力成押注FOPLP，赌对了_老虎社区_美港股上老虎

力成押注FOPLP，赌对了

半导体产业纵横02-09 18:31

台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 ...

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{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2610639154?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-02-09 18:31","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2610639154","market":"us","top_or_hot":-1,"title":"力成押注FOPLP，赌对了","media":"半导体产业纵横","content":"<div>\n<p>台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>力成押注FOPLP，赌对了</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n力成押注FOPLP，赌对了\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-02-09 18:31 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b><strong>半导体产业纵横</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2092937221.SGD","symbol_name":"Blackrock Circular Economy A2 SGD-H","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b","article_id":"2610639154","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2610639154","pubTimestamp":1770633076,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP客户博通与AMD均派出高层到场支持。力成选择投入大量时间与资源，与客户共同开发 FOPLP 产品，甚至暂缓了此前布局已久的 HBM 封装业务，集中资源突破面板级扇出封装的工艺瓶颈。此外，力成本年已完成两处新厂区扩建，包括收购友达一座大型厂房，专门用于FOPLP 先进封装产能扩充，以及测试事业群新增一座厂区，提升高端芯片测试能力。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU2092937221.SGD":"Blackrock Circular Economy A2 SGD-H","TSMY":"TSM期权收益策略ETF-YieldMax","LU1934455194.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (USD) ACC","LU2491050154.USD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (USD) ACC","LU0488056044.USD":"Allianz Asian Multi Income Plus Cl AM DIS USD","TSMZ":"1倍做空TSM ETF-Direxion","LU0384037296.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AT\" (USD) ACC","BK4503":"景林资产持仓","BK4602":"量子计算概念","LU0823414478.USD":"法巴经典能源转换基金","LU0056508442.USD":"贝莱德世界科技基金A2","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","BK4528":"SaaS概念","LU2028103732.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AMG\" (USD) INC","LU2860962120.EUR":"CPR INVEST - ARTIFICIAL INTELLIGENCE \"A2\" (EUR) ACC A","BK4505":"高瓴资本持仓","IE00B5TLWC47.USD":"BNY MELLON LONG-TERM GLOBAL EQUITY \"B\" (USD) ACC","LU2089284900.SGD":"Allianz Global Sustainability Cl AM Dis H2-SGD","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU0238689110.USD":"贝莱德环球动力股票基金","AVGO":"博通","BK4605":"半导体精选","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","SG9999004220.SGD":"Nikko AM Shenton Asia Dividend Equity Fund  SGD","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU0878004406.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) INC","LU0359201612.USD":"贝莱德中国基金A2","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","SGXZ81514606.USD":"大华环球创新基金A Acc USD","LU0882747503.HKD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (HKD) INC","LU0158827948.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"A\" (USD) INC","TSM":"台积电","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC","BK4527":"明星科技股","LU2357125470.USD":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) ACC","LU0316494557.USD":"FRANKLIN GLOBAL FUNDAMENTAL STRATEGIES \"A\" ACC","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","BK4526":"热门中概股","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","LU1267930813.SGD":"FRANKLIN TEMPLETON SHARIAH GLOBAL EQUITY \"AS\" (SGD) ACC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","LU2471134952.CNY":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (CNYHDG) INC","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU1282649810.SGD":"Allianz Asian Multi Income Plus Cl AMg DIS H2-SGD","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","LU2125154778.USD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (USD) INC","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC","LU0359201885.HKD":"BGF CHINA \"A2\" (HKD) ACC","LU0861579265.USD":"联博低波幅策略股票基金A","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","BK4612":"AI芯片","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU2750360997.AUD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (AUDHDG) INC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU1868838027.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"8\" (USD) ACC","LU0345770308.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) ACC","LU0175139822.USD":"AB FCP I Global Equity Blend A USD","LU0345770993.USD":"NINETY ONE GSF GLOBAL STRATEGIC EQUITY \"A\" (USD) INC","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","BK4532":"文艺复兴科技持仓","BK4581":"高盛持仓","LU0965509283.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (SGDHDG) INC","LU1868837722.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"2\" (USD) ACC","BK4512":"苹果概念","BK4543":"AI","LU2089283258.USD":"安联环球可持续基金Cl AM Dis","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","LU2041044095.USD":"Blackrock Circular Economy A2 USD","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","BK4534":"瑞士信贷持仓","BK4141":"半导体产品","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","MU":"美光科技","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","BK4533":"AQR资本管理(全球第二大对冲基金)","BK4591":"室温超导概念","LU0689626769.HKD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (HKD) ACC","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","LU0965509101.SGD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (SGDHDG) ACC","STSM":"Defiance Daily Target 2X Short TSM ETF","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","SGXZ51526630.SGD":"大华环球创新基金A Acc SGD","BK4535":"淡马锡持仓","LU2271345857.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (HKD) ACC","LU2663582299.SGD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOL \"A2\" (SGDHDG) ACC","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU0541502299.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"I\" (USD) ACC","BK4548":"巴美列捷福持仓","LU0264606111.USD":"Janus Henderson Horizon Asian Dividend Income A2 USD","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0082616367.USD":"摩根大通美国科技A（dist）","LU2360108059.USD":"BGF CIRCULAR ECONOMY \"A4\" (USD) INC","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","BK4023":"应用软件","LU1023057109.AUD":"BGF CHINA \"A2\" (AUDHDG) ACC","BK4554":"元宇宙及AR概念","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","LU1917777945.USD":"安联专题基金Cl AT Acc","LU0572939691.SGD":"Janus Henderson Horizon Asian Dividend Income A2 SGD","LU1868837565.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES \"1\" (USD) ACC","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","03145":"华夏亚洲高息股","BK4585":"ETF&股票定投概念","IE0004091025.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"B\" (USD) ACC","AUO":"友达光电","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC","BK4587":"ChatGPT概念","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","LU0143863784.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"DU\" (USD) ACC","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU2211815571.USD":"ALLIANZ POSITIVE CHANGE \"AT\" (USD) ACC","LU0541501648.USD":"ALLSPRING  EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU1712237335.SGD":"Natixis Mirova Global Sustainable Equity H-R-NPF/A SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","LU0289960550.SGD":"AB FCP I - GLOBAL EQUITY BLEND PORTFOLIO 'A' (SGD) ACC","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU2125154935.USD":"ALLSPRING (LUX) WF GLOBAL EQUITY ENHANCED INCOME \"I\" (USD) INC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","BK4550":"红杉资本持仓","BK4588":"碎股","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU2063271972.USD":"富兰克林创新领域基金","AMD":"美国超微公司","HBM":"HudBay Minerals Inc","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","LU2237443382.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA USD","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","TSMG":"2倍做多TSM ETF- Leverage Shares","NVDA":"英伟达","LU0143863198.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"AU\" (USD) ACC","BK4551":"寇图资本持仓","LU2237443549.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A MIncA SGD-H","LU0124676726.USD":"AB SICAV I - SUSTAINABLE US THEMATIC PORTFOLIO \"A\" (USD) ACC","LU1989772923.USD":"CPR Invest - Climate Action A2 Acc USD-H","LU1037948897.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (HKD) INC","LU2237443622.USD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc USD","LU0965508806.USD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (USD) INC","BK4168":"多种金属与采矿","LU0359202008.SGD":"Blackrock China Fund A2 SGD-H","LU2298321311.HKD":"BGF CIRCULAR ECONOMY \"A\" (HKDHDG) ACC","LU1934455277.USD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"AD\" (USD) INC","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","TSMU":"2倍做多TSM ETF-GraniteShares","LU2237443978.SGD":"Aberdeen Standard SICAV I - Global Dynamic Dividend A Acc SGD-H","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","LU0889566641.SGD":"FTSF - Templeton Shariah Global Equity A Acc SGD","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","LU0323591593.USD":"SCHRODER ISF QEP GLOBAL QUALITY \"A\" (USD) ACC","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","TSMX":"2倍做多TSM ETF-Direxion","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC"},"translate_title":"Licheng bets on FOPLP, the bet is right","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1.71,"TSMU":0.6,"AUO":1.61,"TSMX":0.6,"TSMG":0.6,"TSMZ":0.6,"TSMY":0.6,"TSM":1.77,"NVDA":1.64,"STSM":0.6,"03145":0.6,"MU":1.67,"HBM":0.73,"AVGO":1.71},"content_text":"台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 2016 年启动相关研发与产线建设，历经近十年技术迭代与工艺优化，逐步完成从实验室验证到小批量试产的过渡，此次产业链核心伙伴集体到场，也标志着其技术路线与量产能力获得头部客户与设备端的双重认可。针对市场对AI 是否出现泡沫的担忧，力成董事长蔡笃恭强调：“在我个人看来，这一轮 AI 应用与算力需求才刚刚起步，距离行业过热还有相当大的距离。” 他进一步表示，无论是先进工艺还是先进封装，当前均处于供不应求状态，未来需求还将持续扩大。从行业基本面来看，AI 大模型参数规模持续攀升，多芯片异构集成成为主流架构，封装环节承担着芯片间高速互联、散热优化、尺寸控制等核心功能，成为制约算力集群效率的关键环节。目前能够大规模提供先进封装服务的厂商仍以台积电为主，而力成则定位为非台积电阵营的重要替代选择，重点承接因台积电产能饱和而外溢的高端封装需求。蔡笃恭表示，2026、2027 年资本开支均将接近 400 亿元，主要用于 FOPLP 产线扩建、工艺设备采购与研发投入，希望 FOPLP 等先进封测业务成为公司另一大核心增长动力。根据公司规划，其 510mm × 515mm 规格 FOPLP 产线月产能目标为 6000 片，若该产能于 2028 年全部建成并实现满产，单月营收贡献有望超过 30 亿元，预计占公司总营收比例将达到 20% 至 30%，彻底改变公司以存储封测为主的收入结构。过去市场对力成科技的固有印象，大多停留在“全球最大存储芯片封测厂”，长期聚焦 DRAM、NAND Flash 等存储器件的封装与测试服务，客户覆盖美光、铠侠、Solidigm 等国际存储大厂。但如今力成正以先进封装厂商的全新定位，成功获得国际一线客户的认可。当前台积电先进封装产能紧张，大部分被英伟达锁定，高端 AI 芯片、GPU、网络交换芯片的封装订单出现明显外溢，也让力成迎来难得的市场机遇。博通、AMD等客户从一年多前便主动洽谈合作，围绕AI 运算芯片、网络芯片开展 FOPLP 方案开发，并于近期正式进入 NRE（一次性工程设计费用）阶段，为后续大规模量产奠定基础。在AI 需求快速增长的带动下，芯片大厂纷纷加大先进封装布局力度，2.5D/3D 封装、扇出型封装、面板级封装等技术路线并行发展。力成选择投入大量时间与资源，与客户共同开发 FOPLP 产品，甚至暂缓了此前布局已久的 HBM 封装业务，集中资源突破面板级扇出封装的工艺瓶颈。对力成而言，过去十年的技术研发历经波折，早期因市场需求不成熟、工艺良率爬坡缓慢等因素，未能快速实现商业化落地，如今随着 AI 芯片集成度提升与大尺寸封装需求爆发，终于迎来转机。目前市场主流先进封装技术仍是台积电采用硅中介层的CoWoS‑S，但该架构在尺寸拓展、生产成本与量产效率方面存在一定限制，难以满足超大尺寸芯片与低成本规模化量产需求。因此台积电也在持续推进以重布线层（RDL）替代部分硅中介层的 CoWoS‑R，以及采用多颗硅桥（Bridge Die）连接的 CoWoS‑L，后两种架构的技术本质，与力成长期布局的无硅基板面板级封装工艺（PLP）十分接近，均侧重通过 RDL 层与硅桥实现芯片间高密度互联，这也为力成技术对接主流高端封装需求提供了可行性。过去，力成的工艺路线与CoWoS‑S 架构存在差异，导致应用场景受限，难以充分发挥自身优势；但随着 AI 芯片性能不断提升，封装内部需要整合更多计算芯片、存储芯片与接口模块，采用硅桥（Bridge Die）替代传统中介层的工艺路线，在成本、集成度与布线灵活性上更具优势，恰好是力成长期深耕并具备竞争力的技术方向。同时，FOPLP 采用面板级制程，单面板可同时处理多颗芯片，生产效率显著高于传统晶圆级封装，单位成本更具竞争力，适配 AI 芯片规模化量产需求。当前最热门的产品仍是HBM（高带宽存储）。由于 AI 服务器与算力集群需求爆发，HBM 需求极为旺盛，头部存储厂商优先调配产能保障 HBM 产出，反而挤占了其他存储产品的产能，导致整体存储芯片供应偏紧，这一状况短期内仍将持续。至于原厂扩产 HBM，无论在设备、工艺还是良率爬坡方面都需要较长周期，短期内难以完全匹配市场需求。力成虽具备成熟的 HBM 封装经验，但目前相关产能已优先转向支持 FOPLP 业务扩张，暂时没有多余产能直接投入 HBM 封装，待 FOPLP 产线稳定后再视市场情况调整产能分配。力成也是美光最大的后段封测代工合作伙伴，双方在存储封测领域合作多年，合作范围覆盖DRAM、NAND 等主流产品。随着美光在台湾地区、新加坡等地积极扩产，外界关注双方是否会进一步深化合作，拓展至先进封装领域。对此，蔡笃恭表示，目前仍处于敏感阶段，需要再观察一段时间，待市场环境与合作条件成熟后再对外说明。此外，力成本年已完成两处新厂区扩建，包括收购友达一座大型厂房，专门用于FOPLP 先进封装产能扩充，以及测试事业群新增一座厂区，提升高端芯片测试能力。这两座新厂的产能规模，基本可以支撑力成未来两年的增长需求，同时厂房设计与基础设施预留了灵活升级空间，后续可根据市场需求快速导入 HBM 相关封装与测试产能，平衡存储封测与先进封装业务发展。从行业发展趋势来看，先进封装已成为半导体产业技术竞争的核心领域，面板级扇出封装凭借高集成度、低成本、大尺寸适配等优势，逐步成为AI 芯片、网络芯片、高性能计算芯片的重要封装选择。力成科技凭借十年技术积累与产业链协同优势，抓住台积电产能饱和与先进封装需求爆发的窗口期，推动 FOPLP 技术商业化落地，不仅实现自身从存储封测向综合先进封装厂商的转型，也为全球先进封装产业提供了多元化的产能供给选择，对优化 AI 算力基础设施供应链、推动先进封装技术迭代具有积极意义。*声明：本文系原作者创作。文章内容系其个人观点，我方转载仅为分享与讨论，不代表我方赞成或认同，如有异议，请联系后台。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":2,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}