芯报丨芯德半导体再次完成近4亿元融资，系国内先进封测研发商_老虎社区_美港股上老虎

芯报丨芯德半导体再次完成近4亿元融资，系国内先进封测研发商

AI芯天下2025-08-15

聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资，系国内先进封测研发商近日，江苏芯德半导体科技股份有限公司再次完成近4亿元融资，前段时间刚完成最新一轮总额近4亿元的融资，将进一步巩固其在移动产品及异质性封装模组领域的技术优势。本轮融资由南京市、区两级机构联合领投，江苏南京先进制造产业专项母基金、元禾璞华和雨山资本跟投。融资资金将主要用于进一步加速布局...

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{"i18n":{"language":"zh_CN"},"data":{"share":"https://www.laohu8.com/m/news/2559391240?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2025-08-15 20:31","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2559391240","market":"us","top_or_hot":-1,"title":"芯报丨芯德半导体再次完成近4亿元融资，系国内先进封测研发商","media":"AI芯天下","content":"<div>\n<p>聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资，系国内先进封测研发商近日，江苏芯德半导体科技股份有限公司再次完成近4亿元融资，前段时间刚完成最新一轮总额近4亿元的融资，将进一步巩固其在移动产品及异质性封装模组领域的技术优势。本轮融资由南京市、区两级机构联合领投，江苏南京先进制造产业专项母基金、元禾璞华和雨山资本跟投。融资资金将主要用于进一步加速布局...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250815214444a6e86b7b&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>芯报丨芯德半导体再次完成近4亿元融资，系国内先进封测研发商</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n芯报丨芯德半导体再次完成近4亿元融资，系国内先进封测研发商\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-08-15 20:31 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250815214444a6e86b7b&s=b><strong>AI芯天下</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资，系国内先进封测研发商近日，江苏芯德半导体科技股份有限公司再次完成近4亿元融资，前段时间刚完成最新一轮总额近4亿元的融资，将进一步巩固其在移动产品及异质性封装模组领域的技术优势。本轮融资由南京市、区两级机构联合领投，江苏南京先进制造产业专项母基金、元禾璞华和雨山资本跟投。融资资金将主要用于进一步加速布局...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250815214444a6e86b7b&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1548497426.USD","symbol_name":"安联环球人工智能AT Acc","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250815214444a6e86b7b&s=b","article_id":"2559391240","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250815214444a6e86b7b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2559391240","pubTimestamp":1755261086,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资，系国内先进封测研发商近日，江苏芯德半导体科技股份有限公司再次完成近4亿元融资，前段时间刚完成最新一轮总额近4亿元的融资，将进一步巩固其在移动产品及异质性封装模组领域的技术优势。此次融资将进一步推动长晶科技在半导体元件领域的研发与市场拓展。该产品已于8月11日开售，零售价为4490万韩元，并将于下月初在美国发布。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU1548497426.USD":"安联环球人工智能AT Acc","LU2552382215.SGD":"WELLINGTON US BRAND POWER \"A\" (SGDHDG) ACC","LU2065171402.SGD":"M&G (LUX) GLOBAL MAXIMA \"A\" (SGD) INC","LU1116320737.USD":"BGF SYSTEMATIC GLOBAL ENHANCED EQUITY YIELD \"A6\" (USD) INC","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","IE00B4YYXB79.USD":"PIMCO BALANCED INCOME AND GROWTH \"E\" (USD) ACC","BK4585":"ETF&股票定投概念","LU0545039389.USD":"BGF GLOBAL EQUITY INCOME \"A2\" ACC","LU0055631609.USD":"贝莱德世界黄金基金A2","LU0011850046.USD":"贝莱德全球长线股票 A2 USD","LU1235294995.USD":"FIDELITY GLOBAL TECHNOLOGY \"A\" (USDHDG) ACC","R":"瑞德系统","LU2471134879.HKD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (HKD) INC","HK0000320223.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) ACC","LU0056508442.USD":"贝莱德世界科技基金A2","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0080751232.USD":"富达环球多元动力基金A","LU2065169927.USD":"M&G (LUX) GLOBAL MAXIMA \"A\" (USD) ACC","LU1935043023.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (USD) INC A","BK4532":"文艺复兴科技持仓","LU2168564065.EUR":"AZ ALLOCATION - TREND \"AAZ\" (EUR) ACC","LU0345769128.USD":"NINETY ONE GSF GLOBAL EQUITY \"A\" (USD) ACC","LU0096364046.USD":"CT (LUX) I AMERICAN \"DU\" (USD) ACC","LU2471134796.USD":"INVESCO GLOBAL EQUITY INCOME ADVANTAGE \"A\" (USD) INC","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","LU1935042215.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME  \"AA\" (USD) INC A","BK4226":"数据处理及外包服务","LU0943347566.SGD":"安联收益及增长平衡基金AM H2-SGD","LU0784385170.HKD":"BGF GLOBAL MULTI ASSET INCOME \"A6\" (HKDHGD) INC","BK4515":"5G概念","LU2430703095.HKD":"WELLINGTON MULTI-ASSET HIGH INCOME \"AM4\" (HKD) INC","MACW.SI":"APPLE 3xLongSG261006","G":"简伯特","LU0251132253.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) ACC","LU0314106906.USD":"MANULIFE GF GLOBAL EQUITY \"AA\" (USD) INC","IE0005OL40V9.USD":"JANUS HENDERSON BALANCED \"A6M\" (USD) INC","IE00BKVL7J92.USD":"Legg Mason ClearBridge - US Equity Sustainability Leaders A Acc USD","LU0203202063.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A2X\" (USD) ACC","LU2602419157.SGD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"AC\" (SGD) ACC","LU1496350171.SGD":"FRANKLIN DIVERSIFIED BALANCED \"A\" (SGDHDG) ACC","LU1066051225.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AC\" (USD) ACC","LU2236285917.USD":"ALLIANZ GLOBAL INCOME \"AMG\" (USD) INC","LU1066053197.SGD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM3\" (SGDHDG) INC","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","LU0476273544.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"BU\" (USD) ACC","LU0061474960.USD":"天利环球焦点基金AU Acc","B":"Barrick Mining Corporation","BK4554":"元宇宙及AR概念","LU1037948541.HKD":"AB LOW VOLATILITY EQUITY PORTFOLIO \"A\" (HKD) ACC"},"translate_title":"Xinbao | Xinde Semiconductor once again completed nearly 400 million yuan in financing, and is an advanced domestic packaging and testing developer","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"MACW.SI":0.6,"B":1,"R":1,"G":1},"content_text":"聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资，系国内先进封测研发商近日，江苏芯德半导体科技股份有限公司再次完成近4亿元融资，前段时间刚完成最新一轮总额近4亿元的融资，将进一步巩固其在移动产品及异质性封装模组领域的技术优势。本轮融资由南京市、区两级机构联合领投，江苏南京先进制造产业专项母基金、元禾璞华和雨山资本跟投。融资资金将主要用于进一步加速布局SiP（系统级封装）、FOWLP（扇出型晶圆级封装）、Chiplet 2.5D/3D及异质性封装模组等高端封测技术研发和生产，将进一步助力企业加速突破高端封装技术壁垒，为产业链自主可控注入强劲动能。（集微网）消息称国产GPU厂商天数智芯将在香港IPO，筹资3亿~4亿美元据报道，国产GPU厂商天数智芯正考虑在香港进行首次公开募股。据知情人士透露，由大钲资本支持的上海天数智芯半导体股份有限公司（天数智芯）正在与顾问就潜在的股票发行进行合作，此次发行可能募集3亿~4亿美元资金。知情人士表示，目前仍在初步讨论中，IPO规模等细节可能会有所调整。天数智芯生产对AI服务运行至关重要的图形处理器。（集微网）长晶科技完成亿元级战略轮融资近日，半导体元件研发商江苏长晶科技股份有限公司完成亿元级战略轮融资，本轮投资方为江苏省节能环保战新产业基金、蓝天投资。此次融资将进一步推动长晶科技在半导体元件领域的研发与市场拓展。长晶科技此前融资曾获中芯聚源、深创投、国家集成电路产业投资基金等知名机构加持。（集微网）中国科学院柔性侵入式脑机接口器件植入研究取得进展柔性神经电极凭借优异的生物相容性与机械匹配性，被学界认为是实现长期稳定采集神经信号的理想选择。相较于传统刚性电极，柔性探针能有效减少脑组织损伤、抑制炎症反应、延长在体寿命。然而，由于自身刚度较低，这类探针在缺乏额外支撑的情况下难以穿透脑组织。因此，植入难题成为制约柔性电极推广应用的关键瓶颈。（集微网）海外要闻印度首家AI独角兽Fractal启动IPO，计划筹资5.6亿美元印度人工智能（AI）和分析服务提供商Fractal Analytics在孟买申请首次公开募股，公司估值可能超过35亿美元。根据发布的上市文件，此次IPO募集资金可能达到约490亿卢比（约合5.6亿美元）。该公司计划发行价值127.9亿卢比的新股，而包括TPG Inc.、Apax Partners以及两位知名天使投资人在内的支持者则计划发行价值362.1亿卢比的股票。此次IPO的承销商为科塔克马辛德拉银行、摩根士丹利 、埃克斯资本和高盛集团。（集微网）苹果M5芯片推迟到2026年发布，将采用先进LMC封装技术苹果2026年的Mac产品线外观可能变化不大，但在内部，处理器的制造方式将有细微变化。这一变化将为未来几年性能的大幅提升和能效的提高奠定基础。行业分析师郭明𫓹表示，苹果高端MacBook Pro搭载的下一代M5芯片将采用新的LMC（液态环氧塑封料）封装，该材料由中国台湾的长兴材料独家供应。（集微网）三星电子推出全球首款Micro RGB电视8月12日，三星宣布，其115英寸Micro RGB电视在韩国正式上市。该产品已于8月11日开售，零售价为4490万韩元，并将于下月初在美国发布。该产品最显著的特点在于从根本上革新了电视的核心背光技术。传统电视采用单一白光光源，而这款Micro RGB电视则使用尺寸小于100微米（μm）的超精细红（R）、绿（G）、蓝（B）LED元素作为光源。通过对这三种颜色光源进行独立且精准的控制，电视能最大程度提升色彩纯度，并从源头消除色彩失真，从而呈现出极为丰富且精准的色彩效果。（集微网）本公众号所刊发稿件及图片来源于网络，仅用于交流使用，如有侵权请联系回复，我们收到信息后会在24小时内处理。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}