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圣骑士
圣骑士
·
05-19
景硕、欣兴、南电等高阶ABF基板厂有哪个是上市公司？
台积电CPO布局升级加速，ABF基板供需恐再现紧张局面
AI数据中心军备竞赛蔓延至新战场——台积电光电共封装方案"COUPE on Substrate"将于2026年下半年量产，技术路线从先进制程升级至光电系统整合。AI GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。
台积电CPO布局升级加速，ABF基板供需恐再现紧张局面
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圣骑士
圣骑士
·
05-19
景硕、欣兴、南电等高阶ABF基板厂有哪个是上市公司？
台积电CPO布局升级加速，ABF基板供需恐再现紧张局面
AI数据中心军备竞赛蔓延至新战场——台积电光电共封装方案"COUPE on Substrate"将于2026年下半年量产，技术路线从先进制程升级至光电系统整合。AI GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。
台积电CPO布局升级加速，ABF基板供需恐再现紧张局面
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GPU、HBM与高速网络互连整合度，<strong>英伟达下一步锁定的供应链瓶颈很可能正是ABF基板——手段包括框架协议、预付款、战略合作乃至股权投资等方式，以避免重演此前CoWoS与HBM供应吃紧的局面。</strong>市场预期，在AI GPU、ASIC与CPO需求同步拉升下，高阶ABF基板明年不排除再度出现供不应求。</p><h2 id=\"id_3273644154\">台积电CPO延伸至基板层级，技术路线升级</h2><p>台积电此次将COUPE方案延伸至基板层级，标志着AI芯片封装技术路线的重要演进。供应链指出，当光学元件越靠近运算芯片，数据传输距离越短，可同步降低信号损耗、延迟与功耗，对AI服务器从单机性能竞赛走向整柜、整集群效能竞赛具有关键意义。</p><p>英伟达近期亦宣布与<a href=\"https://laohu8.com/S/GLW\">康宁</a>（Corning）深化合作，扩大AI数据中心光学元件供应布局，以确保未来高速光互连所需产能。分析人士认为，上述动作共同指向同一方向：随着云端服务供应商（CSP）持续追求更高机柜效率与更低功耗，晶圆代工、HBM、光纤、光模块与ABF基板等关键环节，均可能成为AI大厂提前锁定产能的核心战略资源。</p><h2 id=\"id_2702580886\">ABF基板需求结构性抬升，消耗量较传统CPU提升数倍</h2><p>供应链透露，相较传统CPU基板，AI GPU与ASIC所需的基板面积与层数大幅增加，ABF材料消耗量提升5至10倍。随着AI GPU、ASIC及高阶网通芯片需求持续攀升，高阶ABF基板的供需结构恐将长期维持偏紧态势。</p><p>媒体分析认为，英伟达不排除通过长约、预付款甚至战略合作等方式提前锁定高阶基板产能，以规避供应链风险。这一预期与英伟达此前在CoWoS封装及HBM内存领域的产能锁定策略一脉相承。</p><p>景硕、欣兴、南电等高阶ABF基板厂均有望受益于上述需求趋势。其中，已切入英伟达Vera Rubin平台供应链的景硕，受益程度相对突出。业界预期，在CPO逐步成为未来AI服务器主流架构的背景下，高阶ABF基板的战略地位将持续提升，相关厂商的产能与技术布局或将成为供应链谈判的重要筹码。</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>台积电CPO布局升级加速，ABF基板供需恐再现紧张局面</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n台积电CPO布局升级加速，ABF基板供需恐再现紧张局面\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1084101182\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/66809d1f5c2e43e2bdf15820c6d6897e);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">华尔街见闻 </p>\n<p class=\"h-time\">2026-05-18 10:32</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><head></head><body><blockquote><p>AI数据中心军备竞赛蔓延至新战场——台积电光电共封装方案"COUPE on Substrate"将于2026年下半年量产，技术路线从先进制程升级至光电系统整合。AI GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。</p></blockquote><p>AI数据中心高速传输需求持续爆发，正将半导体供应链竞争推向新战场。</p><p>据中国台湾媒体《工商时报》周一报道，<a href=\"https://laohu8.com/S/TSM\">台积电</a>近期披露，结合紧凑型通用光子引擎（COUPE）的"COUPE on Substrate"方案<strong>预计于2026年下半年进入量产。</strong></p><p>业界将此解读为<strong>AI芯片制造从"先进制程＋先进封装"迈向"<a href=\"https://laohu8.com/S/600184\">光电</a>共封装＋系统整合"新阶段的关键信号，竞争焦点正进一步延伸至ABF基板与光电共封装整合领域。</strong></p><p>随着<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>新一代Vera Rubin平台持续提升AI GPU、HBM与高速网络互连整合度，<strong>英伟达下一步锁定的供应链瓶颈很可能正是ABF基板——手段包括框架协议、预付款、战略合作乃至股权投资等方式，以避免重演此前CoWoS与HBM供应吃紧的局面。</strong>市场预期，在AI GPU、ASIC与CPO需求同步拉升下，高阶ABF基板明年不排除再度出现供不应求。</p><h2 id=\"id_3273644154\">台积电CPO延伸至基板层级，技术路线升级</h2><p>台积电此次将COUPE方案延伸至基板层级，标志着AI芯片封装技术路线的重要演进。供应链指出，当光学元件越靠近运算芯片，数据传输距离越短，可同步降低信号损耗、延迟与功耗，对AI服务器从单机性能竞赛走向整柜、整集群效能竞赛具有关键意义。</p><p>英伟达近期亦宣布与<a href=\"https://laohu8.com/S/GLW\">康宁</a>（Corning）深化合作，扩大AI数据中心光学元件供应布局，以确保未来高速光互连所需产能。分析人士认为，上述动作共同指向同一方向：随着云端服务供应商（CSP）持续追求更高机柜效率与更低功耗，晶圆代工、HBM、光纤、光模块与ABF基板等关键环节，均可能成为AI大厂提前锁定产能的核心战略资源。</p><h2 id=\"id_2702580886\">ABF基板需求结构性抬升，消耗量较传统CPU提升数倍</h2><p>供应链透露，相较传统CPU基板，AI GPU与ASIC所需的基板面积与层数大幅增加，ABF材料消耗量提升5至10倍。随着AI GPU、ASIC及高阶网通芯片需求持续攀升，高阶ABF基板的供需结构恐将长期维持偏紧态势。</p><p>媒体分析认为，英伟达不排除通过长约、预付款甚至战略合作等方式提前锁定高阶基板产能，以规避供应链风险。这一预期与英伟达此前在CoWoS封装及HBM内存领域的产能锁定策略一脉相承。</p><p>景硕、欣兴、南电等高阶ABF基板厂均有望受益于上述需求趋势。其中，已切入英伟达Vera Rubin平台供应链的景硕，受益程度相对突出。业界预期，在CPO逐步成为未来AI服务器主流架构的背景下，高阶ABF基板的战略地位将持续提升，相关厂商的产能与技术布局或将成为供应链谈判的重要筹码。</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://community-static.tradeup.com/news/01eaf058af436cca2f4a0dfb3f908c1a","relate_stocks":{"BK4548":"巴美列捷福持仓","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY 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GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。AI数据中心高速传输需求持续爆发，正将半导体供应链竞争推向新战场。据中国台湾媒体《工商时报》周一报道，台积电近期披露，结合紧凑型通用光子引擎（COUPE）的\"COUPE on Substrate\"方案预计于2026年下半年进入量产。业界将此解读为AI芯片制造从\"先进制程＋先进封装\"迈向\"光电共封装＋系统整合\"新阶段的关键信号，竞争焦点正进一步延伸至ABF基板与光电共封装整合领域。随着英伟达新一代Vera Rubin平台持续提升AI GPU、HBM与高速网络互连整合度，英伟达下一步锁定的供应链瓶颈很可能正是ABF基板——手段包括框架协议、预付款、战略合作乃至股权投资等方式，以避免重演此前CoWoS与HBM供应吃紧的局面。市场预期，在AI GPU、ASIC与CPO需求同步拉升下，高阶ABF基板明年不排除再度出现供不应求。台积电CPO延伸至基板层级，技术路线升级台积电此次将COUPE方案延伸至基板层级，标志着AI芯片封装技术路线的重要演进。供应链指出，当光学元件越靠近运算芯片，数据传输距离越短，可同步降低信号损耗、延迟与功耗，对AI服务器从单机性能竞赛走向整柜、整集群效能竞赛具有关键意义。英伟达近期亦宣布与康宁（Corning）深化合作，扩大AI数据中心光学元件供应布局，以确保未来高速光互连所需产能。分析人士认为，上述动作共同指向同一方向：随着云端服务供应商（CSP）持续追求更高机柜效率与更低功耗，晶圆代工、HBM、光纤、光模块与ABF基板等关键环节，均可能成为AI大厂提前锁定产能的核心战略资源。ABF基板需求结构性抬升，消耗量较传统CPU提升数倍供应链透露，相较传统CPU基板，AI GPU与ASIC所需的基板面积与层数大幅增加，ABF材料消耗量提升5至10倍。随着AI GPU、ASIC及高阶网通芯片需求持续攀升，高阶ABF基板的供需结构恐将长期维持偏紧态势。媒体分析认为，英伟达不排除通过长约、预付款甚至战略合作等方式提前锁定高阶基板产能，以规避供应链风险。这一预期与英伟达此前在CoWoS封装及HBM内存领域的产能锁定策略一脉相承。景硕、欣兴、南电等高阶ABF基板厂均有望受益于上述需求趋势。其中，已切入英伟达Vera Rubin平台供应链的景硕，受益程度相对突出。业界预期，在CPO逐步成为未来AI服务器主流架构的背景下，高阶ABF基板的战略地位将持续提升，相关厂商的产能与技术布局或将成为供应链谈判的重要筹码。","news_type":1,"symbols_score_info":{"TSMY":0.6,"TSMX":0.6,"TSMU":0.6,"TSM":1.96,"TSMG":0.6,"STSM":0.6,"03145":0.6,"TSMZ":0.6}},"isVote":1,"tweetType":1,"viewCount":126,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0}],"essenList":[{"id":565643930182536,"gmtCreate":1779130978194,"gmtModify":1779141160703,"author":{"id":"78726315297500","authorId":"78726315297500","name":"圣骑士","avatar":"https://static.tigerbbs.com/6a3f98f8d8bfa26966936bdf2d3de276","crmLevel":4,"crmLevelSwitch":1,"followedFlag":false,"authorIdStr":"78726315297500","idStr":"78726315297500"},"themes":[],"title":"","htmlText":"景硕、欣兴、南电等高阶ABF基板厂有哪个是上市公司？","listText":"景硕、欣兴、南电等高阶ABF基板厂有哪个是上市公司？","text":"景硕、欣兴、南电等高阶ABF基板厂有哪个是上市公司？","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/565643930182536","repostId":"2636101036","repostType":2,"repost":{"id":"2636101036","kind":"highlight","weMediaInfo":{"introduction":"追踪全球财经热点，精选影响您财富的资讯，投资理财必备神器！","home_visible":1,"media_name":"华尔街见闻","id":"1084101182","head_image":"https://static.tigerbbs.com/66809d1f5c2e43e2bdf15820c6d6897e"},"pubTimestamp":1779071557,"share":"https://www.laohu8.com/m/news/2636101036?lang=zh_CN&edition=full","pubTime":"2026-05-18 10:32","market":"sh","language":"zh","title":"台积电CPO布局升级加速，ABF基板供需恐再现紧张局面","url":"https://stock-news.laohu8.com/highlight/detail?id=2636101036","media":"华尔街见闻","summary":"AI数据中心军备竞赛蔓延至新战场——台积电光电共封装方案\"COUPE on Substrate\"将于2026年下半年量产，技术路线从先进制程升级至光电系统整合。AI GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。","content":"<html><head></head><body><blockquote><p>AI数据中心军备竞赛蔓延至新战场——台积电光电共封装方案"COUPE on Substrate"将于2026年下半年量产，技术路线从先进制程升级至光电系统整合。AI GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。</p></blockquote><p>AI数据中心高速传输需求持续爆发，正将半导体供应链竞争推向新战场。</p><p>据中国台湾媒体《工商时报》周一报道，<a href=\"https://laohu8.com/S/TSM\">台积电</a>近期披露，结合紧凑型通用光子引擎（COUPE）的"COUPE on Substrate"方案<strong>预计于2026年下半年进入量产。</strong></p><p>业界将此解读为<strong>AI芯片制造从"先进制程＋先进封装"迈向"<a href=\"https://laohu8.com/S/600184\">光电</a>共封装＋系统整合"新阶段的关键信号，竞争焦点正进一步延伸至ABF基板与光电共封装整合领域。</strong></p><p>随着<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>新一代Vera Rubin平台持续提升AI GPU、HBM与高速网络互连整合度，<strong>英伟达下一步锁定的供应链瓶颈很可能正是ABF基板——手段包括框架协议、预付款、战略合作乃至股权投资等方式，以避免重演此前CoWoS与HBM供应吃紧的局面。</strong>市场预期，在AI GPU、ASIC与CPO需求同步拉升下，高阶ABF基板明年不排除再度出现供不应求。</p><h2 id=\"id_3273644154\">台积电CPO延伸至基板层级，技术路线升级</h2><p>台积电此次将COUPE方案延伸至基板层级，标志着AI芯片封装技术路线的重要演进。供应链指出，当光学元件越靠近运算芯片，数据传输距离越短，可同步降低信号损耗、延迟与功耗，对AI服务器从单机性能竞赛走向整柜、整集群效能竞赛具有关键意义。</p><p>英伟达近期亦宣布与<a href=\"https://laohu8.com/S/GLW\">康宁</a>（Corning）深化合作，扩大AI数据中心光学元件供应布局，以确保未来高速光互连所需产能。分析人士认为，上述动作共同指向同一方向：随着云端服务供应商（CSP）持续追求更高机柜效率与更低功耗，晶圆代工、HBM、光纤、光模块与ABF基板等关键环节，均可能成为AI大厂提前锁定产能的核心战略资源。</p><h2 id=\"id_2702580886\">ABF基板需求结构性抬升，消耗量较传统CPU提升数倍</h2><p>供应链透露，相较传统CPU基板，AI GPU与ASIC所需的基板面积与层数大幅增加，ABF材料消耗量提升5至10倍。随着AI GPU、ASIC及高阶网通芯片需求持续攀升，高阶ABF基板的供需结构恐将长期维持偏紧态势。</p><p>媒体分析认为，英伟达不排除通过长约、预付款甚至战略合作等方式提前锁定高阶基板产能，以规避供应链风险。这一预期与英伟达此前在CoWoS封装及HBM内存领域的产能锁定策略一脉相承。</p><p>景硕、欣兴、南电等高阶ABF基板厂均有望受益于上述需求趋势。其中，已切入英伟达Vera Rubin平台供应链的景硕，受益程度相对突出。业界预期，在CPO逐步成为未来AI服务器主流架构的背景下，高阶ABF基板的战略地位将持续提升，相关厂商的产能与技术布局或将成为供应链谈判的重要筹码。</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>台积电CPO布局升级加速，ABF基板供需恐再现紧张局面</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ 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}\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n台积电CPO布局升级加速，ABF基板供需恐再现紧张局面\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1084101182\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/66809d1f5c2e43e2bdf15820c6d6897e);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">华尔街见闻 </p>\n<p class=\"h-time\">2026-05-18 10:32</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><head></head><body><blockquote><p>AI数据中心军备竞赛蔓延至新战场——台积电光电共封装方案"COUPE on Substrate"将于2026年下半年量产，技术路线从先进制程升级至光电系统整合。AI GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。</p></blockquote><p>AI数据中心高速传输需求持续爆发，正将半导体供应链竞争推向新战场。</p><p>据中国台湾媒体《工商时报》周一报道，<a href=\"https://laohu8.com/S/TSM\">台积电</a>近期披露，结合紧凑型通用光子引擎（COUPE）的"COUPE on Substrate"方案<strong>预计于2026年下半年进入量产。</strong></p><p>业界将此解读为<strong>AI芯片制造从"先进制程＋先进封装"迈向"<a href=\"https://laohu8.com/S/600184\">光电</a>共封装＋系统整合"新阶段的关键信号，竞争焦点正进一步延伸至ABF基板与光电共封装整合领域。</strong></p><p>随着<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>新一代Vera Rubin平台持续提升AI GPU、HBM与高速网络互连整合度，<strong>英伟达下一步锁定的供应链瓶颈很可能正是ABF基板——手段包括框架协议、预付款、战略合作乃至股权投资等方式，以避免重演此前CoWoS与HBM供应吃紧的局面。</strong>市场预期，在AI GPU、ASIC与CPO需求同步拉升下，高阶ABF基板明年不排除再度出现供不应求。</p><h2 id=\"id_3273644154\">台积电CPO延伸至基板层级，技术路线升级</h2><p>台积电此次将COUPE方案延伸至基板层级，标志着AI芯片封装技术路线的重要演进。供应链指出，当光学元件越靠近运算芯片，数据传输距离越短，可同步降低信号损耗、延迟与功耗，对AI服务器从单机性能竞赛走向整柜、整集群效能竞赛具有关键意义。</p><p>英伟达近期亦宣布与<a href=\"https://laohu8.com/S/GLW\">康宁</a>（Corning）深化合作，扩大AI数据中心光学元件供应布局，以确保未来高速光互连所需产能。分析人士认为，上述动作共同指向同一方向：随着云端服务供应商（CSP）持续追求更高机柜效率与更低功耗，晶圆代工、HBM、光纤、光模块与ABF基板等关键环节，均可能成为AI大厂提前锁定产能的核心战略资源。</p><h2 id=\"id_2702580886\">ABF基板需求结构性抬升，消耗量较传统CPU提升数倍</h2><p>供应链透露，相较传统CPU基板，AI GPU与ASIC所需的基板面积与层数大幅增加，ABF材料消耗量提升5至10倍。随着AI GPU、ASIC及高阶网通芯片需求持续攀升，高阶ABF基板的供需结构恐将长期维持偏紧态势。</p><p>媒体分析认为，英伟达不排除通过长约、预付款甚至战略合作等方式提前锁定高阶基板产能，以规避供应链风险。这一预期与英伟达此前在CoWoS封装及HBM内存领域的产能锁定策略一脉相承。</p><p>景硕、欣兴、南电等高阶ABF基板厂均有望受益于上述需求趋势。其中，已切入英伟达Vera Rubin平台供应链的景硕，受益程度相对突出。业界预期，在CPO逐步成为未来AI服务器主流架构的背景下，高阶ABF基板的战略地位将持续提升，相关厂商的产能与技术布局或将成为供应链谈判的重要筹码。</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://community-static.tradeup.com/news/01eaf058af436cca2f4a0dfb3f908c1a","relate_stocks":{"BK4548":"巴美列捷福持仓","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY 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GPU所需ABF基板材料消耗量较传统CPU暴增5至10倍，英伟达或效仿锁定CoWoS与HBM产能的惯例提前锁定ABF基板。AI数据中心高速传输需求持续爆发，正将半导体供应链竞争推向新战场。据中国台湾媒体《工商时报》周一报道，台积电近期披露，结合紧凑型通用光子引擎（COUPE）的\"COUPE on Substrate\"方案预计于2026年下半年进入量产。业界将此解读为AI芯片制造从\"先进制程＋先进封装\"迈向\"光电共封装＋系统整合\"新阶段的关键信号，竞争焦点正进一步延伸至ABF基板与光电共封装整合领域。随着英伟达新一代Vera Rubin平台持续提升AI GPU、HBM与高速网络互连整合度，英伟达下一步锁定的供应链瓶颈很可能正是ABF基板——手段包括框架协议、预付款、战略合作乃至股权投资等方式，以避免重演此前CoWoS与HBM供应吃紧的局面。市场预期，在AI GPU、ASIC与CPO需求同步拉升下，高阶ABF基板明年不排除再度出现供不应求。台积电CPO延伸至基板层级，技术路线升级台积电此次将COUPE方案延伸至基板层级，标志着AI芯片封装技术路线的重要演进。供应链指出，当光学元件越靠近运算芯片，数据传输距离越短，可同步降低信号损耗、延迟与功耗，对AI服务器从单机性能竞赛走向整柜、整集群效能竞赛具有关键意义。英伟达近期亦宣布与康宁（Corning）深化合作，扩大AI数据中心光学元件供应布局，以确保未来高速光互连所需产能。分析人士认为，上述动作共同指向同一方向：随着云端服务供应商（CSP）持续追求更高机柜效率与更低功耗，晶圆代工、HBM、光纤、光模块与ABF基板等关键环节，均可能成为AI大厂提前锁定产能的核心战略资源。ABF基板需求结构性抬升，消耗量较传统CPU提升数倍供应链透露，相较传统CPU基板，AI GPU与ASIC所需的基板面积与层数大幅增加，ABF材料消耗量提升5至10倍。随着AI GPU、ASIC及高阶网通芯片需求持续攀升，高阶ABF基板的供需结构恐将长期维持偏紧态势。媒体分析认为，英伟达不排除通过长约、预付款甚至战略合作等方式提前锁定高阶基板产能，以规避供应链风险。这一预期与英伟达此前在CoWoS封装及HBM内存领域的产能锁定策略一脉相承。景硕、欣兴、南电等高阶ABF基板厂均有望受益于上述需求趋势。其中，已切入英伟达Vera Rubin平台供应链的景硕，受益程度相对突出。业界预期，在CPO逐步成为未来AI服务器主流架构的背景下，高阶ABF基板的战略地位将持续提升，相关厂商的产能与技术布局或将成为供应链谈判的重要筹码。","news_type":1,"symbols_score_info":{"TSMY":0.6,"TSMX":0.6,"TSMU":0.6,"TSM":1.96,"TSMG":0.6,"STSM":0.6,"03145":0.6,"TSMZ":0.6}},"isVote":1,"tweetType":1,"viewCount":126,"authorTweetTopStatus":1,"verified":2,"comments":[],"imageCount":0,"langContent":"CN","totalScore":0}],"allBottom":false,"essenBottom":false,"topicSource":"Post"}