半导体设备生变在即! 应用材料与泛林围猎Besi 欲拿下卡着AI与存储脖子的“混合键合”_老虎社区_美港股上老虎

半导体设备生变在即! 应用材料与泛林围猎Besi 欲拿下卡着AI与存储脖子的“混合键合”

智通财经03-13

智通财经APP获悉，随着BE Semiconductor独家具备的先进芯片封装技术——即混合键合(Hybrid Bonding)先进封装技术，在全球AI超级大浪潮之下对于AI芯片以及HBM等数据中心高性能存储系统而言变得愈发关键，全球两大半导体设备制造超级巨头——即总部位于美国的应用材料(AMAT.US)以及泛林集团(LRCX.US)，纷纷强调有意收购这家欧洲半导体设备公司。有媒体援引知情人士透露...

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Applied materials and forest hunting Besi wants to win the \"hybrid bonding\" of stuck AI and storage neck","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"04336":1.96,"LRCX":1.91,"AMAT":1.96},"content_text":"智通财经APP获悉，随着BE Semiconductor独家具备的先进芯片封装技术——即混合键合(Hybrid Bonding)先进封装技术，在全球AI超级大浪潮之下对于AI芯片以及HBM等数据中心高性能存储系统而言变得愈发关键，全球两大半导体设备制造超级巨头——即总部位于美国的应用材料(AMAT.US)以及泛林集团(LRCX.US)，纷纷强调有意收购这家欧洲半导体设备公司。有媒体援引知情人士透露的最新消息报道称，总部位于荷兰的BE Semiconductor正与华尔街投行巨头摩根士丹利合作，讨论其收到的收购问询。其中一位知情人士补充表示，泛林集团已经发出了其中一项收购意向;另一位则补充称，应用材料公司也有浓厚收购兴趣。应用材料此前于2025年4月收购了BE Semiconductor 约9%的股份。当时，应用材料表示，其将这笔持股视为“具有战略意义的长期投资，表明应用材料致力于共同开发业内能力最强的混合键合封装解决方案——这项技术对于构成AI训练/推理系统最基础的先进逻辑和存储芯片产能与架构升级迭代而言正变得日益重要”。在周五，应用材料宣布将其季度股息提高15%，至每股0.53美元，高于此前的每股0.46美元。此前在美东时间周二，应用材料与存储芯片领军者美光科技(MU.US)以及总部位于韩国的SK海力士于美东时间周二宣布，它们已经达成重大合作，将开发并构建DRAM、高带宽存储器(即HBM存储系统)以及数据中心NAND存储系统最前沿解决方案以及升级迭代路线，以全面提升存储芯片整体产能以及人工智能训练/推理系统的综合性能。此前在2月，应用材料公布的最新业绩报告显示，几乎全套高端半导体设备的应用材料公司给出了超预期季度业绩以及无比强劲的未来业绩指引区间，凸显出在全球范围AI算力基础设施建设浪潮如火如荼以及“存储芯片超级周期”宏观背景之下，半导体设备厂商们也迎来超级增长周期，它们将是AI芯片(涵盖AI GPU/AI ASIC)与DRAM/NAND存储芯片产能急剧扩张趋势的最大规模受益者。这家美国最大规模的半导体制造设备与先进封装设备供应商预计，其2026财年第二季度营收约为76.5亿美元，上下浮动范围约5亿美元，相比之下，华尔街分析师们对于应用材料该财季(截至今年4月)的平均营收预期为70.3亿美元——要知道，随着3nm及以下先进制程AI芯片扩产与CoWoS/3D先进封装产能、DRAM/NAND存储芯片产能扩张大举加速，应用材料这一营收预期自今年以来被分析师们不断上调。Non-GAAP准则下第二财季每股收益展望区间则为2.44美元至2.84美元(不含部分项目)，这一展望远远高于2.29美元的分析师平均预期。应用材料Non-GAAP 准则下的第一季度每股收益为2.38美元，高于2.21美元的华尔街平均预期，与上年同期基本持平;第一季度该公司毛利率来到49%，上年同期约48%，第一季度的Non-GAAP自由现金流高达10.4亿美元，意味着实现大幅增长91%。芯片行业“新财富密码”——混合键合!这项技术卡着AI芯片与存储芯片的“脖子”先进封装已成为驱动算力持续提升的“后摩尔时代”新引擎，键合技术的性能直接决定了集成系统的上限。键合技术本身经历了从引线键合、倒装芯片、热压键合到扇出封装的演进，最终迈向混合键合时代。混合键合先进封装已经成为突破算力与带宽瓶颈、重塑AI算力产业链价值的核心技术之一。这一技术被广泛应用于AI芯片与HBM领域——比如英伟达Blackwell系列AI GPU以及博通AI ASIC、SK海力士HBM3E/HBM4，不久后在融合CPO技术的高性能以太网交换机领域也将扮演核心先进封装角色。混合键合通过铜-铜直接键合取代传统凸块，实现了10μm以下的超精细间距互连，在互连密度、带宽、能效和单位互连成本上带来数量级提升，是支撑3D堆叠与异构集成的关键突破。其工艺分为晶圆对晶圆(适合存储等均匀小芯片)和芯片对晶圆(适合大芯片及异构集成)。BE Semiconductor 的混合键合先进封装设备被台积电、SK海力士以及三星等芯片制造行业领先者全面采用，主要用于芯片先进封装环节，无论是2.5D CoWoS先进封装还是更加先进的3D/3.5D封装均需要用到混合键合设备。AI时代的瓶颈，越来越不在单颗晶体管，而在芯粒之间、逻辑与内存之间、封装内部的数据搬运效率。应用材料在一份研究报告中明确写到，混合键合通过直接铜对铜互连，提高互连密度、缩短连线长度，从而同时改善性能、功耗和成本;因此这种直接互连能带来更快的数据传输和更低功耗。对GPU、AI ASIC、CPU+加速器这类高性能计算芯片来说，这正是决定封装是否还能继续提升带宽密度与能效的关键。对HBM和高端企业级存储而言，混合键合同样越来越关键，对未来更高层数、更高带宽、更低功耗的内存/存储路线尤为关键。应用材料的Kinex材料明确提到，其系统面向未来HBM与逻辑-内存整合，且已展示16层及以上DRAM堆叠能力;Besi则表示客户路线图在未来两年将把混合键合/TC Next进一步导入HBM4/4e。在超大规模AI数据中心，高性能网络本身已经变成计算的一部分。Besi已把共封装光学(CPO)和ASIC列为新用例;博通此前在其102.4Tbps Tomahawk 6 CPO交换芯片上明确表示，把光引擎与交换芯片异构集成到共同封装内，可以显著改善功耗效率、链路稳定性，并支撑大规模AI集群扩展。全球半导体设备行业格局即将生变应用材料与泛林抢购BE Semiconductor这件事的本质不是普通并购，而是谁能抢下AI时代最稀缺的封装“瓶颈设备控制权”。Besi拥有“全球精度最高”的混合键合设备，这意味着它不是普通封装厂商，而是AI/HPC时代最稀缺的先进封装核心资产之一。随着微软、谷歌以及Meta等科技巨头们主导的全球超大规模AI数据中心建设进程愈发火热，全方位驱动芯片制造巨头们3nm及以下先进制程AI芯片扩产与CoWoS/3D先进封装产能、DRAM/NAND存储芯片产能扩张大举加速，半导体设备板块的长期牛市逻辑可谓越来越坚挺。根据机构汇编的最新分析师预期，亚马逊连同谷歌母公司Alphabet、Facebook母公司Meta Platforms Inc.，以及甲骨文公司和微软，预计将在2026年的累计人工智能相关资本支出达到大约6500亿美元，还有一些分析师认为整体支出可能超过7000亿美元——意味着同比AI资本开支增幅可能超过70%。如果最终由应用材料或泛林其中一家拿下Besi，意味着整个半导体设备行业格局将发生重大变化。这也将标志着先进封装正式从“后段工艺配角”升级为与前道制程并列的核心战场。对应用材料而言，这意味着它能把清洗、活化、计量、集成平台与Besi的键合核心拼成更完整的“全栈混合键合方案”;对泛林而言，则意味着它能从现有的TSV、RDL、高深宽比(HAR)刻蚀/沉积、混合键合支持工具，进一步向先进封装最核心的价值捕获环节纵深推进。无论谁赢，半导体设备行业格局都会更清楚地走向一个方向：未来AI芯片/存储芯片竞争，不仅依赖于EUV、刻蚀、薄膜沉积等先进半导体设备更新迭代，更是在比谁能把先进封装这条最难的最后一公里，变成自己平台的“超级护城河”。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":1,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":2,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}