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黑芝麻智能(02533)
21.040
+1.510
+7.73%
行情数据延迟15分钟
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公司名称
黑芝麻智能
所属市场
SEHK
成立日期
- -
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- -
办公地址
- -
公司网址
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公司概况
黑芝麻智能国际控股有限公司是一家主要从事提供车规级计算系统级芯片（SoC）及基于SoC的智能汽车解决方案的公司。该公司的主要产品包括车规级SoC，例如华山系列和武当系列。该公司还提供软件，例如操作系统支持、瀚海自动驾驶解决方案平台（ADSP）中间件和感知算法。该公司主要在国内市场开展业务。
2025-09-30
年度报告
补充公告有关截至2024年12月31日止年度之年度报告
补充公告有关截至2024年12月31日止年度之年度报告
2025-09-11
半年度报告
2025 中期报告
2025 中期报告
2025-08-29
半年度报告
截至2025年6月30日止六个月中期业绩公告
截至2025年6月30日止六个月中期业绩公告
2025-08-22
业绩预告
盈利警告
盈利警告
2025-05-08
股份购回
(1) 建议重选退任董事(2) 建议授出购回股份及发行股份之一般授权(3) 建议续聘核数师及(4) 股东周年大会通告
(1) 建议重选退任董事(2) 建议授出购回股份及发行股份之一般授权(3) 建议续聘核数师及(4) 股东周年大会通告
2025-04-25
年度报告
2024年报
2024年报
2025-03-31
年度报告
截至2024年12月31日止年度年度业绩公告
截至2024年12月31日止年度年度业绩公告
2025-02-26
股份发行
完成根据一般授权配售新股份
完成根据一般授权配售新股份
2025-02-19
股份发行
根据一般授权配售新股份
根据一般授权配售新股份
2025-02-17
业绩预告
正面盈利预告
正面盈利预告
2024-09-27
半年度报告
2024 中期报告
2024 中期报告
2024-08-28
半年度报告
截至2024年6月30日止六个月中期业绩公告
截至2024年6月30日止六个月中期业绩公告
2024-07-31
股份发售
全球发售
全球发售
分时
5日
日
周
月
数据加载中...
最高
21.240
今开
20.620
量比
5.46
最低
20.300
昨收
19.530
换手率
1.55%
热议股票
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