英伟达新一代GPU有望采用碳化硅中介层，SiC衬底新应用打开公司成长空间_老虎社区_美港股上老虎

英伟达新一代GPU有望采用碳化硅中介层，SiC衬底新应用打开公司成长空间

东方财富09-07

晶盛机电(300316)投资要点事件：英伟达计划在新一代GPU芯片的CoWoS工艺中以碳化硅取代硅中介层，预计2027年导入。英伟达高阶GPU均采用CoWoS结构，后续高性能版本散热需求更高：英伟达GPU芯片从H100到B200均采用CoWoS封装（芯片-晶圆-基板）技术。CoWoS通过将多个芯片（如处理器、存储器等）高密度地堆叠集成在一个封装内，显著缩小了封装面积，并大幅提升了芯片系统的性能和...

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