电子行业：SRAM在AI推理中拓展应用堆叠方案可助力容量扩充_老虎社区_美港股上老虎

电子行业：SRAM在AI推理中拓展应用堆叠方案可助力容量扩充

东方证券股份有...03-07 14:37

事件：英伟达将于2026 年3 月16 日举办GTC 2026 大会。市场关注英伟达有望结合Groq LPU 芯片架构推出新的AI 推理芯片方案，进而驱动SRAM 拓展应用。SRAM 可实现较高的访问速度。SRAM 即静态随机存取存储器。在SRAM 中每个存储单元需4-6 个晶体管组成触发器结构，只要持续供电，触发器就能稳定保持数据状态，无需额外的刷新操作。基于此，SRAM 读写速度极快，访问时间...

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芯片架构推出新的AI 推理芯片方案，进而驱动SRAM 拓展应用。SRAM 可实现较高的访问速度。SRAM 即静态随机存取存储器。在SRAM 中每个存储单元需4-6 个晶体管组成触发器结构，只要持续供电，触发器就能稳定保持数据状态，无需额外的刷新操作。基于此，SRAM 读写速度极快，访问时间...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260307143737a6aca545&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"IE00B3SWFQ91.USD","symbol_name":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260307143737a6aca545&s=b","article_id":"2617030652","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260307143737a6aca545&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, 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推理过程中，对于小参数模型的模型权重、数据流架构中的中间结果和权重数据等部分容量要求小但访问速度要求高的数据，SRAM 可以作为HBM之外的重要的存储层级补充。从产业进展来看，2025 年12 月英伟达斥资200 亿美元获得Groq 的知识产权的非独家授权，其中包括其语言处理单元（LPU）和配套软件库，并引入Groq 核心工程团队。Groq LPU 采用容量达数百MB 的片上SRAM 存放模型权重，SRAM 集成在处理器内部，访问延迟显著低于 HBM。据Groq 官方数据显示，其片上带宽高达 80TB/s。根据量子位，英伟达未来有望结合Groq 设计的芯片推出新的推理计算系统。根据芯东西公众号，Cerebras 推出的晶圆级引擎3（WSE-3）芯片拥有多达44GB 的片上SRAM存储。2026 年2 月，OpenAI 正式发布其首款搭载Cerebras Systems 芯片的AI 模型GPT-5.3-Codex-Spark；OpenAI 有望在2026~2028 年把 750MW 规模的 Cerebras 芯片集成到其 AI 推理计算资源库中。3D 堆叠方案助力SRAM 实现容量扩充，AMD 等头部厂商已有布局。片上SRAM存在工艺缩放比逻辑电路慢等问题，导致在单枚芯片上SRAM 占用的面积较大、成本提升。基于此，部分投资者认为SRAM架构难以成为AI 芯片内存的主要方案。我们认为，SRAM 3D 堆叠方案可通过垂直堆叠存储单元的方法来提升密度以规避传统SRAM 容量受面积密度限制的问题，可能在未来拓展应用。从产业发展来看，2021年AMD 公布3D 垂直缓存（3D V-Cache）技术，可将额外的7nm SRAM 缓存垂直堆叠在 Ryzen 计算小芯片的顶部，大幅增加L3 缓存数量。2024 年7 月，富士通介绍旗下MONAKA 处理器采用3D SRAM 技术，计划2027 年出货。展望未来，若AI推理中需要实现更高容量的SRAM，3D 堆叠方案有望拓展应用。SRAM 在AI 推理中拓展应用，堆叠方案助力容量扩充。相关标的：布局定制化存储方案的国内头部存储芯片设计厂商兆易创新、北京君正等；布局基于SRAM 的数字存算一体方案的恒烁股份；布局先进封装的长电科技、通富微电等；布局混合键合设备的拓荆科技、华海清科、百傲化学、芯源微等；有望受益于英伟达新芯片方案的头部PCB 厂商深南电路、沪电股份、胜宏科技等；PCB 上游企业生益科技、南亚新材、宏和科技、菲利华、中材科技等。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}