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约翰算法
03-18 00:35

这篇文章不错，转发给大家看看

华尔街点评GTC：在英伟达的定义里，算力即收入，Token是新的大宗商品

英伟达管理层称，“Token是新的大宗商品，算力等于收入”。美银认为，Blackwell系统的每Token成本降低35倍，驱动需求规模化。摩根大通预测，英伟达数据中心收入可能超出当前市场预期，至少有500至700亿美元上行空间。两家机构均看好英伟达的AI资本开支周期持续性。

华尔街点评GTC：在英伟达的定义里，算力即收入，Token是新的大宗商品

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href=\"https://laohu8.com/S/JPM\">摩根大通</a>最新报告指出，这一数字意味着相对于华尔街当前对2026至2027年数据中心收入的一致预期，<strong>存在至少500至700亿美元的上行空间。</strong></p>\n<p>美银证券报告直接援引英伟达管理层表述——<strong>\"Token是新的大宗商品，算力等于收入\"</strong>——并指出，<strong>Blackwell系统相较上一代Hopper已实现每Token成本降低高达35倍，即将推出的Rubin系列有望在此基础上再降低2至35倍</strong>，具体幅度取决于工作负载类型与架构配置。</p>\n<p>在英伟达的叙事框架下，这种持续压缩的Token成本曲线，是驱动需求规模化扩张的根本动力。</p>\n<h2>需求能见度翻倍，超大规模客户与企业市场双轮驱动</h2>\n<p>英伟达管理层披露，Blackwell及Vera Rubin系统的高置信度采购订单已超过1万亿美元，较2025年10月GTC DC大会上公布的5000亿美元翻倍。管理层同时表示，2027年的额外订单和积压订单有望在未来6至9个月内持续累积。</p>\n<p>需求结构呈现多元化：约60%来自超大规模云厂商（内部AI消费正从推荐/搜索工作负载向大语言模型迁移），其余约40%分布于CUDA云原生AI企业、英伟达云合作伙伴、主权AI及工业/企业客户。</p>\n<p>美银指出，这一新的1万亿美元展望与此前华尔街对该三年期数据中心收入约9700亿美元的预期基本吻合，验证逻辑与2025年10月旧版5000亿美元展望验证约4500亿美元预期的方式如出一辙。</p>\n<p>值得关注的是，英伟达管理层在本次大会上用相当篇幅阐述了传统企业工作负载加速这一需求向量。</p>\n<p>英伟达宣布与<a href=\"https://laohu8.com/S/IBM\">IBM</a>（加速WatsonX）、<a href=\"https://laohu8.com/S/GOOG\">谷歌</a>云（BigQuery加速，Snap实现约76%成本节省）、<a href=\"https://laohu8.com/S/DELL\">戴尔</a>（AI数据平台）等合作，并推出cuDF及cuVS两大CUDA-X基础库。</p>\n<p>摩根大通认为，这一方向\"被市场严重低估\"——其逻辑在于，摩尔定律已趋于失效，领域专用加速是唯一可行的替代路径，这将把英伟达的可寻址市场扩展至AI训练/推理周期之外。</p>\n<h2>Groq LPU整合：架构层面最重要的新品发布</h2>\n<p>摩根大通将Groq 3 LPU与Vera Rubin的整合评定为本届GTC\"架构层面最重要的新品发布\"。</p>\n<p>这一解耦推理架构将Rubin GPU（高吞吐量，288GB HBM4，22TB/s带宽，50 PFLOPS NVFP4）与Groq LPU（低延迟解码，500MB片上SRAM，150TB/s SRAM带宽，1.2 PFLOPS FP8）配对使用：预填充在Vera Rubin上完成，注意力解码部分同样在Rubin上运行，而前馈网络/Token生成则卸载至Groq LPU。</p>\n<p>LPX机架集成256颗LPU，提供128GB聚合SRAM、40PB/s内存带宽及315 PFLOPS推理算力，预计于2026年第三季度上市。</p>\n<p>英伟达管理层表示，对于需要超高Token速度的工作负载（代码生成、工程计算、长上下文推理），约25%的数据中心功耗将分配给LPX，其余75%为纯Vera Rubin NVL72配置。</p>\n<p>美银数据显示，<strong>Rubin系统搭配SRAM LPX机架后，高端低延迟工作负载的效率可较上一代提升35倍。</strong>摩根大通则指出，这一架构直接回应了单一处理器无法同时优化吞吐量（受FLOPS限制）与延迟（受带宽限制）的根本矛盾，使英伟达得以在此前ASIC厂商具有传统优势的高端推理市场有效竞争。</p>\n<h2>铜缆与CPO并行推进，互联路线不设单一赌注</h2>\n<p>英伟达管理层在大会上正面回应了铜缆与共封装光学（CPO）之争，确认将同时推进两条路线。</p>\n<p>当前Vera Rubin世代，Oberon机架采用铜缆扩展至NVL72，光学扩展至NVL576；Spectrum-6 SPX共封装光学以太网交换机已量产，由英伟达与<a href=\"https://laohu8.com/S/TSM\">台积电</a>联合开发，管理层称其光学功耗效率较传统可插拔收发器提升5倍，韧性提升10倍。</p>\n<p>对于Rubin Ultra（2027年下半年），Kyber机架采用铜缆NVLink扩展（最多144颗GPU），同时提供基于CPO的NVLink交换方案作为备选。Feynman（2028年）将明确同时支持铜缆与CPO扩展，并配备Spectrum-7（204T，CPO）用于横向扩展。</p>\n<p>美银证券强调，CPO扩展/横向扩展交换机的采用对客户而言完全可选，客户可继续使用铜缆直至其认为合适的时间节点。摩根大通则认为，这一双路径确认与其此前预判一致，预计铜缆扩展将在至少2027年前继续主导NVL72/NVL144配置，CPO则将在横向扩展及NVL576+配置中逐步扩大份额。</p>\n<h2>Vera CPU：面向智能体AI的独立数十亿美元新收入来源</h2>\n<p>英伟达管理层在大会上明确表示，Vera CPU独立业务\"已经确定将成为一个数十亿美元量级的业务\"，美银证券指出这一收入流尚未被当前市场一致预期所涵盖，属于增量贡献。</p>\n<p>Vera CPU搭载88颗自研Olympus ARM核心，LPDDR5X内存子系统提供1.2TB/s带宽（功耗仅为传统服务器CPU的一半），并通过NVLink-C2C以1.8TB/s速率与GPU互联（相当于PCIe Gen 6的7倍）。Vera CPU机架集成256颗液冷CPU，支持超过22500个并发CPU环境。</p>\n<p>管理层强调，CPU正在成为智能体AI扩展的瓶颈——强化学习与智能体工作流需要大量CPU环境来测试和验证GPU模型的输出结果。<a href=\"https://laohu8.com/S/META\">Meta</a>已在规模化部署上一代Grace CPU，Vera将于2027年接替。</p>\n<p>摩根大通将这一CPU收入流定性为高毛利、可重复（随GPU机架一同部署于AI工厂），并与英伟达正在主动催化的智能体AI采用曲线形成结构性绑定。</p>\n<h2>产品路线图延伸至2028年，年度架构节奏持续强化</h2>\n<p>英伟达重申了年度平台发布节奏：Blackwell（2024年）→ Blackwell Ultra（2025年）→ Rubin（2026年）→ Rubin Ultra（2027年）→ Feynman（2028年）。</p>\n<p>Rubin Ultra将采用4芯片GPU配置，搭载1TB HBM4e，新增LP35 LPU芯片（首次引入NVFP4算力），Kyber机架支持每NVLink域144颗GPU（第七代NVLink，3.6Tb/s每GPU，NVL576聚合带宽1.5Pb/s）。</p>\n<p>Feynman的细节披露超出市场预期：</p>\n<p>新GPU采用台积电A16（1.6nm）工艺，引入芯片堆叠与定制HBM；新CPU命名为Rosa（以Rosalind Franklin命名），专为跨GPU、LPU、存储及网络的智能体工作负载编排而设计；新LPU命名为LP40，由英伟达内部Groq团队联合开发；此外还包括BlueField-5 DPU、ConnectX-10超级网卡、NVLink 8及Spectrum-7（204T，CPO）。</p>\n<p>摩根大通认为，英伟达纵向整合平台（现已横跨七颗芯片、五种机架系统及配套软件栈）难以被复制，推理需求加速、传统工作负载加速带来的可寻址市场结构性扩张，以及客户基础的持续拓宽，共同支撑着一个比市场当前所预期更具持续性的AI资本开支周期。</p>\n</body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>华尔街点评GTC：在英伟达的定义里，算力即收入，Token是新的大宗商品</title>\n<style 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href=\"https://wallstreetcn.com/articles/3767740\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU1983260115.SGD":"Janus Henderson Horizon Global Sustainable Equity A2 SGD-H","LU1551013425.SGD":"Allianz Income and Growth Cl AMg2 DIS H2-SGD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU2430703251.USD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (USD) INC","LU2756315318.SGD":"ALLIANZ INCOME AND GROWTH \"AMG\" (SGDHDG) INC A","SG9999002232.USD":"Allianz Global High Payout USD","LU2083900584.USD":"HSBC GIF US INCOME FOCUSED \"AM2\" (USD) INC","LU0417517546.SGD":"Allianz US Equity Cl AT Acc SGD","LU1645745479.HKD":"ALLIANZ EUROPE INCOME AND GROWTH \"AM\" (HKDHDG) INC","SG9999002224.SGD":"Allianz Global High Payout SGD","LU0265550946.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A5\" (USD) INC","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","IE00BJJMRX11.SGD":"Janus Henderson Balanced A 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FOCUS \"AUP\" (USD) INC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU2430703095.HKD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (HKD) INC","HK0000320264.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) ACC","LU2746668461.USD":"MANULIFE DYNAMIC LEADERS \"AA\" (USD) ACC","LU2430703178.SGD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4H\" (SGDHDG) INC","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H"},"source_url":"https://wallstreetcn.com/articles/3767740","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2620042457","content_text":"英伟达年度GTC大会释放出一个核心信号：AI算力的商业逻辑正在发生根本性重构——Token已成为新的大宗商品，而算力即收入。\n英伟达管理层在本届GTC上将数据中心销售可见度从此前的5000亿美元（覆盖至2026年）大幅上调至逾1万亿美元（覆盖2025至2027年累计），并明确表示独立Vera CPU及LPX机架方案的销售额将在此之外额外计入。华尔街将这场大会视为英伟达AI周期持续性的有力背书。\n据追风交易台，摩根大通最新报告指出，这一数字意味着相对于华尔街当前对2026至2027年数据中心收入的一致预期，存在至少500至700亿美元的上行空间。\n美银证券报告直接援引英伟达管理层表述——\"Token是新的大宗商品，算力等于收入\"——并指出，Blackwell系统相较上一代Hopper已实现每Token成本降低高达35倍，即将推出的Rubin系列有望在此基础上再降低2至35倍，具体幅度取决于工作负载类型与架构配置。\n在英伟达的叙事框架下，这种持续压缩的Token成本曲线，是驱动需求规模化扩张的根本动力。\n需求能见度翻倍，超大规模客户与企业市场双轮驱动\n英伟达管理层披露，Blackwell及Vera Rubin系统的高置信度采购订单已超过1万亿美元，较2025年10月GTC DC大会上公布的5000亿美元翻倍。管理层同时表示，2027年的额外订单和积压订单有望在未来6至9个月内持续累积。\n需求结构呈现多元化：约60%来自超大规模云厂商（内部AI消费正从推荐/搜索工作负载向大语言模型迁移），其余约40%分布于CUDA云原生AI企业、英伟达云合作伙伴、主权AI及工业/企业客户。\n美银指出，这一新的1万亿美元展望与此前华尔街对该三年期数据中心收入约9700亿美元的预期基本吻合，验证逻辑与2025年10月旧版5000亿美元展望验证约4500亿美元预期的方式如出一辙。\n值得关注的是，英伟达管理层在本次大会上用相当篇幅阐述了传统企业工作负载加速这一需求向量。\n英伟达宣布与IBM（加速WatsonX）、谷歌云（BigQuery加速，Snap实现约76%成本节省）、戴尔（AI数据平台）等合作，并推出cuDF及cuVS两大CUDA-X基础库。\n摩根大通认为，这一方向\"被市场严重低估\"——其逻辑在于，摩尔定律已趋于失效，领域专用加速是唯一可行的替代路径，这将把英伟达的可寻址市场扩展至AI训练/推理周期之外。\nGroq LPU整合：架构层面最重要的新品发布\n摩根大通将Groq 3 LPU与Vera Rubin的整合评定为本届GTC\"架构层面最重要的新品发布\"。\n这一解耦推理架构将Rubin GPU（高吞吐量，288GB HBM4，22TB/s带宽，50 PFLOPS NVFP4）与Groq LPU（低延迟解码，500MB片上SRAM，150TB/s SRAM带宽，1.2 PFLOPS FP8）配对使用：预填充在Vera Rubin上完成，注意力解码部分同样在Rubin上运行，而前馈网络/Token生成则卸载至Groq LPU。\nLPX机架集成256颗LPU，提供128GB聚合SRAM、40PB/s内存带宽及315 PFLOPS推理算力，预计于2026年第三季度上市。\n英伟达管理层表示，对于需要超高Token速度的工作负载（代码生成、工程计算、长上下文推理），约25%的数据中心功耗将分配给LPX，其余75%为纯Vera Rubin NVL72配置。\n美银数据显示，Rubin系统搭配SRAM LPX机架后，高端低延迟工作负载的效率可较上一代提升35倍。摩根大通则指出，这一架构直接回应了单一处理器无法同时优化吞吐量（受FLOPS限制）与延迟（受带宽限制）的根本矛盾，使英伟达得以在此前ASIC厂商具有传统优势的高端推理市场有效竞争。\n铜缆与CPO并行推进，互联路线不设单一赌注\n英伟达管理层在大会上正面回应了铜缆与共封装光学（CPO）之争，确认将同时推进两条路线。\n当前Vera Rubin世代，Oberon机架采用铜缆扩展至NVL72，光学扩展至NVL576；Spectrum-6 SPX共封装光学以太网交换机已量产，由英伟达与台积电联合开发，管理层称其光学功耗效率较传统可插拔收发器提升5倍，韧性提升10倍。\n对于Rubin Ultra（2027年下半年），Kyber机架采用铜缆NVLink扩展（最多144颗GPU），同时提供基于CPO的NVLink交换方案作为备选。Feynman（2028年）将明确同时支持铜缆与CPO扩展，并配备Spectrum-7（204T，CPO）用于横向扩展。\n美银证券强调，CPO扩展/横向扩展交换机的采用对客户而言完全可选，客户可继续使用铜缆直至其认为合适的时间节点。摩根大通则认为，这一双路径确认与其此前预判一致，预计铜缆扩展将在至少2027年前继续主导NVL72/NVL144配置，CPO则将在横向扩展及NVL576+配置中逐步扩大份额。\nVera CPU：面向智能体AI的独立数十亿美元新收入来源\n英伟达管理层在大会上明确表示，Vera CPU独立业务\"已经确定将成为一个数十亿美元量级的业务\"，美银证券指出这一收入流尚未被当前市场一致预期所涵盖，属于增量贡献。\nVera CPU搭载88颗自研Olympus ARM核心，LPDDR5X内存子系统提供1.2TB/s带宽（功耗仅为传统服务器CPU的一半），并通过NVLink-C2C以1.8TB/s速率与GPU互联（相当于PCIe Gen 6的7倍）。Vera CPU机架集成256颗液冷CPU，支持超过22500个并发CPU环境。\n管理层强调，CPU正在成为智能体AI扩展的瓶颈——强化学习与智能体工作流需要大量CPU环境来测试和验证GPU模型的输出结果。Meta已在规模化部署上一代Grace CPU，Vera将于2027年接替。\n摩根大通将这一CPU收入流定性为高毛利、可重复（随GPU机架一同部署于AI工厂），并与英伟达正在主动催化的智能体AI采用曲线形成结构性绑定。\n产品路线图延伸至2028年，年度架构节奏持续强化\n英伟达重申了年度平台发布节奏：Blackwell（2024年）→ Blackwell Ultra（2025年）→ Rubin（2026年）→ Rubin Ultra（2027年）→ Feynman（2028年）。\nRubin Ultra将采用4芯片GPU配置，搭载1TB HBM4e，新增LP35 LPU芯片（首次引入NVFP4算力），Kyber机架支持每NVLink域144颗GPU（第七代NVLink，3.6Tb/s每GPU，NVL576聚合带宽1.5Pb/s）。\nFeynman的细节披露超出市场预期：\n新GPU采用台积电A16（1.6nm）工艺，引入芯片堆叠与定制HBM；新CPU命名为Rosa（以Rosalind Franklin命名），专为跨GPU、LPU、存储及网络的智能体工作负载编排而设计；新LPU命名为LP40，由英伟达内部Groq团队联合开发；此外还包括BlueField-5 DPU、ConnectX-10超级网卡、NVLink 8及Spectrum-7（204T，CPO）。\n摩根大通认为，英伟达纵向整合平台（现已横跨七颗芯片、五种机架系统及配套软件栈）难以被复制，推理需求加速、传统工作负载加速带来的可寻址市场结构性扩张，以及客户基础的持续拓宽，共同支撑着一个比市场当前所预期更具持续性的AI资本开支周期。","news_type":1,"symbols_score_info":{"NVII":0.6,"NVDD":0.6,"ANV":0.6,"NVDU":0.6,"NVD3.UK":0.6,"NVDS":0.6,"DIPS":0.6,"NVD2.UK":0.6,"NVDS.UK":0.6,"NVD":0.6,"NVDY":0.6,"2NVD.UK":0.6,"NVDX":0.6,"3NVD.UK":0.6,"SNVD.UK":0.6,"NVDA":1.98,"NVIW.SI":0.6,"NVDW":0.6,"NVDB":0.6,"NVDQ":0.6,"NVDG":0.6}},"isVote":1,"tweetType":1,"viewCount":13,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":27,"optionInvolvedFlag":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"hasMoreComment":false,"orderType":2}