英伟达联手高塔半导体！1.6T硅光模块解锁AI数据中心高速互连_老虎社区_美港股上老虎

英伟达联手高塔半导体！1.6T硅光模块解锁AI数据中心高速互连

半导体产业研究02-09 18:06

AI大模型算力需求持续飙升，数据中心内部的高速互连技术成为制约算力释放的核心瓶颈。以色列特色晶圆代工厂高塔半导体（Tower Semiconductor）宣布与英伟达达成深度合作，共同研发适配AI数据中心网络的1.6T光模块，依托高塔半导体的硅光子（SiPh）平台，打造符合英伟达网络协议的高速光互连方案，将硅光子技术推向AI数据中心高速组网的核心舞台，为超大规模算力集群的高效数据传输提供关键技术...

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Semiconductor）宣布与英伟达达成深度合作，共同研发适配AI数据中心网络的1.6T光模块，依托高塔半导体的硅光子（SiPh）平台，打造符合英伟达网络协议的高速光互连方案，将硅光子技术推向AI数据中心高速组网的核心舞台，为超大规模算力集群的高效数据传输提供关键技术支撑。核心合作：硅光平台升级，1.6T速率突破AI互连瓶颈此次合作中，高塔半导体的硅光子平台将全面适配英伟达的网络协议标准，打造的1.6T光模块数据传输速率较上一代硅光子产品实现翻倍，直击AI基础设施的核心痛点——分布式算力集群中GPU、加速器与内存之间的数传效率问题。随着AI大模型参数从十亿级跃迁至万亿级，数据移动的重要性已与算力本身持平。超大规模AI数据中心内，数千颗计算芯片需同步协同运算，传统互连技术难以满足低延迟、高带宽的数传需求，而高速光互连成为维持集群运算效率的关键。高塔半导体的硅光子平台通过定制化的高速光收发器设计，完美适配下一代AI系统架构，可实现算力集群内的高效数据交互，从底层解决数据传输的效率桎梏。对于英伟达而言，此次合作是其打造可扩展、高能效AI网络生态的重要落子。光互连技术能在保证高吞吐量的同时，最大限度降低传输延迟与功耗，这正是超大规模AI算力集群实现稳定、高效运行的核心要求。英伟达网络高级副总裁Gilad Shainer表示，AI的指数级增长催生了新一代高速可扩展网络的需求，与高塔半导体的合作将完善硅光子生态，通过下一代技术推动AI基础设施效率提升，加速AI应用的规模化落地。产业变革：特色晶圆厂向系统级技术赋能转型此次合作也标志着高塔半导体的战略转型，从单纯的晶圆制造厂商，向系统级技术赋能者迈进。不同于传统晶圆厂的代工模式，高塔半导体此次聚焦产品的性能、可扩展性与可制造性三大核心维度，全程参与光模块从设计到量产的全流程，助力客户快速实现1.6T光模块在AI数据中心的商业化落地。据eeNews Europe报道，这一合作凸显了硅光子技术与晶圆制造工艺，正成为超大规模数据中心、网络平台及通信基础设施中AI系统设计的核心支撑。高塔半导体也持续加大对硅锗（SiGe）与硅光子技术的研发投入，以匹配市场对高速光互连的旺盛需求，并将硅光子技术与自身成熟的模拟、射频（RF）技术融合，形成一体化解决方案，全面覆盖AI基础设施、数据中心组网及通信应用场景。目前，1.6T光模块正逐步迈向商业化部署阶段，随着GPU与AI加速器的性能持续升级，数据中心的网络带宽需求同步激增，硅光子技术凭借高集成度、低功耗、高速率的核心优势，已成为AI数据中心架构的核心技术之一，行业渗透率将持续提升。硅光子技术为何是AI互连的最优解？硅光子技术是将光子学集成到硅基晶圆上的新一代互连技术，相较于传统的电互连与普通光模块，其适配AI数据中心的核心优势体现在三方面：1. 高速率低延迟：基于硅基晶圆的光子集成设计，可实现Tb级别的高速数据传输，信号传输延迟远低于电互连，完美匹配AI算力集群的高速数传需求；2. 高集成度低功耗：利用成熟的硅基半导体制造工艺，可将光发射、接收、调制等器件集成于单一晶圆，大幅缩小模块体积，同时光子传输的功耗远低于电子传输，契合数据中心能效要求；3. 高兼容性易量产：硅光子平台兼容传统CMOS制造工艺，高塔半导体等晶圆厂可依托现有产线实现规模化量产，降低1.6T光模块的商业化成本，加速在AI数据中心的普及。高塔半导体作为全球领先的特色晶圆代工厂，在以色列、美国、日本布局自有晶圆厂，同时在欧美拥有合作产能，其成熟的硅锗、BiCMOS、RF CMOS等特色工艺，为硅光子技术的量产落地提供了坚实的制造基础，此次与英伟达的合作，也让其成为AI高速互连领域的核心制造玩家。产业趋势：光互连成AI数据中心标配，生态协同成关键随着AI算力集群向更大规模、更快速率演进，光互连技术已成为下一代AI数据中心的标配，而网络平台厂商与特色晶圆厂的深度合作，正成为数据中心架构升级的核心模式。高塔半导体与英伟达的合作，不仅是单一技术与产品的研发，更是AI高速互连生态的构建。未来，硅光子技术将持续向更高速率、更高集成度演进，400G/800G光模块将成为基础配置，1.6T及以上速率产品将逐步成为超大规模AI数据中心的主流选择，而晶圆厂、芯片厂商、光模块厂商的全产业链协同，将成为推动技术落地、降低量产成本的关键，也将重塑AI数据中心的互连产业格局。原文标题：Tower Semiconductor, Nvidia advance 1.6T optical modules for AI data center networking原文媒体：digitimes asia","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}