2022年的专注于高端实时控制DSP芯片设计的新兴企业,代表产品是GS32系列数字信号处理器DSP(下文简称“GS32-DSP”),采用基于RISC-V GS32-DSP100内核,针对实时控制领域做深度定制优化,拥有自主知识产权;不仅与TI C2000硬件Pin-to-Pin兼容,还在算力、资源和性价比上显著提升,完全有替代C2000的底气。Part 1直击C2000核心优势的国产化进阶C2000作为一款经典产品,传统竞争力源于四大支柱:高性能信号处理内核、实时控制加速器、浮点运算精度及丰富外设生态。 面对C2000多年把持的市场,国内厂商正寻求突破口。格见半导体推出的GS32-DSP系列,凭借技术创新和产品优势,有力地挑战并超越了C2000。GS32-DSP系列不仅提供了丰富多样的产品线以满足不同应用需求,在架构上也采纳了高度灵活的格见GS32-DSP100内核,基于RISC-V指令集,自主定制专用DSP加速单元,显著提升电机电源控制特定应用性能。同时,依托本土优势,GS32
国产芯片替代C2000?GS32-DSP系列正在重塑数字电源市场的选择
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芝能汽车
·
2025-02-27
线性可插拔光学器件:数据中心节能新方案
芝能智芯出品 随着数据中心对能源效率和数据传输性能的需求不断增长,线性可插拔光学器件(Linear Pluggable Optics, LPO)作为一种新兴技术,正逐渐受到行业关注。 LPO通过将数字信号处理(DSP)功能从传统的可插拔光学模块移至机架顶部(Top-of-Rack, ToR)交换机,显著降低了功耗,同时维持了高速数据传输的能力。 与共封装光学器件(Co-Packaged Optics, CPO)相比,LPO在节能幅度上略逊一筹,但其实现难度更低,且能有效缓解热效应导致的光信号漂移问题。LPO的广泛应用受限于互操作性挑战。 为解决这一问题,光互联网络论坛(Optical Internetworking Forum, OIF)正在制定电气标准,以提升LPO模块的兼容性,推动其商业化落地。 本文将深入分析LPO的技术原理、在数据中心节能中的作用,以及其面临的挑战与未来前景。 Part 1 LPO的技术原理与节能优势 ● LPO的工作机制 LPO是一种新型光学互连技术,优化数据中心内部的高速数据传输,核心创新在于重新分配传统可插拔光学模块中的DSP功能。 在传统架构中,可插拔模块(如八进制小型可插拔模块,OSFP)内置DSP芯片,负责信号的重新定时、均衡、前向纠错(FEC)等任务,以确保光信号在长距离传输中的质量。 然而,这些DSP芯片功耗较高,约占模块总功耗的50%,成为数据中心节能的瓶颈。LPO的解决之道是将DSP功能集成到ToR交换机的专用集成电路(ASIC)中,使电信号能够直接驱动光学引擎。 具体工作流程如下: ◎ 信号发送端:交换机ASIC中的DSP处理数字信号,通过高速串行解串器(SerDes)链路传输至可插拔模块。模块内仅保留基本的模拟电路,如跨阻放大器(TIA)和连续时间线性均衡器(CTLE),用于将电信号转换为光信号。 ◎&nb
线性可插拔光学器件:数据中心节能新方案
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芝能汽车
·
2025-02-26
800Gbps长距离光通信技术:Marvell COLORZ 800
芝能智芯出品 在数据爆炸式增长和人工智能(AI)技术迅猛发展的时代,高速、远距离的数据传输已成为支撑现代数据中心和AI基础设施的核心需求。 Marvell COLORZ 800作为一款突破性的800G ZR+光学模块,以其在1000公里距离内实现800Gbps传输速度的卓越性能,重新定义了行业标准。 这款模块采用标准的OSFP可插拔外形尺寸,能在800Gbps下实现500至1000公里的传输,还可灵活调整至在2500公里距离上支持400Gbps通信。 我们将从技术原理、应用场景及市场前景三个方面,深入剖析Marvell COLORZ 800的创新之处及其对未来的深远影响。 Part 1 Marvell COLORZ 800 的技术原理与创新 在数据中心和电信网络中,数据传输介质的选择直接影响系统的性能和成本。 ● 短距离传输中,铜线因其低成本和易部署性而占据主导地位。例如,在NVIDIA GB200 NVL72这样的AI系统中,铜线可用于机架内部连接72个GPU和交换机,电缆长度通常在3米左右。 然而,当传输距离超过数米时,铜线的信号完整性会因衰减和干扰而显著下降,无法满足高速需求。 ● 光纤成为长距离传输的理想选择。光纤利用光信号传输数据,具有带宽高、损耗低、抗干扰能力强的优势。 光学模块则是光纤通信的关键组件,负责将电信号转换为光信号并在接收端逆向转换。常见的光学模块外形包括SFP(小型可插拔)、QSFP(四通道小型可插拔)和OSFP(八通道小型可插拔)。 Marvell COLORZ 800采用OSFP标准,这种外形尺寸专为高速应用设计,提供更大的功率支持、散热能力和内部空间,从而容纳复杂的组件。 Marvell COLORZ 800能在紧凑的OSFP模块中实现800Gbps的超高速和1000公里的远距离传输。 ● 其背后的技术创新令人瞩目,工作流程的简要分解: ◎&
800Gbps长距离光通信技术:Marvell COLORZ 800
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芝能汽车
·
2025-02-13
MPS 2024年财报亮点:多元领域创新是增长动力
芝能智芯出品 Monolithic Power Systems (MPS) 全年营收为22亿美元,同比增长21%,在碳化硅、汽车音频和企业笔记本电池管理解决方案等领域,MPS凭借持续创新和市场拓展,进一步巩固了其在高功率电源管理市场中的地位。 ● 全年营收:22.071亿美元,同比增长:21.2%; ● 净利润:17.867亿美元,同比增长:318.1%; ● 毛利率:GAAP毛利率:55.3%,非GAAP毛利率:55.8%。 本文将深入分析MPS的财务表现、增长驱动因素、创新成果以及未来的市场展望。 Part 1 财务表现: 稳健增长,创新驱动 MPS在2024年的整体财务表现亮眼 ● 全年营收达22.071亿美元,较2023年增长21.2%,这是MPS连续第13年的增长记录。 ● 第四季度营收创历史新高,达到6.217亿美元,同比增长37%。 离不开MPS在多元化市场布局、技术创新以及高效执行等方面的努力。 在企业数据、通信和汽车等关键市场的强劲表现,推动了收入增长。尤其在企业数据领域,MPS的电源管理解决方案在AI和服务器应用中的需求增长,成功占据了市场份额。 ● 在利润方面,MPS的净利润为17.867亿美元,同比增长318.1%,在高功率清洁能源应用、汽车音频和企业笔记本领域的产品开发取得了显著成效。 ● 毛利率有所下降(由2023年的56.1%下降至55.3%),依然保持较高的运营利润率(24.4%),在产品研发和市场拓展方面的投资回报。 MPS的创新投入无疑是其快速增长的重要驱动力,不仅在传统电源管理领域保持领先地位,还积极拓展碳化硅、汽车音频、企业笔记本和数据转换器等新兴市场。 以下是几大创新领域的详细分析: ● 碳化硅领域:高效能电源转换引领未来 碳化硅(SiC)作为高效功率半
MPS 2024年财报亮点:多元领域创新是增长动力
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编组 21备份 2
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品玩
·
2024-12-09
Sonos Ace上手体验:是耳机但更想超越耳机
自从AirPods Pro这种入耳式耳机的降噪能力大幅提升之后,我一直以为属于大耳罩耳机的时代已经结束了。前者的降噪能力,已完全可以实现类似于过去大耳罩耳机的降噪水平,同时便携性上也享有优势。 不过,当北方天气降温之后,我发现大耳罩耳机的春天似乎回来了。尤其是在乘坐公共交通的时候,各式各样的大耳罩耳机似乎成了标配。一款大耳罩耳机不光能在路上听听音乐、播客节目,或是隔绝一下地铁嘈杂的噪音,甚至还能给耳朵保暖。 不知道Sonos是不是也是这么想的。在今年Q4的开始,Sonos官宣旗下旗舰级头戴式降噪耳机产品Sonos Ace正式在中国上市,这也是Sonos品牌的首款耳机产品。 你一定听说过它们家的无线智能音响。作为一家主营一体化无线智能音响、智能家庭影院音响、无线智能音响连接器设备的品牌,Sonos在十几年声音领域的耕耘中一直未涉猎耳机产品。在谈到为什么要推出一款耳机产品时,Sonos公司CEO Patrick Spence给出了一个再简单不过的答案——这是Sonos的用户要求的。 的确,这应该算是这家公司老本行的延伸。Sonos的做法是,将个人聆听打造为Sonos生态中的一环——通过空间音频、主动消噪(ANC)技术和感知模式,以及采用Sonos全新TrueCinema技术,为个人聆听提供更具沉浸感的音效体验。 我们在最近也收到了Sonos Ace的体验产品。Sonos Ace提供黑色和白色两种颜色,售价为3999元人民币。从价格上,它似乎是奔着AirPods Max去的。 整体设计上,Sonos Ace延续了品牌简洁的设计理念——包装看起来是环保的瓦楞纸,产品依然采用了全实体按键设计,它配备的耳机盒也很有特色。包装还内附了两根转接线,USB-C to USB-C以及USB-C to 3.5mm。 从产品上看,Sonos过去的产品一般都采用了清一色的黑白两色设计,在风格上也力求
Sonos Ace上手体验:是耳机但更想超越耳机
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编组 21备份 2
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芝能汽车
·
2024-12-07
汽车毫米波雷达芯片的技术迭代路线
芝能智芯出品 智能汽车和自动驾驶技术的快速发展,毫米波雷达变得不起眼,毫米波雷达的广泛应用推动了射频前端芯片(MMIC)的技术演进。 从早期昂贵的砷化镓(GaAs)工艺到如今主流的CMOS与SiGe工艺,再到未来潜力无限的FD-SOI工艺,技术路径的不断升级有效降低了毫米波雷达的成本并提升了其性能。 我们分析车载毫米波雷达的核心需求,详细介绍不同芯片解决方案,并展望其未来在技术与市场中的发展方向。 Part 1 汽车领域对毫米波雷达 的核心需求 随着L2及更高级别自动驾驶技术的普及,车辆需要更精准的环境感知能力。毫米波雷达以其全天候工作能力和高分辨率特点,已成为实现自动驾驶的关键传感器之一。 全球多个地区的政府推动ADAS(高级驾驶辅助系统)强制安装规定,进一步刺激毫米波雷达的市场需求。例如,欧盟已将自动紧急制动系统(AEB)列为新车强制性功能。 毫米波雷达主要用于距离测量、速度感知和目标识别,其功能需求涵盖以下几点: ● 高分辨率和广视场角:提升检测精度以支持更复杂的驾驶场景,如城市环境中的行人避让。 ● 高探测距离:长距能力可满足高速公路驾驶需求,例如目标车道的提前规划。 ● 实时响应与抗干扰:确保在多传感器环境中快速、可靠地处理数据。 ◎ 在L0-L2的经济型驾驶场景中,低成本成为毫米波雷达的重要考量,这需要芯片高度集成化以降低生产成本。 ◎ 在L3-L4高阶自动驾驶中,4D成像雷达需要支持数千虚拟通道,实现超高分辨率点云,这对芯片的计算能力提出了更高要求。 毫米波雷达芯片的高集成度和多通道设计使得热管理变得复杂,特别是在高温环境下使用时需保持稳定性能。 Part 2 毫米波雷达芯片 的技术路径与解决方案 传统汽车雷达芯片方案主要采用低分辨率的雷达技术,能够提供基本的距离和速度测量功能。 ● 射频前端芯片:传
汽车毫米波雷达芯片的技术迭代路线
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编组 21备份 2
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投资界
·
2024-08-02
炬迪科技完成天使轮融资,元禾厚望、盛宇华天基金联合领投
投资界8月2日消息,近日,高端车规音频DSP芯片设计厂商炬迪(上海)科技有限公司(以下简称:炬迪科技)完成首轮融资,本轮融资由元禾厚望和盛宇投资旗下盛宇华天基金联合领投。此轮融资将用于炬迪科技新一代领先型国产车规音频DSP芯片的研发。 炬迪科技成立于2023年10月,由一群有着丰富的芯片研发经验和国内一流的音频专家团队所创建,在上海和成都设有研发中心。基于对高端音频芯片和各类音频音效处理算法的深度理解,炬迪科技从成立之初便聚焦高端车规音频DSP芯片市场,已推出多款车规音频DSP芯片。该系列芯片具备高性能、高可靠性和高性价比等优点,目前相关方案已在多家终端客户导入中。炬迪科技研发的车规音频DSP芯片和各类音频算法交钥匙整体解决方案,将提升智能汽车的音频听觉效果,满足不同汽车用户的个性化需求,降低整车成本,加速我国汽车产业关键核心零部件的国产化进程。 元禾厚望执行董事王新宇表示:智能汽车已成为全球竞逐的战略性新兴产业,也是我国经济增长的新引擎。作为该领域核心的关键器件之一,车规音频DSP芯片长期被国外厂商所垄断,对我国相关产业的可持续性发展造成了一定的影响。炬迪科技掌握车规音频DSP芯片的全部核心技术,拥有出色的团队背景、深厚的产业资源积累与产品迭代落地经验。元禾厚望作为持续深耕半导体领域的投资机构,一直密切关注我国被国外卡脖子的核心产业的发展趋势,高度看好智能汽车核心器件国产化的发展前景。未来,元禾厚望将积极支持炬迪科技的技术/产品升级与商业化拓展,助力炬迪科技推动相关产业成长壮大。 盛宇投资表示:过去10年,我国新能源汽车产业从无到有、由弱渐强。目前,各大车厂都在发力智能化,针对用户的音频舒适度体验也被各厂商提升到非常重要的高度,优秀的车内音频效果,已成为智能座舱方案的核心竞争力之一。音频DSP芯片作为车载音频方案最核心的“大脑”,长期被国外芯片厂商如ADI、AKM等垄断,
炬迪科技完成天使轮融资,元禾厚望、盛宇华天基金联合领投
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编组 21备份 2
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IPO早报
·
2024-06-19
解锁全球增长潜力:Flat Ads DSP助您触达全球,高效增长!
在当今数字化营销的时代,广告主们面临着前所未有的挑战和机遇。如何精准触达目标用户,如何最大化广告效果,如何在全球市场中实现快速增长,这些都是广告主面临的考验。作为全球领先的移动广告营销平台,Flat Ads拥有自研的DSP平台,为广告主们提供了高效、精准、智能的一站式营销解决方案。 DSP(Demand Side Platform:需求方平台)是采买流量的广告投放平台,允许广告主通过程序化购买的方式在多个广告交易市场上实时竞价购买广告流量。Flat Ads DSP凭借先进的AI算法和高效的数据处理能力,帮助广告主通过多种渠道精准触达目标用户,包括CTV、移动应用及网页等流量,以满足广告主多样化的推广需求,实现营销目标。 一、优质全球流量,助力广告主轻松获客 Flat Ads DSP连接了超过7亿独家开发者流量和海量第三方优质流量,为广告主提供了丰富多样的广告库存。无论是游戏、电商、金融还是其他行业,Flat Ads都能为广告主匹配到最优质的广告资源,助力广告主轻松获取目标用户,实现全球增长。 二、高效精准的投放策略,确保广告效果最大化 Flat Ads DSP拥有强大的精准定向能力,支持包括人群画像、设备属性等十余种广告定向能力。通过深度学习算法和AI技术,Flat Ads能够实时优化和调整投放策略,确保广告营销全链路都保持最佳的效果。这种高效精准的投放策略,不仅提高了广告的曝光率和点击率,还降低了广告成本,为广告主带来了更大的价值。 三、多种深度效果结算模式,满足广告主多样化需求 Flat Ads DSP提供灵活的出价方案,支持CPC(按点击付费)、CPI(按安装付费)、CPA(按效果付费)、CPS(按销售付费)等多种深度效果结算模式。这种多样化的结算方式,能够满足广告主不同的投放目标和需求,帮助广告主高效实现投放目标,并最大化投放效果。
解锁全球增长潜力:Flat Ads DSP助您触达全球,高效增长!
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公司概况
公司名称
Viant Technology Inc.
所属市场
NASDAQ
成立日期
- -
员工人数
- -
办公地址
- -
公司网址
http://www.viantinc.com
邮政编码
- -
联系电话
- -
联系传真
- -
公司概况
Viant Technology Inc.于2020年10月9日成立为特拉华州公司。该公司是一家广告软件公司。公司软件支持程序化购买广告和需求端平台Adelphic是营销人员及其广告代理机构用于在大多数渠道集中规划其广告媒体、购买和评估的企业软件平台。通过该公司的技术,营销人员可以轻松地在台式机、移动设备、联网电视、线性电视、流媒体音频和数字广告牌上购买广告。
04-01 12:00
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
03-17
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
03-12
员工持股计划
Form S-8 - Securities to be offered to employees in employee benefit plans
Form S-8 - Securities to be offered to employees in employee benefit plans
03-12
年度报告
Form 10-K - Annual report [Section 13 and 15(d), not S-K Item 405]
Form 10-K - Annual report [Section 13 and 15(d), not S-K Item 405]
03-12
重要事件披露
Form 8-K - Current report
Form 8-K - Current report
01-22
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
2025-12-17
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
2025-12-15
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
2025-12-15
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
2025-12-15
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
2025-12-11
[修订]年度报告
Form 10-K/A - Annual report [Section 13 and 15(d), not S-K Item 405]: [Amend]
Form 10-K/A - Annual report [Section 13 and 15(d), not S-K Item 405]: [Amend]
2025-11-10
重要事件披露
Form 8-K - Current report
Form 8-K - Current report
2025-11-10
季度报告
Form 10-Q - Quarterly report [Sections 13 or 15(d)]
Form 10-Q - Quarterly report [Sections 13 or 15(d)]
2025-09-11
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
2025-09-11
关联方拟减持公告
Form 144 - Report of proposed sale of securities
Form 144 - Report of proposed sale of securities
分时
5日
日
周
月
数据加载中...
最高
11.22
今开
11.06
量比
1.13
最低
10.63
昨收
11.23
换手率
1.15%
热议股票
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C2000为市场战略,为国内汽车电子产业提供了更具竞争力的替代选择。C2000在汽车电子中的有哪些技术优势与应用场景?格见半导体的产品矩阵是否能撼动其地位?国产MCU在替代C2000过程中的竞争力与前景又如何?探讨这些问题,其实最终可以展望预测中国汽车电子产业的未来十年的趋势。Part 1C2000在汽车电子领域的主要应用C2000广泛应用于电机控制、数字电源、工业自动化、新能源和汽车电子等诸多场景。其特点是集成了丰富的信号处理功能,如高精度PWM、快速ADC和硬件加速单元,在过去很长一段时间内,都是实时控制领域应用的理想选择。● 在汽车电子中,C2000的其主要场景包括:电机控制、数字电源控制、车辆状态监测等。芯片集成了逻辑块,降低了对外围电路的依赖,简化了系统设计。Part 2国产MCU产业竞争力分析随着中国新能源汽车市场的快速崛起和国产化政策的推动,本土MCU厂商正加速技术突围,挑战C2000的统治地位。格见半导体GS32-DSP系列产品通过Pin-to-Pin兼容策略和技术创新,也是为国内汽车电子企业提供了另外一种选择,一种强有力的替代","plainDigest":"芝能智芯出品德州仪器(TI)的C2000系列微控制器在汽车电子领域凭借其高性能实时控制能力和灵活的设计,成为电机控制、数字电源管理及车辆状态监测的核心解决方案。从车身电子控制系统到汽车照明、动力域控制器,C2000以高精度PWM、快速信号处理和硬件加速单元为汽车行业提供了高效、安全的支持。但随着中国汽车产业的发展,从车企、零部件到各种材料都在进行深度本土化,芯片也不例外,在经历了缺芯之后,中国车企都开始扶持芯片的自主化。本土MCU厂商正通过技术突围挑战C2000的市场地位。深圳格见构知半导体有限公司(以下简称“格见半导体”)推出的GS32-DSP系列产品,以提高芯片性能、扩大资源、降低成本为核心策略,Pin2Pin兼容TI C2000为市场战略,为国内汽车电子产业提供了更具竞争力的替代选择。C2000在汽车电子中的有哪些技术优势与应用场景?格见半导体的产品矩阵是否能撼动其地位?国产MCU在替代C2000过程中的竞争力与前景又如何?探讨这些问题,其实最终可以展望预测中国汽车电子产业的未来十年的趋势。Part 1C2000在汽车电子领域的主要应用C2000广泛应用于电机控制、数字电源、工业自动化、新能源和汽车电子等诸多场景。其特点是集成了丰富的信号处理功能,如高精度PWM、快速ADC和硬件加速单元,在过去很长一段时间内,都是实时控制领域应用的理想选择。● 在汽车电子中,C2000的其主要场景包括:电机控制、数字电源控制、车辆状态监测等。芯片集成了逻辑块,降低了对外围电路的依赖,简化了系统设计。Part 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GS32-DSP100内核,针对实时控制领域做深度定制优化,拥有自主知识产权;不仅与TI C2000硬件Pin-to-Pin兼容,还在算力、资源和性价比上显著提升,完全有替代C2000的底气。Part 1直击C2000核心优势的国产化进阶C2000作为一款经典产品,传统竞争力源于四大支柱:高性能信号处理内核、实时控制加速器、浮点运算精度及丰富外设生态。 面对C2000多年把持的市场,国内厂商正寻求突破口。格见半导体推出的GS32-DSP系列,凭借技术创新和产品优势,有力地挑战并超越了C2000。GS32-DSP系列不仅提供了丰富多样的产品线以满足不同应用需求,在架构上也采纳了高度灵活的格见GS32-DSP100内核,基于RISC-V指令集,自主定制专用DSP加速单元,显著提升电机电源控制特定应用性能。同时,依托本土优势,GS32","plainDigest":"芝能智芯出品新能源汽车除了电动化,整个电子电气架构也发生了很多变化,越来越多的功能需要通过微控制器(MCU)来实现。电动汽车的核心模块,比如牵引逆变器、电池管理系统BMS、车载充电机OBC和新能源领域的数字电源管理,甚至各种安全功能,都需要MCU来实现。德州仪器(TI)的C2000系列正是一款典型的高性能MCU代表,因为布局市场早——1995年推出,有丰富的外设支持和广泛的应用领域,是TI最具代表性的产品线之一。在国产新能源的产业升级中少不了这款产品的身影。面对国内市场快速增长、国产化趋势以及自主可控需求,中国本土微控制器(MCU)厂商迅速崛起,逐渐挑战了C2000的主导地位。前段时间拜访了深圳格见构知半导体有限公司(简称“格见半导体”),这是一家成立于2022年的专注于高端实时控制DSP芯片设计的新兴企业,代表产品是GS32系列数字信号处理器DSP(下文简称“GS32-DSP”),采用基于RISC-V GS32-DSP100内核,针对实时控制领域做深度定制优化,拥有自主知识产权;不仅与TI C2000硬件Pin-to-Pin兼容,还在算力、资源和性价比上显著提升,完全有替代C2000的底气。Part 1直击C2000核心优势的国产化进阶C2000作为一款经典产品,传统竞争力源于四大支柱:高性能信号处理内核、实时控制加速器、浮点运算精度及丰富外设生态。 面对C2000多年把持的市场,国内厂商正寻求突破口。格见半导体推出的GS32-DSP系列,凭借技术创新和产品优势,有力地挑战并超越了C2000。GS32-DSP系列不仅提供了丰富多样的产品线以满足不同应用需求,在架构上也采纳了高度灵活的格见GS32-DSP100内核,基于RISC-V指令集,自主定制专用DSP加速单元,显著提升电机电源控制特定应用性能。同时,依托本土优势,GS32","sourceLanguage":"CN","currentLanguage":"CN","editable":false,"auditStatus":"PASSED","topFlag":false,"totalScore":0,"gmtCreate":1743639060000,"gmtModify":1743656328674,"symbols":["DSP","IE00BD6J9T35.USD","LU1854103824.USD","LU0724618433.USD","LU1854104046.USD","LU1861219969.SGD","LU1978683503.SGD","LU1720051017.SGD","LU2357305700.SGD","LU0124384867.USD","LU0348723411.USD","IE00BZ199S13.USD","LU2298322129.HKD","LU1861214812.USD","LU1861220033.SGD","LU1720051108.HKD","LU1548497426.USD","LU1861215975.USD","LU2360107325.USD","ON"],"themeIds":[],"popularizeThemeFlag":false,"imageCount":6,"images":[{"url":"https://static.tigerbbs.com/ee2585e8dd7e418da469a16baa757205"},{"url":"https://static.tigerbbs.com/a07e315fd88c45539592641da68464df"},{"url":"https://static.tigerbbs.com/e0405e300cd1410eb83d08a9805f0a96"}],"repostCount":0,"viewCount":4184,"likeCount":0,"liked":false,"collected":false,"commentCount":0,"hotComments":[],"voteFlag":false,"rewardFlag":false,"videoFlag":false,"articleFlag":false,"paperFlag":true,"essentialFlag":false,"highlightedFlag":false,"shareLink":"https://laohu8.com/post/420444908613816","orderFlag":false,"starInvestorRankings":[],"featuresForAnalytics":[],"commentAndTweetFlag":false,"upFlag":false,"length":6391,"displayRows":4,"foldSize":0,"authorId":"10000000000010662"}],"position":0},{"cardType":"TWEET","cardId":"TWEET.408550783013040","cardData":[{"tweetId":"408550783013040","author":{"authorId":"10000000000010662","idStr":"10000000000010662","name":"芝能汽车","avatar":"https://static.tigerbbs.com/336727d832ab95004d9b13efcaa8b9b2","userType":8,"introduction":"","crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[],"fanSize":492,"starInvestorFlag":false,"userFollowAuthorFlag":false,"authorFollowUserFlag":false},"userFollowAuthorFlag":false,"authorFollowUserFlag":false,"title":"线性可插拔光学器件:数据中心节能新方案","digest":"芝能智芯出品 随着数据中心对能源效率和数据传输性能的需求不断增长,线性可插拔光学器件(Linear Pluggable Optics, LPO)作为一种新兴技术,正逐渐受到行业关注。 LPO通过将数字信号处理(DSP)功能从传统的可插拔光学模块移至机架顶部(Top-of-Rack, ToR)交换机,显著降低了功耗,同时维持了高速数据传输的能力。 与共封装光学器件(Co-Packaged Optics, CPO)相比,LPO在节能幅度上略逊一筹,但其实现难度更低,且能有效缓解热效应导致的光信号漂移问题。LPO的广泛应用受限于互操作性挑战。 为解决这一问题,光互联网络论坛(Optical Internetworking Forum, OIF)正在制定电气标准,以提升LPO模块的兼容性,推动其商业化落地。 本文将深入分析LPO的技术原理、在数据中心节能中的作用,以及其面临的挑战与未来前景。 Part 1 LPO的技术原理与节能优势 ● LPO的工作机制 LPO是一种新型光学互连技术,优化数据中心内部的高速数据传输,核心创新在于重新分配传统可插拔光学模块中的DSP功能。 在传统架构中,可插拔模块(如八进制小型可插拔模块,OSFP)内置DSP芯片,负责信号的重新定时、均衡、前向纠错(FEC)等任务,以确保光信号在长距离传输中的质量。 然而,这些DSP芯片功耗较高,约占模块总功耗的50%,成为数据中心节能的瓶颈。LPO的解决之道是将DSP功能集成到ToR交换机的专用集成电路(ASIC)中,使电信号能够直接驱动光学引擎。 具体工作流程如下: ◎ 信号发送端:交换机ASIC中的DSP处理数字信号,通过高速串行解串器(SerDes)链路传输至可插拔模块。模块内仅保留基本的模拟电路,如跨阻放大器(TIA)和连续时间线性均衡器(CTLE),用于将电信号转换为光信号。 ◎&nb","plainDigest":"芝能智芯出品 随着数据中心对能源效率和数据传输性能的需求不断增长,线性可插拔光学器件(Linear Pluggable Optics, LPO)作为一种新兴技术,正逐渐受到行业关注。 LPO通过将数字信号处理(DSP)功能从传统的可插拔光学模块移至机架顶部(Top-of-Rack, ToR)交换机,显著降低了功耗,同时维持了高速数据传输的能力。 与共封装光学器件(Co-Packaged Optics, CPO)相比,LPO在节能幅度上略逊一筹,但其实现难度更低,且能有效缓解热效应导致的光信号漂移问题。LPO的广泛应用受限于互操作性挑战。 为解决这一问题,光互联网络论坛(Optical Internetworking Forum, OIF)正在制定电气标准,以提升LPO模块的兼容性,推动其商业化落地。 本文将深入分析LPO的技术原理、在数据中心节能中的作用,以及其面临的挑战与未来前景。 Part 1 LPO的技术原理与节能优势 ● LPO的工作机制 LPO是一种新型光学互连技术,优化数据中心内部的高速数据传输,核心创新在于重新分配传统可插拔光学模块中的DSP功能。 在传统架构中,可插拔模块(如八进制小型可插拔模块,OSFP)内置DSP芯片,负责信号的重新定时、均衡、前向纠错(FEC)等任务,以确保光信号在长距离传输中的质量。 然而,这些DSP芯片功耗较高,约占模块总功耗的50%,成为数据中心节能的瓶颈。LPO的解决之道是将DSP功能集成到ToR交换机的专用集成电路(ASIC)中,使电信号能够直接驱动光学引擎。 具体工作流程如下: ◎ 信号发送端:交换机ASIC中的DSP处理数字信号,通过高速串行解串器(SerDes)链路传输至可插拔模块。模块内仅保留基本的模拟电路,如跨阻放大器(TIA)和连续时间线性均衡器(CTLE),用于将电信号转换为光信号。 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COLORZ 800","digest":"芝能智芯出品 在数据爆炸式增长和人工智能(AI)技术迅猛发展的时代,高速、远距离的数据传输已成为支撑现代数据中心和AI基础设施的核心需求。 Marvell COLORZ 800作为一款突破性的800G ZR+光学模块,以其在1000公里距离内实现800Gbps传输速度的卓越性能,重新定义了行业标准。 这款模块采用标准的OSFP可插拔外形尺寸,能在800Gbps下实现500至1000公里的传输,还可灵活调整至在2500公里距离上支持400Gbps通信。 我们将从技术原理、应用场景及市场前景三个方面,深入剖析Marvell COLORZ 800的创新之处及其对未来的深远影响。 Part 1 Marvell COLORZ 800 的技术原理与创新 在数据中心和电信网络中,数据传输介质的选择直接影响系统的性能和成本。 ● 短距离传输中,铜线因其低成本和易部署性而占据主导地位。例如,在NVIDIA GB200 NVL72这样的AI系统中,铜线可用于机架内部连接72个GPU和交换机,电缆长度通常在3米左右。 然而,当传输距离超过数米时,铜线的信号完整性会因衰减和干扰而显著下降,无法满足高速需求。 ● 光纤成为长距离传输的理想选择。光纤利用光信号传输数据,具有带宽高、损耗低、抗干扰能力强的优势。 光学模块则是光纤通信的关键组件,负责将电信号转换为光信号并在接收端逆向转换。常见的光学模块外形包括SFP(小型可插拔)、QSFP(四通道小型可插拔)和OSFP(八通道小型可插拔)。 Marvell COLORZ 800采用OSFP标准,这种外形尺寸专为高速应用设计,提供更大的功率支持、散热能力和内部空间,从而容纳复杂的组件。 Marvell COLORZ 800能在紧凑的OSFP模块中实现800Gbps的超高速和1000公里的远距离传输。 ● 其背后的技术创新令人瞩目,工作流程的简要分解: ◎&","plainDigest":"芝能智芯出品 在数据爆炸式增长和人工智能(AI)技术迅猛发展的时代,高速、远距离的数据传输已成为支撑现代数据中心和AI基础设施的核心需求。 Marvell COLORZ 800作为一款突破性的800G ZR+光学模块,以其在1000公里距离内实现800Gbps传输速度的卓越性能,重新定义了行业标准。 这款模块采用标准的OSFP可插拔外形尺寸,能在800Gbps下实现500至1000公里的传输,还可灵活调整至在2500公里距离上支持400Gbps通信。 我们将从技术原理、应用场景及市场前景三个方面,深入剖析Marvell COLORZ 800的创新之处及其对未来的深远影响。 Part 1 Marvell COLORZ 800 的技术原理与创新 在数据中心和电信网络中,数据传输介质的选择直接影响系统的性能和成本。 ● 短距离传输中,铜线因其低成本和易部署性而占据主导地位。例如,在NVIDIA GB200 NVL72这样的AI系统中,铜线可用于机架内部连接72个GPU和交换机,电缆长度通常在3米左右。 然而,当传输距离超过数米时,铜线的信号完整性会因衰减和干扰而显著下降,无法满足高速需求。 ● 光纤成为长距离传输的理想选择。光纤利用光信号传输数据,具有带宽高、损耗低、抗干扰能力强的优势。 光学模块则是光纤通信的关键组件,负责将电信号转换为光信号并在接收端逆向转换。常见的光学模块外形包括SFP(小型可插拔)、QSFP(四通道小型可插拔)和OSFP(八通道小型可插拔)。 Marvell COLORZ 800采用OSFP标准,这种外形尺寸专为高速应用设计,提供更大的功率支持、散热能力和内部空间,从而容纳复杂的组件。 Marvell COLORZ 800能在紧凑的OSFP模块中实现800Gbps的超高速和1000公里的远距离传输。 ● 其背后的技术创新令人瞩目,工作流程的简要分解: 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炬迪科技成立于2023年10月,由一群有着丰富的芯片研发经验和国内一流的音频专家团队所创建,在上海和成都设有研发中心。基于对高端音频芯片和各类音频音效处理算法的深度理解,炬迪科技从成立之初便聚焦高端车规音频DSP芯片市场,已推出多款车规音频DSP芯片。该系列芯片具备高性能、高可靠性和高性价比等优点,目前相关方案已在多家终端客户导入中。炬迪科技研发的车规音频DSP芯片和各类音频算法交钥匙整体解决方案,将提升智能汽车的音频听觉效果,满足不同汽车用户的个性化需求,降低整车成本,加速我国汽车产业关键核心零部件的国产化进程。 元禾厚望执行董事王新宇表示:智能汽车已成为全球竞逐的战略性新兴产业,也是我国经济增长的新引擎。作为该领域核心的关键器件之一,车规音频DSP芯片长期被国外厂商所垄断,对我国相关产业的可持续性发展造成了一定的影响。炬迪科技掌握车规音频DSP芯片的全部核心技术,拥有出色的团队背景、深厚的产业资源积累与产品迭代落地经验。元禾厚望作为持续深耕半导体领域的投资机构,一直密切关注我国被国外卡脖子的核心产业的发展趋势,高度看好智能汽车核心器件国产化的发展前景。未来,元禾厚望将积极支持炬迪科技的技术/产品升级与商业化拓展,助力炬迪科技推动相关产业成长壮大。 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