先进封装关键材料PSPI供不应求，旭化成将断供部分客户_老虎社区_美港股上老虎

先进封装关键材料PSPI供不应求，旭化成将断供部分客户

芯智讯2025-05-28

5月27日消息，据台媒《经济日报》报道，半导体业界近日传闻日本化工巨头旭化成（Asahi KASEI）对客户发出通知，称因该公司产能无法跟上市场需求，将对部分客户断供先进封装关键耗材感光型聚酰亚胺（PSPI），业界忧心恐导致AI 断链危机一触即发。业界指出，目前没有任何材料能全面替代PSPI在所有先进封装制程中的性能，考察先进封装是AI芯片生产关键技术，若缺少PSPI导致先进封装产能供给受限，不仅...

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断链危机一触即发。业界指出，目前没有任何材料能全面替代PSPI在所有先进封装制程中的性能，考察先进封装是AI芯片生产关键技术，若缺少PSPI导致先进封装产能供给受限，不仅牵动台积电、日月光投控、群创等业者先进封装业务接单，进而冲击全球AI产业发展。目前，旭化成是全球PSPI数一数二关键供应商，以封装材料来说，旭化成和HD（杜邦与日立合资公司）居前两大，一旦供货不足，牵动整个半导体生态。据知情人士称，此次旭化成拟对部分客户断供其PIMEL系列感光材料供应，即PSPI相关产品，主要是因为AI高速发展，使得算力需求快速增长，对先进封装需求暴增，同步带动PSPI需求劲扬，该公司产能无法及时跟上市场需求。业界人士称，旭化成的PSPI材料，在半导体封装领域具有关键应用价值，并广获半导体指标厂采用，主要用于元件表面保护层、凸块钝化层及RDL绝缘层，在晶圆级封装（WLP）制程中，晶圆表面钝化层及RDL重布线层介质制造需依赖光敏绝缘材料，由于PSPI的独特优点在于兼具光敏特性与绝缘性能，可显著简化2P2M、4P4M等多层布线制程。随着AI热潮推升辉达AI芯片热销，英伟达所有先进高速运算（HPC）都要用到先进封装，尤其仰赖台积电的CoWoS技术，英伟达执行长黄仁勋上周来台参加台北国际电脑展（COMPUTEX）受访时直言，CoWoS是很先进的技术，目前除了CoWoS之外，“我们真的没有其他选择”，更确立CoWoS对辉达不可取代的地位。先进封装爆火，三星、英特尔、日月光投控、群创等大厂也积极抢进，进一步消耗PSPI产能。随着旭化成对部分客户断供，业界忧心AI断链危机一触即发。对于相关消息，台积电并未回应。业界分析认为，台积电是全球晶圆代工龙头，应会获得旭化成优先供货，研判对台积电影响不大。不过，对正积极强化先进封装能量日月光投控而言，旭化成PSPI供货不顺，可能会打乱原先集团布局规划。但日月光投控对此也不予回应。日月光投控内部规划，目标2025年CoWoS先进封装月产可达1万片，力拼今年相关业绩倍增至10亿美元以上。编辑：芯智讯-浪客剑  来源：《经济日报》","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"hasMoreComments":false,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}