英飞凌宣布扩展GaN晶圆代工，台积电选择退出_老虎社区_美港股上老虎

英飞凌宣布扩展GaN晶圆代工，台积电选择退出

市场资讯2025-07-05

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！英飞凌（Infineon）宣布，随着市场对氮化镓（GaN）半导体的需求持续增长，决定利用好这一趋势，巩固其作为氮化镓市场领先集成器件制造商（IDM）的地位，将进军氮化镓300mm晶圆代工。英飞凌将于2025年第四季度向客户提供首批样品，从而进一步扩大客户群。英飞凌掌握了氮化镓300mm晶圆代工所有三种相关材料：硅（Si）、...

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英飞凌（Infineon）宣布，随着市场对氮化镓（GaN）半导体的需求持续增长，决定利用好这一趋势，巩固其作为氮化镓市场领先集成器件制造商（IDM）的地位，将进军氮化镓300mm晶圆代工。英飞凌将于2025年第四季度向客户提供首批样品，从而进一步扩大客户群。英飞凌掌握了氮化镓300mm晶圆代工所有三种相关材料：硅（Si）、...</p>\n\n<a href=\"https://finance.sina.com.cn/stock/t/2025-07-05/doc-infeksvu6861866.shtml\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2357125470.USD","symbol_name":"BNP PARIBAS ENERGY TRANSITION \"CLASSIC RH\" (USDHDG) 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英飞凌（Infineon）宣布，随着市场对氮化镓（GaN）半导体的需求持续增长，决定利用好这一趋势，巩固其作为氮化镓市场领先集成器件制造商（IDM）的地位，将进军氮化镓300mm晶圆代工。英飞凌将于2025年第四季度向客户提供首批样品，从而进一步扩大客户群。英飞凌掌握了氮化镓300mm晶圆代工所有三种相关材料：硅（Si）、碳化硅（SiC）和氮化镓。GaN半导体具有更高的功率密度、更快的开关速度和更低的功率损耗，可实现更小的设计，从而减少智能手机充电器、太阳能逆变器、工业和人形机器人等电子设备的能耗和热量产生。英飞凌是第一家在现有基础设施中成功开发氮化镓300mm晶圆技术的半导体制造商，与目前的200mm晶圆相比，300mm晶圆的生产技术更先进，效率也更高，因为更大的晶圆直径允许每片晶圆生产更多的芯片，可达到原来的2.3倍。另一方面，传闻台积电（TSMC）将退出GaN晶圆代工市场，位于中国台湾新竹的晶圆厂相产线将停止生产。台积电已经向DigiTimes证实了该消息，表示经过完整评估后，决定在未来两年内逐步退出GaN晶圆代工业务，这是基于市场和公司长期业务策略下的选择，正在与客户紧密合作，确保过渡期内顺利交接。据了解，部分厂商选择将订单转向力积电（PSMC）。\n\n\n海量资讯、精准解读，尽在新浪财经APP","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"-1","news_tag":"corporation","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}