挑战英伟达高端显卡地位？AMD 被曝研发 2.5D / 3.5D 芯粒封装_老虎社区_美港股上老虎

挑战英伟达高端显卡地位？AMD 被曝研发 2.5D / 3.5D 芯粒封装

IT之家08-30

IT之家 8 月 30 日消息，科技媒体 Tom's Hardware 昨日（8 月 29 日）发布博文，报道称 AMD 资深研究员、SoC 首席架构师 Laks Pappu 在其 LinkedIn 资料中透露，AMD 正研发新一代基于 2.5D / 3.5D 芯粒（chiplet）封装及单芯片（monolithic）架构的 GPU，意味着该公司有望在下一代产品中重返高性能 GPU 竞争。IT之家...

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