Intel has a plan to go beyond 3nm chips_老虎社区_美港股上老虎

Intel has a plan to go beyond 3nm chips

engadget2021-08-05

Its moving past nanometers, in more than one way. Earlier this year, Intel announced they were planning toretake the CPU manufacturing leadand "unquestioned leadership" in the PC world. These were ...

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131

Roykhor77
·2021-08-06
Nice!
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1
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Alfred1007
·2021-08-05
As long as it get faster, it is good for us..
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1
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- Roykhor77:
  Nice!
  2021-08-06
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lexxselrahc
·2021-08-05
Looks promising in the long term. Hold.
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点赞
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74c5dd72
·2021-08-05
Pls like and share
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4
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sx2021
·2021-08-05
possible
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1
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- bshian:
  Ok
  2021-08-05
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Lauuu
·2021-08-05
Like and comment pls
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1
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- mchang05:
  [得意]
  2021-08-05
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Tchua
·2021-08-05
Long Intel on it fixing its manufacturing problems
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4
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- Tchua:
  Anyone too?
  2021-08-05
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- Tchua:
  Continue to be Strong
  2021-08-06
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- 60d48e1:
  agreed
  2021-08-06
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Okie_cheong
·2021-08-05
Intel come on!!! 👍🏻👍🏻👍🏻
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6
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Silverlitz
·2021-08-05
My bet is still on TSMC winning the semicon race, over Intel.
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6
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- Kukudosmin:
  Ok
  2021-08-05
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ivy888
·2021-08-05
Like
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3
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deadcow
·2021-08-05
ok
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4
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- ivy888:
  ok
  2021-08-05
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Troytan
·2021-08-05
Intel power, go go go
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7
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- deadcow:
  lihai
  2021-08-05
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Anonymous2
·2021-08-05
Like pls
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3
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Khoo12
·2021-08-05
Yes
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6
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- GacktEng:
  Comment snd like pls
  2021-08-05
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Holla
·2021-08-05
Like my comment pls
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5
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- Jefflim:
  O
  2021-08-05
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Thunderz
·2021-08-05
like pl
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2
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Lowger
·2021-08-05
woooooooooaw
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yanney90
·2021-08-05
Wow
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4
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- Lowger:
  woooooooaw
  2021-08-05
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Pennyboy
·2021-08-05
Like pl
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6
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- Lowger:
  woooooooooaw
  2021-08-05
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- Godchok:
  Oo
  2021-08-05
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These were ...</p>\n\n<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"09086","symbol_name":"华夏纳指-U","start_time":0,"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","article_id":"1119138550","we_media_id":null,"thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","pubTimestamp":1628157065,"columns":[],"sourceInfo":{"source_id":"lsy1628157128723","name":"Engadget"},"weMediaInfo":null,"summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","collect":0,"end_time":0,"defaultTopTitle":"engadget.com","property":[],"viewcount":null,"language":"en","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"translate_title":"英特尔有超越3nm芯片的计划","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9},"content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","kind":"news","is_publish_news":true,"is_publish_highlight":true,"is_publish_live":false,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[{"id":899562256,"gmtCreate":1628207030275,"gmtModify":1633752691788,"author":{"id":"3577415925422402","authorId":"3577415925422402","name":"Roykhor77","avatar":"https://static.tigerbbs.com/dceebb2c02d2b0c1df8a4c7c7ebba8d9","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3577415925422402","authorIdStr":"3577415925422402"},"htmlText":"Nice!","listText":"Nice!","text":"Nice!","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899562256","repostId":1119138550,"repostType":2,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899639769,"gmtCreate":1628176953751,"gmtModify":1633752880004,"author":{"id":"3570656625926041","authorId":"3570656625926041","name":"Alfred1007","avatar":"https://static.tigerbbs.com/81d8406380cbc0525927f00a9510f2fa","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3570656625926041","authorIdStr":"3570656625926041"},"htmlText":"As long as it get faster, it is good for us..","listText":"As long as it get faster, it is good for us..","text":"As long as it get faster, it is good for us..","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899639769","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5440522,"gmtCreate":1628207039724,"gmtModify":1635158999458,"authorId":3577415925422402,"author":{"id":3577415925422402,"idStr":"3577415925422402","authorId":3577415925422402,"name":"Roykhor77","avatar":"https://static.tigerbbs.com/dceebb2c02d2b0c1df8a4c7c7ebba8d9","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899639769,"type":1,"supId":0,"prevId":0,"content":"Nice!","text":"Nice!","html":"Nice!"}],"langContent":"EN"},{"id":899175365,"gmtCreate":1628171633857,"gmtModify":1633752960157,"author":{"id":"3578739448923997","authorId":"3578739448923997","name":"lexxselrahc","avatar":"https://static.tigerbbs.com/20a54ceed78bc452d36ac799295862ce","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3578739448923997","authorIdStr":"3578739448923997"},"htmlText":"Looks promising in the long term. Hold.&nbsp;","listText":"Looks promising in the long term. Hold.&nbsp;","text":"Looks promising in the long term. Hold.","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899175365","repostId":1119138550,"repostType":2,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899326056,"gmtCreate":1628162145975,"gmtModify":1631893785548,"author":{"id":"3581979721991802","authorId":"3581979721991802","name":"74c5dd72","avatar":"https://community-static.tradeup.com/news/default-avatar.jpg","vip":1,"crmLevel":2,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3581979721991802","authorIdStr":"3581979721991802"},"htmlText":"Pls like and share","listText":"Pls like and share","text":"Pls like and share","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":4,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899326056","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899328734,"gmtCreate":1628162135528,"gmtModify":1633753052631,"author":{"id":"4087888020031940","authorId":"4087888020031940","name":"sx2021","avatar":"https://static.laohu8.com/default-avatar.jpg","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"4087888020031940","authorIdStr":"4087888020031940"},"htmlText":"possible&nbsp;","listText":"possible&nbsp;","text":"possible","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899328734","repostId":1119138550,"repostType":2,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435865,"gmtCreate":1628162591817,"gmtModify":1635159390342,"authorId":3576896763784132,"author":{"id":3576896763784132,"idStr":"3576896763784132","authorId":3576896763784132,"name":"bshian","avatar":"https://static.tigerbbs.com/ea8813b91ae8bba6f3905bb49e6986be","vip":1,"currentWearingBadge":{"badgeId":"99a38ff64bfd44f891fd016771fc8f64-1","templateUuid":"99a38ff64bfd44f891fd016771fc8f64","name":"超级披露者","description":"在交易分享中开启超级披露","bigImgUrl":"https://static.tigerbbs.com/802f4014829adb4e63332fc230b97e42","smallImgUrl":"https://static.tigerbbs.com/70e97d213ed3e4f4820224f1366d402f","redirectLinkEnabled":1,"redirectLinkType":1,"redirectLink":"https://www.itigerup.com/activity/forapp/star-investor","redirectLinkValidityFrom":1776816000000,"redirectLinkValidityTo":2156198400000,"hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2026.04.23","individualDisplayEnabled":0,"individualDisplaySort":0,"categoryType":1104,"isScarce":1,"effectEnabled":0,"wearingSort":1},"crmLevel":12,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[{"categoryType":1104,"badgeId":"99a38ff64bfd44f891fd016771fc8f64-1","name":"超级披露者","description":"在交易分享中开启超级披露","smallImgUrl":"https://static.tigerbbs.com/70e97d213ed3e4f4820224f1366d402f","bigImgUrl":"https://static.tigerbbs.com/802f4014829adb4e63332fc230b97e42","isScarce":1,"plateColors":{"bgColor":{"dark":"#2f2a1f","tint":"#fcf6e5"},"fontColor":{"dark":"#dea95e","tint":"#885600"}},"effectEnabled":0,"redirectLinkEnabled":1,"redirectLinkType":1,"redirectLink":"https://www.itigerup.com/activity/forapp/star-investor","redirectLinkValidityFrom":1776816000000,"redirectLinkValidityTo":2156198400000,"sortingWeight":0,"wearable":1}]},"repliedAuthorId":0,"objectId":899328734,"type":1,"supId":0,"prevId":0,"content":"Ok","text":"Ok","html":"Ok"}],"langContent":"EN"},{"id":899365001,"gmtCreate":1628161536303,"gmtModify":1633753057388,"author":{"id":"3576024520094293","authorId":"3576024520094293","name":"Lauuu","avatar":"https://static.tigerbbs.com/02c1a1e93d0024ed67162afaf9bd827e","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3576024520094293","authorIdStr":"3576024520094293"},"htmlText":"Like and comment pls","listText":"Like and comment pls","text":"Like and comment pls","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899365001","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5436295,"gmtCreate":1628166412143,"gmtModify":1635159358366,"authorId":3577232364431505,"author":{"id":3577232364431505,"idStr":"3577232364431505","authorId":3577232364431505,"name":"mchang05","avatar":"https://static.tigerbbs.com/722052c3dcd628d887b92ad416984abf","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899365001,"type":1,"supId":0,"prevId":0,"content":"[得意]","text":"[得意]","html":"[得意]"}],"langContent":"EN"},{"id":899369802,"gmtCreate":1628161013706,"gmtModify":1631885479159,"author":{"id":"3561859229387101","authorId":"3561859229387101","name":"Tchua","avatar":"https://static.tigerbbs.com/245ba7d1360ad877e076f09e9d78c378","vip":1,"crmLevel":12,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3561859229387101","authorIdStr":"3561859229387101"},"htmlText":"Long Intel on it fixing its&nbsp;manufacturing problems","listText":"Long Intel on it fixing its&nbsp;manufacturing problems","text":"Long Intel on it fixing its manufacturing problems","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":4,"commentSize":3,"repostSize":0,"link":"https://laohu8.com/post/899369802","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5438505,"gmtCreate":1628178769508,"gmtModify":1635159186607,"authorId":3561859229387101,"author":{"id":3561859229387101,"idStr":"3561859229387101","authorId":3561859229387101,"name":"Tchua","avatar":"https://static.tigerbbs.com/245ba7d1360ad877e076f09e9d78c378","vip":1,"crmLevel":12,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899369802,"type":1,"supId":0,"prevId":0,"content":"Anyone too?","text":"Anyone too?","html":"Anyone too?"},{"id":5448501,"gmtCreate":1628261430147,"gmtModify":1635158358219,"authorId":3561859229387101,"author":{"id":3561859229387101,"idStr":"3561859229387101","authorId":3561859229387101,"name":"Tchua","avatar":"https://static.tigerbbs.com/245ba7d1360ad877e076f09e9d78c378","vip":1,"crmLevel":12,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899369802,"type":1,"supId":0,"prevId":0,"content":"Continue to be Strong","text":"Continue to be Strong","html":"Continue to be Strong"},{"id":5448618,"gmtCreate":1628262024582,"gmtModify":1635158350888,"authorId":3577963183517164,"author":{"id":3577963183517164,"idStr":"3577963183517164","authorId":3577963183517164,"name":"60d48e1","avatar":"https://static.laohu8.com/default-avatar.jpg","vip":1,"crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899369802,"type":1,"supId":0,"prevId":0,"content":"<u>agreed</u>","text":"<u>agreed</u>","html":"<u>agreed</u>"}],"langContent":"EN"},{"id":899360299,"gmtCreate":1628160931911,"gmtModify":1631885479163,"author":{"id":"3586231647181730","authorId":"3586231647181730","name":"Okie_cheong","avatar":"https://static.tigerbbs.com/58d32683390fe18e22d3aed1e3b8b4bb","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3586231647181730","authorIdStr":"3586231647181730"},"htmlText":"Intel come on!!! 👍🏻👍🏻👍🏻","listText":"Intel come on!!! 👍🏻👍🏻👍🏻","text":"Intel come on!!! 👍🏻👍🏻👍🏻","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":6,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899360299","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899382268,"gmtCreate":1628160560254,"gmtModify":1631893283154,"author":{"id":"3570362135363824","authorId":"3570362135363824","name":"Silverlitz","avatar":"https://static.tigerbbs.com/abc7af211be1f2d501fd1885af02f33e","vip":1,"crmLevel":12,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3570362135363824","authorIdStr":"3570362135363824"},"htmlText":"My bet is still on TSMC winning the semicon race, over Intel.","listText":"My bet is still on TSMC winning the semicon race, over Intel.","text":"My bet is still on TSMC winning the semicon race, over Intel.","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":6,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899382268","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435735,"gmtCreate":1628161420003,"gmtModify":1631893283152,"authorId":4087297462574060,"author":{"id":4087297462574060,"idStr":"4087297462574060","authorId":4087297462574060,"name":"Kukudosmin","avatar":"https://static.tigerbbs.com/fe82a55d4d107e643c3d79336bd97bb3","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899382268,"type":1,"supId":0,"prevId":0,"content":"Ok","text":"Ok","html":"Ok"}],"langContent":"EN"},{"id":899388275,"gmtCreate":1628160398997,"gmtModify":1633753066711,"author":{"id":"3579641974902127","authorId":"3579641974902127","name":"ivy888","avatar":"https://static.tigerbbs.com/10358949b7fc96b011ec29ca7fd9c9a4","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3579641974902127","authorIdStr":"3579641974902127"},"htmlText":"Like","listText":"Like","text":"Like","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":3,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899388275","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899381597,"gmtCreate":1628160342219,"gmtModify":1633753067302,"author":{"id":"3579085067033099","authorId":"3579085067033099","name":"deadcow","avatar":"https://static.tigerbbs.com/b73e551a33ab83c745d06a9d890b1f93","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3579085067033099","authorIdStr":"3579085067033099"},"htmlText":"ok","listText":"ok","text":"ok","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":4,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899381597","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435625,"gmtCreate":1628160412651,"gmtModify":1635159409173,"authorId":3579641974902127,"author":{"id":3579641974902127,"idStr":"3579641974902127","authorId":3579641974902127,"name":"ivy888","avatar":"https://static.tigerbbs.com/10358949b7fc96b011ec29ca7fd9c9a4","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899381597,"type":1,"supId":0,"prevId":0,"content":"<u>ok</u>","text":"<u>ok</u>","html":"<u>ok</u>"}],"langContent":"EN"},{"id":899337230,"gmtCreate":1628158761820,"gmtModify":1631885479166,"author":{"id":"3571482048865852","authorId":"3571482048865852","name":"Troytan","avatar":"https://static.laohu8.com/default-avatar.jpg","vip":1,"crmLevel":12,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3571482048865852","authorIdStr":"3571482048865852"},"htmlText":"Intel power, go go go","listText":"Intel power, go go go","text":"Intel power, go go go","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":7,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899337230","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435606,"gmtCreate":1628160271066,"gmtModify":1635159411013,"authorId":3579085067033099,"author":{"id":3579085067033099,"idStr":"3579085067033099","authorId":3579085067033099,"name":"deadcow","avatar":"https://static.tigerbbs.com/b73e551a33ab83c745d06a9d890b1f93","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899337230,"type":1,"supId":0,"prevId":0,"content":"liha<u><u>i</u></u>","text":"liha<u><u>i</u></u>","html":"liha<u><u>i</u></u>"}],"langContent":"EN"},{"id":899336332,"gmtCreate":1628158315526,"gmtModify":1633753077861,"author":{"id":"3560247957239615","authorId":"3560247957239615","name":"Anonymous2","avatar":"https://static.laohu8.com/default-avatar.jpg","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3560247957239615","authorIdStr":"3560247957239615"},"htmlText":"Like pls","listText":"Like pls","text":"Like pls","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":3,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899336332","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899333895,"gmtCreate":1628158164117,"gmtModify":1633753080212,"author":{"id":"3564738902623228","authorId":"3564738902623228","name":"Khoo12","avatar":"https://static.tigerbbs.com/a1637796379aeed1538616117eb09330","vip":1,"crmLevel":12,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3564738902623228","authorIdStr":"3564738902623228"},"htmlText":"Yes","listText":"Yes","text":"Yes","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":6,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899333895","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435425,"gmtCreate":1628158458742,"gmtModify":1635159425546,"authorId":3583823859758620,"author":{"id":3583823859758620,"idStr":"3583823859758620","authorId":3583823859758620,"name":"GacktEng","avatar":"https://static.tigerbbs.com/f46820dfef2abefa70609fe49af45714","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899333895,"type":1,"supId":5435411,"prevId":0,"content":"Comment snd like pls","text":"Comment snd like pls","html":"Comment snd like pls"}],"langContent":"EN"},{"id":899330294,"gmtCreate":1628157986918,"gmtModify":1633753081598,"author":{"id":"3565687171198207","authorId":"3565687171198207","name":"Holla","avatar":"https://static.tigerbbs.com/c0b0e402ff8043410cc67ffccbfe2174","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3565687171198207","authorIdStr":"3565687171198207"},"htmlText":"Like my comment pls&nbsp;","listText":"Like my comment pls&nbsp;","text":"Like my comment pls","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":5,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899330294","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435576,"gmtCreate":1628159874885,"gmtModify":1635159413628,"authorId":3578653033561627,"author":{"id":3578653033561627,"idStr":"3578653033561627","authorId":3578653033561627,"name":"Jefflim","avatar":"https://static.tigerbbs.com/4eae5cd25af3e0b464ed1c1e891bf602","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899330294,"type":1,"supId":0,"prevId":0,"content":"<u>O</u>","text":"<u>O</u>","html":"<u>O</u>"}],"langContent":"EN"},{"id":899397698,"gmtCreate":1628157912314,"gmtModify":1633753082293,"author":{"id":"3574244130180526","authorId":"3574244130180526","name":"Thunderz","avatar":"https://static.tigerbbs.com/acab5d654638ab77357135a5d4266cb2","vip":1,"crmLevel":12,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3574244130180526","authorIdStr":"3574244130180526"},"htmlText":"like pl","listText":"like pl","text":"like pl","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":2,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899397698","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899397939,"gmtCreate":1628157885621,"gmtModify":1633753082617,"author":{"id":"3582886929910429","authorId":"3582886929910429","name":"Lowger","avatar":"https://static.tigerbbs.com/2787202ad1607a43e761beb8e8d1e26c","vip":1,"crmLevel":11,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3582886929910429","authorIdStr":"3582886929910429"},"htmlText":"woooooooooaw","listText":"woooooooooaw","text":"woooooooooaw","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/899397939","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"},{"id":899394418,"gmtCreate":1628157849234,"gmtModify":1631884731647,"author":{"id":"3579429547537340","authorId":"3579429547537340","name":"yanney90","avatar":"https://static.tigerbbs.com/ca08ef843cbc4228ad46f8d977734499","vip":1,"crmLevel":13,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3579429547537340","authorIdStr":"3579429547537340"},"htmlText":"Wow","listText":"Wow","text":"Wow","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":4,"commentSize":1,"repostSize":0,"link":"https://laohu8.com/post/899394418","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435351,"gmtCreate":1628157918378,"gmtModify":1631884731649,"authorId":3582886929910429,"author":{"id":3582886929910429,"idStr":"3582886929910429","authorId":3582886929910429,"name":"Lowger","avatar":"https://static.tigerbbs.com/2787202ad1607a43e761beb8e8d1e26c","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899394418,"type":1,"supId":0,"prevId":0,"content":"woooooooaw","text":"woooooooaw","html":"woooooooaw"}],"langContent":"EN"},{"id":899395451,"gmtCreate":1628157728773,"gmtModify":1633753083333,"author":{"id":"3560509961275440","authorId":"3560509961275440","name":"Pennyboy","avatar":"https://static.tigerbbs.com/125fbddbd3a10f60b565cf59f44d4ac8","vip":1,"crmLevel":12,"crmLevelSwitch":0,"wearingBadges":[],"idStr":"3560509961275440","authorIdStr":"3560509961275440"},"htmlText":"Like pl","listText":"Like pl","text":"Like pl","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":6,"commentSize":2,"repostSize":0,"link":"https://laohu8.com/post/899395451","repostId":1119138550,"repostType":4,"repost":{"id":"1119138550","kind":"news","pubTimestamp":1628157065,"share":"https://www.laohunote.com/m/news/1119138550?lang=zh_CN&edition=full","pubTime":"2021-08-05 17:51","market":"us","language":"en","title":"Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>","url":"https://stock-news.laohu8.com/highlight/detail?id=1119138550","media":"engadget","summary":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were plan","content":"<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>","source":"lsy1628157128723","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Intel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote></title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nIntel has a plan to go beyond 3nm chips<blockquote>英特尔计划超越 3nm 芯片</blockquote>\n</h2>\n<h4 class=\"meta\">\n<p class=\"head\">\n<strong class=\"h-name small\">engadget</strong><span class=\"h-time small\">2021-08-05 17:51</span>\n</p>\n</h4>\n</header>\n<article>\n<p>  Its moving past nanometers, in more than <a href=\"https://laohu8.com/S/AONE.U\">one</a> way.  Earlier this year, <a href=\"https://laohu8.com/S/INTC\">Intel</a> announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.</p><p><blockquote>它超越纳米，超过<a href=\"https://laohu8.com/S/AONE.U\">一</a>方式。今年早些时候，<a href=\"https://laohu8.com/S/INTC\">英特尔</a>宣布他们计划夺取CPU制造的领先地位，并在个人电脑领域取得“无可争议的领导地位”。这些都是令人印象深刻的目标，但缺少的是他们如何实际实现这些目标的任何感觉。现在，我们终于知道了英特尔的计划。</blockquote></p><p> Intel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.</p><p><blockquote>英特尔首席执行官帕特·基辛格和技术开发高级副总裁安·凯莱赫博士阐述了公司的未来计划。首先，英特尔正在重新命名其制造节点。曾经的 10 纳米“增强型超鳍”现在只有“7”。这可能感觉有点口是心非——“只要挥动魔杖，你就有更好的技术!”——但公平地说，制程节点的纳米测量已经不再与任何物理测量相对应，就密度而言，英特尔目前的 10 纳米芯片与台积电和三星的 7 纳米芯片具有竞争力。</blockquote></p><p> Looking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's <a href=\"https://laohu8.com/S/DDD\">3D</a> stacked-chip technology, Foveros.</p><p><blockquote>除了 7nm 之外，英特尔的目标是积极的发布计划，每年都会进行重大产品更新。我们预计他们将在今年秋天推出 Alder Lake 芯片，该芯片将混合高功率和低功耗内核，随后是现在的 4nm Meteor Lake 芯片，该芯片将采用“瓷砖”（chiplet）设计，并采用英特尔的<a href=\"https://laohu8.com/S/DDD\">三维</a>堆叠芯片技术，Foveros。</blockquote></p><p> Beyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.</p><p><blockquote>除此之外，英特尔还为基于 EUV 的 3nm 节点规划了技术，该节点将使用高能制造工艺来简化芯片制造，并为埃节点规划了“20A”技术。这是一米的百亿分之一（意味着它是 2 纳米），随后将是 18A 节点，英特尔希望在 2025 年开始生产，用于本世纪下半叶的产品。同样，虽然节点测量不再真正对应于物理结构，但硅原子的宽度为2埃，因此这些晶体管非常小。</blockquote></p><p> This release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.</p><p><blockquote>这个发布时间表似乎很激进，英特尔也没有实现新节点目标的最佳记录，但如果它甚至能接近这些目标，预计您的笔记本电脑和台式机将在未来几年获得巨大的性能提升。</blockquote></p><p></p>\n<div class=\"bt-text\">\n\n\n<p> 来源：<a href=\"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html\">engadget</a></p>\n<p>为提升您的阅读体验，我们对本页面进行了排版优化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"09086":"华夏纳指-U","03086":"华夏纳指","INTC":"英特尔"},"source_url":"https://www.engadget.com/intel-laid-out-an-aggressive-plan-to-build-angstrom-scale-transistors-within-the-next-five-years-180020485.html","is_english":true,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"1119138550","content_text":"Its moving past nanometers, in more than one way.\n\nEarlier this year, Intel announced they were planning toretake the CPU manufacturing leadand \"unquestioned leadership\" in the PC world. These were impressive goals, but what was missing was any sense of how they'd actually achieve them. Now, we finally know Intel's plan.\nIntel's CEO Pat Gelsinger and SVP of Technology Development Dr. Ann Kelleher,laid out the company's plan for the future.For starters, Intel is renaming its manufacturing nodes. What used to be 10nm \"Enhanced Superfin\" is now just \"7.\" This may feel a little duplicitous — \"just wave a wand a you've got better technology!\" — but to be fair to intel, the nanometer measurements of process nodes don't really correspond to anything physical any more, and in terms of density Intel's current 10nm chips are competitive with TSMC and Samsung's 7nm.\nLooking beyond 7nm, Intel is targeting an aggressive release schedule with major product updates happening annually. We're expecting their Alder Lake chips this fall, which will mix high and low-powered cores, followed by now-4nm Meteor Lake chips that will move to a \"tile\" (chiplet) design, and incorporate Intel's 3D stacked-chip technology, Foveros.\nBeyond that, Intel has technology mapped out for an EUV-based 3nm node that will use the high-energy manufacturing process to streamline chip creation, and a \"20A\" for angstrom node. This is one ten-billionth of a meter (meaning it's 2nm), and will be followed by a 18A node that Intel hopes to start moving into production in 2025 for products sometime in the 2nd half of the decade. Again, while node measurements don't really correspond to physical structures any more, a silicon atom is in the area of 2 angstroms wide, so these are seriously tiny transistors.\nThis release schedule seems aggressive, and Intel does not have the best track record of meeting targets for new nodes, but if it can even come close to these goals, expect your laptops and desktops to get a huge performance boost in the next few years.","news_type":1,"symbols_score_info":{"09086":0.9,"INTC":0.9,"03086":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":5435354,"gmtCreate":1628157925591,"gmtModify":1631896293378,"authorId":3582886929910429,"author":{"id":3582886929910429,"idStr":"3582886929910429","authorId":3582886929910429,"name":"Lowger","avatar":"https://static.tigerbbs.com/2787202ad1607a43e761beb8e8d1e26c","vip":1,"crmLevel":11,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899395451,"type":1,"supId":5435343,"prevId":0,"content":"woooooooooaw","text":"woooooooooaw","html":"woooooooooaw"},{"id":5435343,"gmtCreate":1628157847853,"gmtModify":1631896293369,"authorId":3569413860916910,"author":{"id":3569413860916910,"idStr":"3569413860916910","authorId":3569413860916910,"name":"Godchok","avatar":"https://static.tigerbbs.com/612b599840527576c9e54717db23827a","vip":1,"crmLevel":12,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[]},"repliedAuthorId":0,"objectId":899395451,"type":1,"supId":0,"prevId":0,"content":"Oo","text":"Oo","html":"Oo"}],"langContent":"EN"}],"hasMoreComments":true,"newsSizeData":{"likeSize":131,"commentSize":25,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"isCrawlerRequest":true}