台积电削减12英寸成熟制程产能_老虎社区_美港股上老虎

台积电削减12英寸成熟制程产能

半导体行业观察01-25

公众号记得加星标⭐️，第一时间看推送不会错过。研调机构Counterpoint发布报告指出，台积电预计在2028年前将晶圆14厂12英寸成熟制程产能削减15%至20%。主要目的是解决传统工艺节点产能利用率低下的问题，同时释放资源以支持先进封装技术的拓展。台积电表示，不评论单一市场报告。不过，会全力支持所有客户。台积电在日前法人说明会针对成熟制程产能调整进行说明，指出确实降低8英寸与6英寸晶圆产能，...

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Rate）驱动，该节点的超量测试率一直维持在80%左右，且复苏前景不明朗。与之形成鲜明对比的是，市场对先进封装解决方案的需求持续增长。因此，台积电正优先将洁净室空间、设备和资金重新分配到更高价值的制造领域。然而，该公司强调，此举并非反映成熟节点半导体终端需求的下降，而是台积电全球制造生态系统中此类生产布局的优化调整。为确保依赖成熟和中端制程节点的客户的持续供应，台积电正日益利用海外晶圆厂和附属制造平台。在日本，熊本晶圆厂（Fab23）预计将于2026年底前实现40/45nm和12/16nm制程的产能提升，从而支持以汽车和互联网服务提供商（ISP）为重点的供应链。在欧洲，德累斯顿晶圆厂（Fab24）的建设正在稳步推进，预计将于2027年开始设备安装，并计划在本十年末实现22/28nm和12/16nm制程的显著产能。Fab14的部分设备预计将被重新部署到这些晶圆厂，从而在提高资产利用率的同时，控制海外资本支出。与此同时，台积电旗下子公司VIS在吸收成熟节点产能方面发挥着日益重要的作用。VIS已宣布计划从台积电收购12英寸制程设备，以支持其位于新加坡的制造基地VSMC向130nm至40nm制程的扩展。此举进一步明确了集团内部的分工——台积电专注于先进逻辑和先进封装，而VIS则以更高的资本效率满足稳定、长周期成熟节点的需求。根据目前的形势，台积电预计到 2028 年将逐步淘汰 Fab14 工厂约 50KWPM 的产能，通过多元化的制造渠道提高运营灵活性和盈利能力，同时维持客户供应。台积电表示，经与客户讨论，让资源运用更具弹性，也就是优化资源以支持客户。台积电会一如既往地支持客户，即使是在8英寸晶圆业务方面，只要客户有好的业务发展，台积电都会持续提供支援。参考链接https://money.udn.com/money/story/5612/9284784https://counterpointresearch.com/en/insights/TSMC-to-Cut-Fab14-Mature-Node-Capacity-to-Reflect-Changing-Demand-MixXXXXXXXXXX（来源：udn&counterpointresearch）*免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}