晶盛机电最新公告：改变部分募集资金用途投资半导体装备精密零部件智能化生产项目等新项目_老虎社区_美港股上老虎

晶盛机电最新公告：改变部分募集资金用途投资半导体装备精密零部件智能化生产项目等新项目

证券之星06-03 18:51

晶盛机电(300316.SZ)公告称，公司董事会同意将“12英寸集成电路大硅片设备测试实验线项目”募集资金投资总额调整为1.78亿元，并将剩余募集资金及已终止项目剩余募集资金合计8.61亿元(含利息及理财收益)投资于新项目“半导体装备精密零部件智能化生产项目”和“高端半导体设备碳化硅零部件产业化项目”。该事项尚需提交股东会审议。

以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

暂无评论

热议股票

7x24

全部

{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2640063319?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-06-03 18:51","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2640063319","market":"sh","top_or_hot":-1,"title":"晶盛机电最新公告：改变部分募集资金用途投资半导体装备精密零部件智能化生产项目等新项目","media":"证券之星","content":"<html><body><p><a href=\"https://laohu8.com/S/300316\">晶盛机电</a>(300316.SZ)公告称，公司董事会同意将“12英寸集成电路大硅片设备测试实验线项目”募集资金投资总额调整为1.78亿元，并将剩余募集资金及已终止项目剩余募集资金合计8.61亿元(含利息及理财收益)投资于新项目“半导体装备精密零部件智能化生产项目”和“高端半导体设备碳化硅零部件产业化项目”。该事项尚需提交股东会审议。</p><p>以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。</p></body></html>","source":"stockstar","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>晶盛机电最新公告：改变部分募集资金用途投资半导体装备精密零部件智能化生产项目等新项目</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n晶盛机电最新公告：改变部分募集资金用途投资半导体装备精密零部件智能化生产项目等新项目\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-06-03 18:51 北京时间&nbsp;&nbsp;&nbsp;<a href=https://stock.stockstar.com/RB2026060300040258.shtml><strong>证券之星</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>晶盛机电(300316.SZ)公告称，公司董事会同意将“12英寸集成电路大硅片设备测试实验线项目”募集资金投资总额调整为1.78亿元，并将剩余募集资金及已终止项目剩余募集资金合计8.61亿元(含利息及理财收益)投资于新项目“半导体装备精密零部件智能化生产项目”和“高端半导体设备碳化硅零部件产业化项目”。该事项尚需提交股东会审议。以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。</p>\n\n<a href=\"https://stock.stockstar.com/RB2026060300040258.shtml\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK0125","symbol_name":"芯片国产化","start_time":0,"source_url":"https://stock.stockstar.com/RB2026060300040258.shtml","article_id":"2640063319","we_media_id":"1082532455","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2640063319","pubTimestamp":1780483880,"columns":[],"sourceInfo":{"source_id":"stockstar","name":"证券之星"},"weMediaInfo":{"media_name":"证券之星","introduction":"证券之星始创于1996年，是国内领先的金融信息及综合服务平台。关注证券之星，即时获取有价值的财经资讯。","home_visible":1,"id":"1082532455","head_image":"https://community-static.tradeup.com/news/2e305640fc27210243042d09d3a7fa3f"},"summary":"晶盛机电(300316.SZ)公告称，公司董事会同意将“12英寸集成电路大硅片设备测试实验线项目”募集资金投资总额调整为1.78亿元，并将剩余募集资金及已终止项目剩余募集资金合计8.61亿元(含利息及理财收益)投资于新项目“半导体装备精密零部件智能化生产项目”和“高端半导体设备碳化硅零部件产业化项目”。该事项尚需提交股东会审议。以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"zh","relate_stocks":{"159582":"半导体","300316":"晶盛机电","BK0125":"芯片国产化","LU1655091616.SGD":"JPMorgan Funds - China A-Share Opportunities A (acc) SGD","BK0054":"太阳能发电","BK0251":"专用设备","BK0064":"蓝宝石","IE0005HP3H50.USD":"GUINNESS CHINA \"C\" (USD) ACC"},"translate_title":"The latest announcement of Jingsheng Electromechanical: Change the use of some raised funds to invest in new projects such as intelligent production projects of precision parts of semiconductor equipment","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"159582":1.5,"300316":1.5},"content_text":"晶盛机电(300316.SZ)公告称，公司董事会同意将“12英寸集成电路大硅片设备测试实验线项目”募集资金投资总额调整为1.78亿元，并将剩余募集资金及已终止项目剩余募集资金合计8.61亿元(含利息及理财收益)投资于新项目“半导体装备精密零部件智能化生产项目”和“高端半导体设备碳化硅零部件产业化项目”。该事项尚需提交股东会审议。以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}