这个王八蛋诈骗犯有出_老虎社区_美港股上老虎 - 老虎社区

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飞翔678
07-04

这个王八蛋诈骗犯有出来招摇撞骗了

SemiAnalysis：谷歌下一代TPU将采用英特尔EMIB-T封装

SemiAnalysis透露，谷歌下一代TPU（Humufish）将弃用台积电CoWoS，改用英特尔EMIB-T封装。EMIB-T通过硅通孔实现垂直供电，不仅去除了昂贵的中介层、大幅降低成本并提高硅片利用率，还能更好地支持下一代HBM。然而，EMIB-T作为新技术，其大规模量产的良率仍是英特尔面临的最大考验。

SemiAnalysis：谷歌下一代TPU将采用英特尔EMIB-T封装

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src=\"https://wpimg-wscn.awtmt.com/7be113d1-7bd9-41b5-9b53-10ee1323b5dd.png\"/></p>\n<h2>架构适配性与量产大考</h2>\n<p>针对市场关于台积电CoWoS-L同样使用局部硅桥的讨论，业内独立分析人士Nutty指出，CoWoS-L在基于硅桥的结构之上增加了一个全局RDL层，这虽然提高了布线的灵活性，但也增加了面积和工艺复杂性。</p>\n<p>“对于像Humufish这样似乎针对推理和代理工作负载进行优化的芯片来说，数据流可能更加结构化。”Nutty分析称，“在这种情况下，EMIB仅在需要的地方放置高密度链接的方法，比为全封装布线灵活性买单更加合理。”</p>\n<p>Nutty认为，这正是EMIB-T的重要意义所在。它不仅能减少硅片使用量和封装成本，还能作为受限的CoWoS生态系统之外的第二供应商。</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/acc53030-1114-4425-ad5d-a26d3397f5dc.png\"/></p>\n<h2><strong>量产良率成关键，英特尔面临执行力大考</strong></h2>\n<p>尽管架构极具吸引力，但执行力仍是最大的未知数。网友Axi直言：“在吹嘘节省成本之前，先给我们看看良率。”</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/668a8cd3-cdbf-44aa-b24a-011baa6db190.png\"/></p>\n<p>SemiAnalysis警告称：“普通的EMIB已经大规模出货多年，但EMIB-T是新技术，提供供电的硅桥在扩大制造规模时难度更大。”</p>\n<p>只有当英特尔能够按计划提升良率和产量时，这些优势才能落地。如果英特尔的进度出现延误，谷歌的后备方案依然是产能受限的CoWoS。这场技术迁移的成败，将直接检验英特尔先进封装的真实交付能力。</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>SemiAnalysis：谷歌下一代TPU将采用英特尔EMIB-T封装</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; 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overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nSemiAnalysis：谷歌下一代TPU将采用英特尔EMIB-T封装\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1084101182\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/66809d1f5c2e43e2bdf15820c6d6897e);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">华尔街见闻 </p>\n<p class=\"h-time\">2026-07-02 08:41</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><body><p>7月1日，据知名半导体分析机构SemiAnalysis透露，<a href=\"https://laohu8.com/S/GOOG\">谷歌</a>下一代代号为Humufish的TPU将放弃<a href=\"https://laohu8.com/S/TSM\">台积电</a>的CoWoS封装，转而采用<a href=\"https://laohu8.com/S/INTC\">英特尔</a>的EMIB-T技术。</p>\n<p>目前，台积电的CoWoS是AI芯片封装的行业默认标准。<a href=\"https://laohu8.com/S/GOOGL\">谷歌</a>作为头部科技巨头，其旗舰产品若成功迁移至英特尔的封装体系，将对台积电造成冲击。SemiAnalysis在X平台称，</p>\n<blockquote>\n<p>“谷歌下一代TPU，代号Humufish，将采用英特尔EMIB-T，而不是台积电CoWoS。CoWoS是行业默认选择，这正是一个旗舰部件转向其他方案值得关注的原因。”</p>\n</blockquote>\n<p>两者的核心区别在于封装的物理路径。CoWoS将所有的裸片（dies）放置在一个大型的硅或RDL中介层上。而英特尔的EMIB技术，则是将小型硅桥直接嵌入有机基板中，仅仅在需要芯片间连接的地方才进行桥接。</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/dc414855-7c00-49df-9436-064e5440c8d2.png\"/></p>\n<h2>摆脱光罩限制与降低成本</h2>\n<p>台积电CoWoS的硅中介层是通过光刻技术打印的，因此其物理尺寸受到光罩极限的严格限制。</p>\n<p>SemiAnalysis解释称：“单片版本（CoWoS-S）的极限大约是光罩尺寸的3.3倍，这也是台积电转向CoWoS-L的原因。EMIB不受光罩极限的束缚，因此它是一项扩展性强得多的技术。”</p>\n<p>除了尺寸突破，成本和效率是另一个核心驱动力。EMIB完全去除了昂贵的中介层，使得封装成本显著降低。</p>\n<p>更直观的差异体现在硅片利用率上。晶圆是圆形的，如果要从中切割出大型中介层，边缘区域会产生大量浪费，且尺寸越大良率越低。这就好比用圆面团切大块的方饼，边角料注定很多。</p>\n<p>相比之下，SemiAnalysis表示：“微小的硅桥可以密集排列，几乎没有浪费。”此外，这一选择也让买家在台积电之外，获得了第二家供应商。</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/66d96e90-cc5f-47da-98b9-64ddff22df65.png\"/></p>\n<div> </div>\n<div> </div>\n<h2><strong>垂直供电加持，EMIB-T适配下一代HBM</strong></h2>\n<p>Humufish具体采用的是EMIB-T技术，其中的“T”代表硅通孔（TSV）。这一设计解决了传统封装中的供电痛点。</p>\n<p>SemiAnalysis解释称，普通的EMIB在硅桥中没有过孔，电力必须绕过它通过基板传输，这给供电带来了压力。“EMIB-T将电力垂直直接穿过硅桥，并增加了电容器和接地层以提供更纯净的电力。”</p>\n<p>这种架构上的升级，正是为了让芯片能够适配下一代HBM（高带宽内存）和更高带宽的互连需求。</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/7be113d1-7bd9-41b5-9b53-10ee1323b5dd.png\"/></p>\n<h2>架构适配性与量产大考</h2>\n<p>针对市场关于台积电CoWoS-L同样使用局部硅桥的讨论，业内独立分析人士Nutty指出，CoWoS-L在基于硅桥的结构之上增加了一个全局RDL层，这虽然提高了布线的灵活性，但也增加了面积和工艺复杂性。</p>\n<p>“对于像Humufish这样似乎针对推理和代理工作负载进行优化的芯片来说，数据流可能更加结构化。”Nutty分析称，“在这种情况下，EMIB仅在需要的地方放置高密度链接的方法，比为全封装布线灵活性买单更加合理。”</p>\n<p>Nutty认为，这正是EMIB-T的重要意义所在。它不仅能减少硅片使用量和封装成本，还能作为受限的CoWoS生态系统之外的第二供应商。</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/acc53030-1114-4425-ad5d-a26d3397f5dc.png\"/></p>\n<h2><strong>量产良率成关键，英特尔面临执行力大考</strong></h2>\n<p>尽管架构极具吸引力，但执行力仍是最大的未知数。网友Axi直言：“在吹嘘节省成本之前，先给我们看看良率。”</p>\n<p><img src=\"https://wpimg-wscn.awtmt.com/668a8cd3-cdbf-44aa-b24a-011baa6db190.png\"/></p>\n<p>SemiAnalysis警告称：“普通的EMIB已经大规模出货多年，但EMIB-T是新技术，提供供电的硅桥在扩大制造规模时难度更大。”</p>\n<p>只有当英特尔能够按计划提升良率和产量时，这些优势才能落地。如果英特尔的进度出现延误，谷歌的后备方案依然是产能受限的CoWoS。这场技术迁移的成败，将直接检验英特尔先进封装的真实交付能力。</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"BK4543":"AI","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","LU0528227936.USD":"富达环球人口趋势基金A-ACC","LU1059921491.USD":"NORDEA 1 GLOBAL STABLE EQUITY \"HB\" (USDHDG) ACC","LU0289961442.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (SGD) ACC","LU0985320562.USD":"NORDEA 1 GLOBAL STARS EQUITY \"BP\" (USD) ACC","LU2357305700.SGD":"Allianz Global Artificial Intelligence ET H2-SGD","LU0310799852.SGD":"FTIF - Templeton Global Equity Income A MDIS SGD","LU0238689110.USD":"贝莱德环球动力股票基金","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" 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