AGI焦点｜黄仁勋刚敬完酒，苏姿丰就飞韩国抢HBM4_老虎社区_美港股上老虎

AGI焦点｜黄仁勋刚敬完酒，苏姿丰就飞韩国抢HBM4

钛媒体AGI03-13

图片由AI生成▎AI芯片战火再次烧到存储供应链，中国厂商亦摩拳擦掌。文｜飞向TAI空作者｜胡珈萌编辑｜李程程本文首发于钛媒体APP苏姿丰终于决定开启首次访韩之旅。据韩媒《每日经济新闻》报道，美国超威半导体公司（AMD）董事长兼首席执行官苏姿丰将于3月18日访韩，并会见三星电子会长李在镕和韩国搜索引擎大厂Naver公司高层。这是苏姿丰2014年上任以来首次。有意思的是，苏姿丰访韩的时间点，选在了...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260313092826a4653427&s=b><strong>钛媒体AGI</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>图片由AI生成▎AI芯片战火再次烧到存储供应链，中国厂商亦摩拳擦掌。文｜飞向TAI空作者｜胡珈萌编辑｜李程程本文首发于钛媒体APP苏姿丰终于决定开启首次访韩之旅。据韩媒《每日经济新闻》报道，美国超威半导体公司（AMD）董事长兼首席执行官苏姿丰将于3月18日访韩，并会见三星电子会长李在镕和韩国搜索引擎大厂Naver公司高层。这是苏姿丰2014年上任以来首次。有意思的是，苏姿丰访韩的时间点，选在了英...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260313092826a4653427&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2089284900.SGD","symbol_name":"Allianz Global Sustainability Cl AM Dis 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ACC"},"translate_title":"AGI Focus | Just after Huang Renxun toasted, Su Zifeng flew to South Korea to grab HBM4","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDU":0.6,"AMDW":0.6,"NVDW":0.6,"NVDS":0.6,"NVDY":0.6,"2NVD.UK":0.6,"AMD":1.97,"AMDG":0.6,"NVDX":0.6,"NVDQ":0.6,"AMUU":0.6,"NVII":0.6,"NVD":0.6,"NVDA":0.9,"NVDS.UK":0.6,"AMDU":0.6,"NVD2.UK":0.6,"3NVD.UK":0.6,"NVDG":0.6,"AMYY":0.6,"DAMD":0.6,"AMDL":0.6,"NVDD":0.6,"DIPS":0.6,"ANV":0.6,"NVD3.UK":0.6,"NVDB":0.6,"NVIW.SI":0.6,"AMDD":0.6,"AMDY":0.6,"SNVD.UK":0.6,"MU":0.9},"content_text":"图片由AI生成▎AI芯片战火再次烧到存储供应链，中国厂商亦摩拳擦掌。文｜飞向TAI空作者｜胡珈萌编辑｜李程程本文首发于钛媒体APP苏姿丰终于决定开启首次访韩之旅。据韩媒《每日经济新闻》报道，美国超威半导体公司（AMD）董事长兼首席执行官苏姿丰将于3月18日访韩，并会见三星电子会长李在镕和韩国搜索引擎大厂Naver公司高层。这是苏姿丰2014年上任以来首次。有意思的是，苏姿丰访韩的时间点，选在了英伟达每年最重要的GTC大会期间，芯片巨头隔空对垒再次复现，双方恐怕又要在同一时段抢占媒体头条和热点话题了。当然，这背后更显现的是，存储芯片超级周期的又一信号。如今，AI芯片领域竞争愈发白热化，以韩国三星、SK海力士为代表的存储巨头愈发成为供应链上的关键节点。就连英伟达CEO黄仁勋，上个月都热情宴请SK海力士工程师，亲自敬酒以保供应，苏姿丰此次访韩就显得更加意味深长。AI来了，存储从“周期”走向“超级周期”苏姿丰内心想必很清楚，若AMD无法提前锁定最新一代HBM4的稳定供应，公司很可能将在与英伟达GPU，以及，强势崛起的ASIC芯片的竞争中持续处于下风。近年来，AI热潮持续冲击着半导体产业链，其中，存储是受影响最大的领域。尤其是DRAM（动态随机存取存储器）领域的高带宽内存（HBM），其通过与GPU紧密封装实现超高带宽，对于大模型训练至关重要。以往，存储行业的周期大致在3年左右，但AI对算力看起来近乎无限的需求，完全打破了这一节奏。2025年，以微软、谷歌、亚马逊、Meta等大型云厂商为代表的科技巨头，已经以超4000亿美元的大规模资本开支（Capex）极大拉动了算力硬件产业链需求，到了2026年，相关资本开支还会继续增长到6500亿美元的惊人水平。受此影响，产业链需求继续高增。数据来源：美国云巨头厂商财报及电话会议；作者制图高盛预计，2026年，全球HBM需求将同比增长76%。相关报告还指出，AI服务器对内存的消耗是传统服务器的8倍以上，这种结构性变化，使得存储需求完全脱离了传统的经济周期。而在供给侧，为了满足激增的HBM订单，三星、SK海力士和美光科技三大巨头，不得不将大量原本用于生产通用DRAM的晶圆产能转向HBM，其他存储技术如NAND等产能，也全线告急，这导致产业链价格狂飙。在“挤压效应”和“涨价潮”的双重影响下，使用通用存储芯片的手机、电脑等产品成本骤增，只能纷纷涨价。HBM却无法仅靠短期扩产满足需求。此前，美光科技移动与客户端业务部门营销副总裁克里斯托弗·摩尔（Christopher Moore）表示，该领域市场的供需结构已彻底被重构，尽管行业已启动巨额投资扩产，但新建晶圆厂本就需要数年周期，且AI对技术、良率要求极高，产品投产后，还需经历漫长的客户认证和设备调试，让产能释放的时间进一步拉长。摩尔还表示，目前存储产线因客户对8GB、12GB、16GB等多容量规格的并行需求而频繁切换，影响了提产效率，预计产能短缺问题至少将持续至2028年。去年以来，多家研究机构报告指出，存储带宽或将在一段时间内，成为制约GPU性能释放的最大瓶颈之一。激战HBM4，三星、SK海力士纷纷出手美国芯片巨头与韩国存储巨头间错综复杂的关系，对各自公司的发展前景和行业格局有至关重要的影响。曾经，三星在芯片领域的优势远超SK海力士，但正是在这轮AI浪潮中，随着英伟达的崛起，局面发生了变化。韩国记者李德周在《英伟达之道》一书中，曾介绍过SK海力士“逆袭”的历程。SK海力士与三星均在2013年左右开始开发HBM，2015年起向英伟达供货。然而，在2022年底，在ChatGPT引爆这波生成式AI浪潮之前，三星内部判断，AI市场有限，未像SK海力士那样积极投入HBM的研发与产能，也错过了与英伟达建立更紧密合作的机会。反观SK海力士，凭借更高的良率、更充足的产能和更快的迭代速度，持续为英伟达每一代新产品供应HBM，公司销售额和股价双双飙升，整个2025年营业利润已历史首次超越三星。在很长一段时间内，英伟达的HBM第二顺位供应商是美光科技，直到去年底，三星才有明显起色。但在目前HBM4的迭代中，局面又开始洗牌，各家公司开启了新一轮竞争。2月中旬，三星宣布率先向英伟达出货了首批HBM4产品，是行业首家，同时计划在5月实现大规模供货。另一边，SK海力士的进度也较为近似，而且在良率等指标上可能仍有优势。从目前披露的信息来看，英伟达新一代Rubin架构中，约60-70%的HBM4订单可能仍会花落SK海力士。也正因为英伟达和SK海力士愈发深厚绑定，三星和AMD等“追赶者”也加紧了互相合作，以求提升自身竞争力。与此同时，美光科技在HBM4上的性能和产能进度上并不理想，新技术迭代处于落后。多家分析机构认为，HBM4的竞争将主要集中在韩系两巨头之间。截图来自Bernstein今年1月发布的报告Asia Semiconductors and Global Memory： 2026 is still all about AI实际上，存储行业格局的巨变，正是AI的快速发展，促使很多格局固化已久产业重新洗牌的结果之一。以往，被视为“老成持重”的三星，目前在HMB4和新一代技术方面颇为激进，而后来者SK海力士，风格则趋向稳健，注重保持性能与可靠性的平衡。另外，值得注意的是，标准化HBM4的竞争尚未结束，下一代定制化产品HBM4E的战火已经燃起，推理需求、定制化芯片更加与这一趋势相关。为了争夺推理、定制化市场，芯片厂商希望，将特定逻辑功能集成到HBM的基础芯片中，以进一步优化性能、降低延迟和功耗，这对存储厂商逻辑设计与先进封装的能力提出了新要求。三星目前已组建专门团队，计划在今年中完成定制HBM4E设计，并考虑采用自研2nm工艺以求突破。SK海力士和美光，则继续深度绑定台积电的先进制程生态，逐步加码HBM4E产能。国产存储崛起，谁在抢跑HBM赛道？中国国产芯片自然不会错过这股热潮，已经有强势崛起之势。虽然国产存储在高精尖的HBM领域仍面临较多阻碍，难以短期内追赶国际领先，但在通用存储领域，不少厂商已取得可观进展。其中，当前最引人注目的当属长鑫存储。长鑫存储是国内市占第一的DRAM芯片设计制造商，主要为移动设备、服务器和消费电子等领域提供内存解决方案。近年来，长鑫存储发展速度逐步提升，全球产能占比已超过4%，是“芯片国产替代潮”中的重要力量之一。而且，长鑫存储与国际领先水平的技术差距正在缩小。长鑫存储近期已启动HBM3样品送测，并交付给国内头部客户进行验证，计划今年起全面量产。长鑫存储已经计划走向资本市场。去年末，该公司已正式向上交所递交招股书，拟在科创板挂牌上市，计划募资295亿元，主要用于存储器晶圆制造量产线技术升级改造项目、DRAM存储器技术升级项目、动态随机存取存储器前瞻技术研究与开发项目。长鑫存储募资额是科创板创立以来的历史第二高，仅次于另一大国产芯片巨头中芯国际的532.3亿元。市场对其上市估值的预测也高达1500亿元，可能又将引领一次IPO狂欢。大笔融资和资本市场的反馈，也有望继续推动该公司发展提速，紧追国际领先水平。此外，主攻3D NAND闪存的长江存储也已经崭露头角。长江存储主要业务集中在消费级SSD和嵌入式存储市场，在全球3D NAND闪存市场中已稳居第一梯队。目前也正处于产能快速扩张期。此外，佰维存储、宏芯宇电子、江波龙等国产存储厂商，都迎来了自身的业务高增长期。星辰天合、芯天下等初创公司，在存储超级周期中受到市场重视，开启了增产开拓市场和冲刺IPO融资之旅。不过，应该看到的是，在核心工艺、先进封装等尚存技术难关，且全球中、美芯片生态链出现隔离、分化趋势的背景下，国产HBM的突破很难一蹴而就。未来，除了单点的技术攻关、突破瓶颈外，产业链协同也显得尤其重要。尤其在国产芯片替代潮涌，AI算力整体需求爆发，政策和资本支持逐步加码，创新动能持续涌现的情况下，国产设备、材料、设计、制造、封测整个链条能实现协同攻关，将更有利于赶上先进技术的迭代步伐。（本文首发于钛媒体APP）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":1,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}