光学共封装（CPO）真的来了？台积电首批样品即将交付_老虎社区_美港股上老虎

光学共封装（CPO）真的来了？台积电首批样品即将交付

半导体芯知11-17

正如笔者前几天所提及的，随着AI数据中心对带宽和能效需求的持续爆发，传统铜线互连架构逐渐遇到物理瓶颈。为此，光学共封装（CPO, Co-Packaged Optics）技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电（TSMC）已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。这些样片支持每条光纤高达1.6T（...

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{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2584675878?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-11-17 21:33","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2584675878","market":"us","top_or_hot":-1,"title":"光学共封装（CPO）真的来了？台积电首批样品即将交付","media":"半导体芯知","content":"<div>\n<p>正如笔者前几天所提及的，随着AI数据中心对带宽和能效需求的持续爆发，传统铜线互连架构逐渐遇到物理瓶颈。为此，光学共封装（CPO, Co-Packaged Optics） 技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电（TSMC）已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。这些样片支持每条光纤高达1.6T（...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>光学共封装（CPO）真的来了？台积电首批样品即将交付</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n光学共封装（CPO）真的来了？台积电首批样品即将交付\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-11-17 21:33 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b><strong>半导体芯知</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>正如笔者前几天所提及的，随着AI数据中心对带宽和能效需求的持续爆发，传统铜线互连架构逐渐遇到物理瓶颈。为此，光学共封装（CPO, Co-Packaged Optics） 技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电（TSMC）已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。这些样片支持每条光纤高达1.6T（...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0572940350.SGD","symbol_name":"Janus Henderson Horizon Asian Dividend Income A3 SGD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b","article_id":"2584675878","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251118020213a6ffe6d2&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2584675878","pubTimestamp":1763386416,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"为此，光学共封装 技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电 已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。业内预计，这批 1.6T光模块最早将于 2026 年开始出货。TSMC的硅光子技术与先进封装方案的结合，使得CPO模块能够在晶圆级实现高密度集成，同时保持良好的批量复制性和一致性。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0572940350.SGD":"Janus Henderson Horizon Asian Dividend Income A3 SGD","BK4141":"半导体产品","BK4534":"瑞士信贷持仓","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0359201885.HKD":"BGF CHINA \"A2\" (HKD) ACC","LU0823414551.USD":"BNP PARIBAS ENERGY TRANSITION \"C\" (USD) INC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","LU2750360641.GBP":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (GBPHDG) INC","LU0792757196.USD":"TEMPLETON SHARIAH GLOBAL EQUITY FUND \"A\" (USD) ACC","LU0965509010.AUD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"AD\" (AUDHDG) INC","LU1508157978.USD":"BSF BLACKROCK SYSTEMATIC ASIA PACIFIC EQUITY ABSOLUTE RETURN \"A\" (USD) ACC","LU2023251221.USD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (USD) INC","LU2111349929.HKD":"ALLIANZ GLOBAL SUSTAINABILITY \"AM\" (HKD) INC","BK4554":"元宇宙及AR概念","LU1989772840.SGD":"CPR Invest - Climate Action A2 Acc SGD-H","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0143863198.USD":"CT (LUX) I GLOBAL EMERGING MARKET EQUITIES\"AU\" (USD) ACC","LU0878005551.USD":"UBS (LUX) KEY SELEC ASIA ALLOCATION OPPORTUNITY (USD) \"P\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU0158827781.USD":" ALLIANZ GLOBAL SUSTAINABILITY \"AT\" (USD) ACC","BK4588":"碎股","LU2360108059.USD":"BGF CIRCULAR ECONOMY \"A4\" (USD) INC","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","BK4605":"半导体精选","LU2298321311.HKD":"BGF CIRCULAR ECONOMY \"A\" (HKDHDG) ACC","LU2491049909.HKD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (HKD) ACC","NVDA":"英伟达","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","LU2249611893.SGD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (SGD) ACC","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC","LU2491050071.SGD":"WELLINGTON SUSTAINABLE OUTCOMES \"A\" (SGDHDG) ACC","LU2506951792.HKD":"BNP PARIBAS ENERGY TRANSITION \"CRH\" (HKDHDG)       ACC","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","LU2211814178.USD":"ALLIANZ CLEAN PLANET \"AT\" (USD) ACC","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","03145":"华夏亚洲高息股","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU1934455863.HKD":"AB SICAV I LOW VOLATILITY TOTAL RETURN EQUITY PORT \"A\" (HKD) ACC","BK4581":"高盛持仓","BK4532":"文艺复兴科技持仓","LU2360032135.SGD":"ALLSPRING GLOBAL EQUITY ENHANCED INCOME \"A\" (SGDHDG) INC","LU2294711713.HKD":"BNP PARIBAS ENERGY TRANSITION \"C\" (HKD) ACC","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","BK4527":"明星科技股","LU0823414478.USD":"法巴经典能源转换基金","LU1623119135.USD":"Natixis Mirova Global Sustainable Equity R-NPF/A USD","TSM":"台积电","LU2471134523.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) ACC"},"translate_title":"Is optical co-packaging (CPO) really coming? TSMC's first samples will be delivered soon","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"03145":0.6,"NVDA":0.9,"TSM":1.5},"content_text":"正如笔者前几天所提及的，随着AI数据中心对带宽和能效需求的持续爆发，传统铜线互连架构逐渐遇到物理瓶颈。为此，光学共封装（CPO, Co-Packaged Optics） 技术成为下一代高性能计算和高速互连的核心解决方案。根据最新相关报道，台积电（TSMC）已开发出首批 CPO 样片，并预计将在年内交付到NVIDIA（英伟达）和Broadcom（博通）。这些样片支持每条光纤高达1.6T（Terabits-per-second）的传输速率，可直接应用于新一代 AI 数据中心，实现芯片间光互连的高速通信。业内预计，这批 1.6T光模块最早将于 2026 年开始出货。（1）CPO 技术为何成为 AI 数据中心新宠？CPO（Co-Packaged Optics，光学共封装）的核心理念，是将光模块直接与主芯片共封装，使电-光信号转换在毫米级距离内完成，从而最大化带宽利用率，同时显著降低功耗和信号延迟。这一设计彻底突破了传统铜线互连在高带宽、高密度应用中的物理限制，使芯片间通信速度和能效实现同步提升。相比传统的分离式封装，CPO在数据传输密度、能效比和系统可靠性方面均有显著优势，尤其适合用于AI模型训练平台、高性能交换机和下一代数据中心的核心计算节点。TSMC的硅光子技术与先进封装方案的结合，使得CPO模块能够在晶圆级实现高密度集成，同时保持良好的批量复制性和一致性。这意味着，不仅单个芯片的性能大幅提升，整个数据中心在规模化部署时也能获得稳定可靠的光互连方案。值得注意的是，晶圆级的光电集成还能有效降低布线复杂度，简化散热管理，同时为大规模并行计算提供可扩展的解决方案。未来，随着CPO技术不断成熟，其在 AI 数据中心、云计算服务器和高速互联网络中的应用将更加广泛，有望成为下一代高性能计算的标准方案，为算力升级和能效优化提供核心支撑。（2）行业意义与展望CPO技术的价值不仅体现在技术层面，更直接影响整个高性能计算生态。对于AI推理和训练负载持续攀升的数据中心而言，CPO可突破铜线互连的速度与能效瓶颈，实现芯片间光互连的质的飞跃。若这批1.6T光模块当真在2026年开始量产，AI数据中心将进入“光速时代”，算力密度、能效比和整体性能都将获得显著提升。此外，TSMC的硅光子技术结合先进封装方案，也将推动光通信、交换机、高性能服务器等相关产业的发展。有业内分析师认为，随着CPO技术逐步成熟并进入量产阶段，它有望成为下一代数据中心的标准方案，不仅提升算力和能效，还将推动全球 AI 计算能力的升级，为云计算、大模型训练和高性能计算应用带来全新机遇。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":1,"commentSize":0,"repostSize":1,"favoriteSize":1,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}