HBM之后HBF也要来了更高容量引领AI时代存储革命_老虎社区_美港股上老虎

HBM之后HBF也要来了更高容量引领AI时代存储革命

极客网01-19

极客网·芯片1月19日在半导体存储领域，HBM（高带宽内存）用近十年时间完成了从技术概念到产业核心的蜕变，成为 AI 大模型、高端 GPU 等算力密集型应用的关键支撑。而如今，其迭代技术 HBF（高带宽闪存）正加速袭来，凭借更具颠覆性的性能特点，有望重塑存储产业格局，为 AI 时代的存储需求提供全新解决方案。HBF 之所以被寄予厚望，核心在于其精准切中了当前存储领域的核心痛点 —— 容量与带宽的...

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之所以被寄予厚望，核心在于其精准切中了当前存储领域的核心痛点 —— 容量与带宽的平衡难题。作为通过堆叠 NAND 闪存制成的新型存储产品，HBF 与 HBM 在结构上有着异曲同工之妙，但应用场景与性能侧重却形成鲜明互补。正如 “HBM 之父”、韩国科学技术院（KAIST）教授金正浩的生动比喻：“HBM 与 HBF 就好比书房与图书馆，前者容量虽小但使用便捷，后者则以超大容量成为数据存储的‘超级仓库’”。相较于 HBM，HBF 的核心优势集中体现在存储容量的跨越式提升上。广发证券的研究显示，在研的 HBF 存储容量有望达到现有 HBM 的 8 至 16 倍，这一突破将彻底改变 GPU 存储容量的上限，有望将其扩展至 4TB 级别。在 AI 大模型参数规模迈入万亿级、上下文长度普遍超过 128K 的当下，HBM 的容量瓶颈日益凸显，而 HBF 的超大容量特性，恰好完美匹配了 AI 大模型对海量数据存储的极致需求，被业内视为满足下一代 AI 内存要求的最佳方案。除了容量优势，HBF 在技术延续性与应用扩展性上也具备显著潜力。其结构与 HBM 的共通性，使得存储厂商能够快速复用成熟的堆叠技术与生产经验，降低研发与量产成本。金正浩进一步预测，待 HBM 迭代至第六代产品时，HBF 将实现广泛应用，届时单个基础裸片将集成多组存储堆栈，进一步释放其容量潜力。从市场前景来看，2 至 3 年内 HBF 相关方案将密集涌现，到 2038 年左右，HBF 市场规模有望超越 HBM，成为存储领域的主流技术路线。当前，全球科技巨头已纷纷入局 HBF 赛道，加速推动其商业化落地。SK 海力士正与闪迪联手推进 HBF 标准制定，并计划于今年推出采用 16 层 NAND 闪存堆叠的 HBF1 第一代样品；三星电子与闪迪更是明确了应用时间表，预计最快在 2027 年底或 2028 年初将 HBF 技术植入英伟达、AMD 和谷歌的实际产品中。总而言之，从 HBM 到 HBF，存储技术的迭代始终围绕着算力提升的核心需求。如果说 HBM 解决了 AI 发展初期的带宽瓶颈，那么 HBF 则将以超大容量的核心优势，支撑起下一代 AI 大模型、智能计算等场景的爆发式增长。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}