芯片都开始造了，承认_老虎社区_美港股上老虎 - 老虎社区

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DeW
01-16

芯片都开始造了，承认别人靠跳级险胜一招，自己在最先进落后了都不会。台积电早晚给这几个老登害死。

Intel首发量产2nm级工艺台积电称不怕竞争：不是砸钱就行的

快科技1月15日消息，虽然台积电在去年12月底宣布2nm工艺已经量产，但Intel在去年10月份就宣布量产18A工艺，这也是2nm级别的工艺，量产时间上算是领先了台积电一次。Intel接下来靠着18A工艺确实有机会抢占先进工艺市场，甚至有可能获得苹果等大厂的订单，分走台积电的代工份额。对于这个问题，台积电CEO魏哲家也在今天的说法会上回应了与Intel的竞争，他的态度是台积电不担心Intel会在晶圆代工市场上影响台积电的占有率，无惧Intel的竞争。

Intel首发量产2nm级工艺台积电称不怕竞争：不是砸钱就行的

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href=\"https://laohu8.com/S/AAPL\">苹果</a>等大厂的订单，分走台积电的代工份额。</p><p>对于这个问题，台积电CEO魏哲家也在今天的说法会上回应了与Intel的竞争，<strong>他的态度是台积电不担心Intel会在晶圆代工市场上影响台积电的占有率</strong>，无惧Intel的竞争。</p><p>他表示，先进工艺与系统整合越来越难，竞争不是靠砸钱就能追上的，一项先进技术通常要2-3年的准备期，完成后才能把设计落实到产品上，而产品通过认证或者核准之后，<strong>还要进入量产、良率<span>拉升</span>及产能爬坡等阶段，还要1-2年时间才行。</strong></p><p>魏哲家表示，台积电一直不缺对手，而且还都是强劲的对手，公司正视对方投入与进展，但不会因此动摇，台积电将持续以技术领先、制造能力与客户信任为核心，推动业务往既定方向发展，并在竞争环境中延续长期优势。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20260115211144966d201c72tx2xgy1t\"/></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel首发量产2nm级工艺 台积电称不怕竞争：不是砸钱就行的</title>\n<style 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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260115211147a4c7d469&s=b><strong>快科技</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>快科技1月15日消息，虽然台积电在去年12月底宣布2nm工艺已经量产，但Intel在去年10月份就宣布量产18A工艺，这也是2nm级别的工艺，量产时间上算是领先了台积电一次。Intel接下来靠着18A工艺确实有机会抢占先进工艺市场，甚至有可能获得苹果等大厂的订单，分走台积电的代工份额。对于这个问题，台积电CEO魏哲家也在今天的说法会上回应了与Intel的竞争，他的态度是台积电不担心Intel会在...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260115211147a4c7d469&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","BK4585":"ETF&股票定投概念","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2063271972.USD":"富兰克林创新领域基金","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" 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ACC"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260115211147a4c7d469&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2603600002","content_text":"快科技1月15日消息，虽然台积电在去年12月底宣布2nm工艺已经量产，但Intel在去年10月份就宣布量产18A工艺，这也是2nm级别的工艺，量产时间上算是领先了台积电一次。Intel接下来靠着18A工艺确实有机会抢占先进工艺市场，甚至有可能获得苹果等大厂的订单，分走台积电的代工份额。对于这个问题，台积电CEO魏哲家也在今天的说法会上回应了与Intel的竞争，他的态度是台积电不担心Intel会在晶圆代工市场上影响台积电的占有率，无惧Intel的竞争。他表示，先进工艺与系统整合越来越难，竞争不是靠砸钱就能追上的，一项先进技术通常要2-3年的准备期，完成后才能把设计落实到产品上，而产品通过认证或者核准之后，还要进入量产、良率拉升及产能爬坡等阶段，还要1-2年时间才行。魏哲家表示，台积电一直不缺对手，而且还都是强劲的对手，公司正视对方投入与进展，但不会因此动摇，台积电将持续以技术领先、制造能力与客户信任为核心，推动业务往既定方向发展，并在竞争环境中延续长期优势。","news_type":1,"symbols_score_info":{"03145":0.6,"04335":1.93,"TSM":1.96,"INTC":1.93}},"isVote":1,"tweetType":1,"viewCount":52,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":90,"optionInvolvedFlag":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"hasMoreComment":false,"orderType":2}