晶方科技(603005)

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公司概况
公司名称
苏州晶方半导体科技股份有限公司
所属行业
计算机、通信和其他电子设备制造业
上市日期
2014-02-10
注册资本
65217万元
公司概况
苏州晶方半导体科技股份有限公司的主营业务是传感器领域的封装测试业务。公司的主要产品是影像传感器芯片、生物身份识别芯片、MEMS芯片、射频芯片。截至2025年12月31日，公司及子公司形成了国际化的专利体系布局，已成功申请并获得授权的专利共486项，其中中国大陆授权273项，包括发明专利157项，实用新型专利116项。美国授权发明专利87项，欧洲授权发明专利13项，韩国授权发明专利35项，日本授权发明专利20项，中国香港授权发明专利18项和中国台湾授权发明专利40项。

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