688249 晶合集成
交易中 08-03 13:57:21
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晶合集成获GIC Private Limited增持71.25万股 每股作价约30.12港元
新浪港股 · 08:13
晶合集成获GIC Private Limited增持71.25万股 每股作价约30.12港元
晶合集成获得发明专利授权：“一种半导体结构及其制备方法”
证券之星 · 07-29
晶合集成获得发明专利授权：“一种半导体结构及其制备方法”
晶合集成获得实用新型专利授权：“一种对准标识、半导体器件和掩膜版”
证券之星 · 07-28
晶合集成获得实用新型专利授权：“一种对准标识、半导体器件和掩膜版”
晶合集成获得发明专利授权：“半导体测试结构及方法”
证券之星 · 07-26
晶合集成获得发明专利授权：“半导体测试结构及方法”
晶合集成获得发明专利授权：“LDMOS器件的阈值电压的APC方法、系统、介质及产品”
证券之星 · 07-25
晶合集成获得发明专利授权：“LDMOS器件的阈值电压的APC方法、系统、介质及产品”
华勤技术（603296）披露全资子公司收购晶合集成H股事项，7月24日股价下跌0.78%
证券之星 · 07-24
华勤技术（603296）披露全资子公司收购晶合集成H股事项，7月24日股价下跌0.78%
华勤技术(03296)斥资9089.98万港元收购合共265.57万股晶合集成H股
智通财经 · 07-24
华勤技术(03296)斥资9089.98万港元收购合共265.57万股晶合集成H股
晶合集成：股东华勤通讯增持2289万股H股 占总股本1.03%
财中社 · 07-24
晶合集成：股东华勤通讯增持2289万股H股 占总股本1.03%
部分半导体股午后上扬 澜起科技(06809)上涨7.06% AI算力需求带动产业链迎来情绪修复
金吾财讯 · 07-24
部分半导体股午后上扬 澜起科技(06809)上涨7.06% AI算力需求带动产业链迎来情绪修复
华勤技术（603296）披露收购晶合集成H股进展，7月23日股价上涨1.38%
证券之星 · 07-23
华勤技术（603296）披露收购晶合集成H股进展，7月23日股价上涨1.38%
华勤技术：华勤通讯斥资6577万港元收购晶合集成200万股H股
财中社 · 07-23
华勤技术：华勤通讯斥资6577万港元收购晶合集成200万股H股
7月23日晶合集成跌6.35%，兴全合润混合C基金重仓该股
证券之星 · 07-23
7月23日晶合集成跌6.35%，兴全合润混合C基金重仓该股
华勤技术旗下子公司于7月22日收购晶合集成450万股H股
投资观察 · 07-22
华勤技术旗下子公司于7月22日收购晶合集成450万股H股
华勤技术（603296）披露收购晶合集成H股事项，7月22日股价上涨10.0%
证券之星 · 07-22
华勤技术（603296）披露收购晶合集成H股事项，7月22日股价上涨10.0%
华勤通讯香港有限公司增持晶合集成(02249)311.59万股 每股作价29.9182港元
智通财经 · 07-22
华勤通讯香港有限公司增持晶合集成(02249)311.59万股 每股作价29.9182港元
华勤技术斥资1.44亿港元购买晶合集成445万股H股
财中社 · 07-22
华勤技术斥资1.44亿港元购买晶合集成445万股H股
晶合集成获得实用新型专利授权：“一种扣环、研磨头及研磨设备”
证券之星 · 07-22
晶合集成获得实用新型专利授权：“一种扣环、研磨头及研磨设备”
7月21日晶合集成涨14.75%，兴全合润混合C基金重仓该股
证券之星 · 07-21
7月21日晶合集成涨14.75%，兴全合润混合C基金重仓该股
港股异动 | 芯片股全线反弹 传台积电拟上调成熟制程报价 Capex上调再次确认AI景气度
智通财经 · 07-21
港股异动 | 芯片股全线反弹 传台积电拟上调成熟制程报价 Capex上调再次确认AI景气度
晶合集成获得实用新型专利授权：“光阻扳手”
证券之星 · 07-21
晶合集成获得实用新型专利授权：“光阻扳手”
公司概况
公司名称：
合肥晶合集成电路股份有限公司
所属行业：
计算机、通信和其他电子设备制造业
上市日期：
2023-05-05
主营业务：
合肥晶合集成电路股份有限公司的主营业务是12英寸晶圆代工业务及其配套服务。公司的主要产品是DDIC、CIS、PMIC、Logic、MCU。报告期内公司新增发明专利317项、实用新型专利99项、软件著作权7项，截至报告期末公司累计获得专利1,374个。
发行价格：
19.86
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Limited增持晶合集成（02249）71.25万股，每股作价30.1181港元，总金额约为2145.91万港元。增持后最新持股数目约为1146.38万股，持股比例为5.30%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/hkstock/ggscyd/2026-08-03/doc-inikytnr4749837.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["02249","EWH","688249","BK0214","BK4104","BK1163","GIC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2655824028","title":"晶合集成获得发明专利授权：“一种半导体结构及其制备方法”","url":"https://stock-news.laohu8.com/highlight/detail?id=2655824028","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2655824028?lang=zh_cn&edition=full","pubTime":"2026-07-29 03:32","pubTimestamp":1785267163,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项发明专利授权，专利名为“一种半导体结构及其制备方法”，专利申请号为CN202610407639.4，授权日为2026年7月28日。今年以来晶合集成新获得专利授权325个，较去年同期增加了43.17%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072900003180.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","159582","02249","BK1163","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2654713047","title":"晶合集成获得实用新型专利授权：“一种对准标识、半导体器件和掩膜版”","url":"https://stock-news.laohu8.com/highlight/detail?id=2654713047","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2654713047?lang=zh_cn&edition=full","pubTime":"2026-07-28 03:32","pubTimestamp":1785180756,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项实用新型专利授权，专利名为“一种对准标识、半导体器件和掩膜版”，专利申请号为CN202522014052.0，授权日为2026年7月28日。今年以来晶合集成新获得专利授权317个，较去年同期增加了39.65%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072800002525.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","BK1163","688249","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2654005080","title":"晶合集成获得发明专利授权：“半导体测试结构及方法”","url":"https://stock-news.laohu8.com/highlight/detail?id=2654005080","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2654005080?lang=zh_cn&edition=full","pubTime":"2026-07-26 03:23","pubTimestamp":1785007391,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项发明专利授权，专利名为“半导体测试结构及方法”，专利申请号为CN202610425182.X，授权日为2026年7月24日。今年以来晶合集成新获得专利授权315个，较去年同期增加了38.77%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072600001151.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["688249","BK1163","159582","02249","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2654032863","title":"晶合集成获得发明专利授权：“LDMOS器件的阈值电压的APC方法、系统、介质及产品”","url":"https://stock-news.laohu8.com/highlight/detail?id=2654032863","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2654032863?lang=zh_cn&edition=full","pubTime":"2026-07-25 03:43","pubTimestamp":1784922205,"startTime":"0","endTime":"0","summary":"证券之星消息，根据天眼查APP数据显示晶合集成新获得一项发明专利授权，专利名为“LDMOS器件的阈值电压的APC方法、系统、介质及产品”，专利申请号为CN202610667846.3，授权日为2026年7月24日。本申请可用于精确、及时地调控LDMOS器件的阈值电压。今年以来晶合集成新获得专利授权314个，较去年同期增加了38.33%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072500003764.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","BK1163","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653388170","title":"华勤技术（603296）披露全资子公司收购晶合集成H股事项，7月24日股价下跌0.78%","url":"https://stock-news.laohu8.com/highlight/detail?id=2653388170","media":"证券之星","labels":["merge"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653388170?lang=zh_cn&edition=full","pubTime":"2026-07-24 22:08","pubTimestamp":1784902089,"startTime":"0","endTime":"0","summary":"截至2026年7月24日收盘，华勤技术报收于88.19元，较前一交易日下跌0.78%，最新总市值为1337.14亿元。该股当日开盘86.8元，最高91.88元，最低86.01元，成交额达37.76亿元，换手率为5.31%。近日，华勤技术发布H股公告，披露全资子公司华勤通讯通过联交所场内交易收购晶合集成2,655,700股H股，占晶合集成已发行股本约0.12%，总代价约90,899,831港元，每股均价约34.23港元。该交易已合并此前12个月内多项收购计算，构成须予披露交易，获豁免股东批准。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072400041636.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"merge","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","688249","BK1163","LU2328871848.SGD","603296","02249","03296","LU1969619763.USD","BK1193"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653846920","title":"华勤技术(03296)斥资9089.98万港元收购合共265.57万股晶合集成H股","url":"https://stock-news.laohu8.com/highlight/detail?id=2653846920","media":"智通财经","labels":["shareholding","merge"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653846920?lang=zh_cn&edition=full","pubTime":"2026-07-24 20:02","pubTimestamp":1784894521,"startTime":"0","endTime":"0","summary":"智通财经APP讯，华勤技术(03296)发布公告，于2026年7月24日，公司全资子公司华勤通讯透过于2026年7月24日在联交所进行的场内交易，收购合共265.57万股晶合集成H股(占晶合集成于本公告日期已发行股本总额约0.12%)，总代价约为9089.98万港元(不包括交易成本)，相当于每股目标股份的均价约为34.23港元。于收购事项完成后及于本公告日期，集团持有晶合集成已发行股本总额约11.03%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1472139.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding,merge","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["LU2328871848.SGD","03296","BK1193","02249","603296","BK1163","BK0214","688249","LU1969619763.USD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653893520","title":"晶合集成：股东华勤通讯增持2289万股H股 占总股本1.03%","url":"https://stock-news.laohu8.com/highlight/detail?id=2653893520","media":"财中社","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653893520?lang=zh_cn&edition=full","pubTime":"2026-07-24 18:44","pubTimestamp":1784889840,"startTime":"0","endTime":"0","summary":"晶合集成（688249）发布公告，公司股东华勤通讯香港有限公司于2026年7月16日至7月24日通过香港联合交易所以集中竞价方式累计增持公司H股股份2289万股，占公司总股本的1.03%。此次权益变动后，华勤技术股份有限公司（603296/03296）、合肥勤合电子科技有限公司及华勤通讯香港有限公司合计持有公司股份数量增至2.45亿股，合计持股比例增至11.03%。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202607243820617385.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202607243820617385.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02249","BK0214","688249","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653709388","title":"部分半导体股午后上扬 澜起科技(06809)上涨7.06% AI算力需求带动产业链迎来情绪修复","url":"https://stock-news.laohu8.com/highlight/detail?id=2653709388","media":"金吾财讯","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653709388?lang=zh_cn&edition=full","pubTime":"2026-07-24 13:45","pubTimestamp":1784871917,"startTime":"0","endTime":"0","summary":"金吾财讯 | 部分半导体股午后走强，澜起科技 上涨7.06%、天数智芯上涨4.04%、晶合集成上涨3.61%、晶门半导体上涨3.57%、中芯国际上涨2.19%、兆易创新上涨1.88%、华虹宏力上涨1.67%。大同证券表示，当前市场处于多重因素交织的复杂博弈阶段。","market":"fut","thumbnail":"https://static.szfiu.com/news/20241108/YjNiOTNjODIxNjM4MTUzMTI5MQ==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20241108/YjNiOTNjODIxNjM4MTUzMTI5MQ==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1986697","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["LU1023057109.AUD","LU1960683339.HKD","688249","LU0501845795.SGD","BK1614","LU0708995583.HKD","06809","LU0880133367.SGD","IE0034224299.USD","688008","688347","02878","LU1813983027.USD","BK1610","LU1807302812.USD","LU0320764599.SGD","LU1152091168.USD","BK1589","LU2039709279.SGD","03986","LU0072913022.USD","BK1163","688981","BK1526","LU1008478684.HKD","LU1993786604.SGD","02249","00981","LU0359201612.USD","LU0359202008.SGD","LU0052750758.USD","SG9999006597.SGD","TCHI","LU0359201885.HKD","LU1152091754.HKD","LU1328277881.USD","603986","01347","09903","LU0314109678.HKD","LU0067412154.USD","BK1607"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653725028","title":"华勤技术（603296）披露收购晶合集成H股进展，7月23日股价上涨1.38%","url":"https://stock-news.laohu8.com/highlight/detail?id=2653725028","media":"证券之星","labels":["merge"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653725028?lang=zh_cn&edition=full","pubTime":"2026-07-23 22:03","pubTimestamp":1784815399,"startTime":"0","endTime":"0","summary":"截至2026年7月23日收盘，华勤技术报收于88.88元，较前一交易日上涨1.38%，最新总市值为1347.6亿元。近日，华勤技术发布H股公告，披露有关在市场上收购晶合集成H股之须予披露交易。公告显示，于2026年7月23日，华勤技术全资子公司华勤通讯通过联交所场内交易收购晶合集成1,996,000股H股，占其已发行股本约0.09%，总代价约65,771,793港元，每股均价约32.95港元。该交易已合并此前12个月内多项收购计算，构成须予披露交易，获豁免股东批准。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026072300047774.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"merge","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["03296","BK0214","LU1969619763.USD","LU2328871848.SGD","02249","688249","603296","BK1193","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653428997","title":"华勤技术：华勤通讯斥资6577万港元收购晶合集成200万股H股","url":"https://stock-news.laohu8.com/highlight/detail?id=2653428997","media":"财中社","labels":["merge"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653428997?lang=zh_cn&edition=full","pubTime":"2026-07-23 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19:14","pubTimestamp":1784718840,"startTime":"0","endTime":"0","summary":"7月22日，华勤技术（603296/03296）发布公告，全资子公司华勤通讯通过联交所购买合计445万股晶合集成（688249/02249）H股，约占晶合集成股本总额的0.20%，交易金额约为1.44亿港元。本次交易完成后，公司持有晶合集成约10.82%股份。公司表示，购买晶合集成股份是基于对其未来发展前景的信心及长期投资价值的认可。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202607223817454966.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202607223817454966.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02249","LU2328871848.SGD","688249","BK1193","03296","LU1969619763.USD","BK0214","603296","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2653786344","title":"晶合集成获得实用新型专利授权：“一种扣环、研磨头及研磨设备”","url":"https://stock-news.laohu8.com/highlight/detail?id=2653786344","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2653786344?lang=zh_cn&edition=full","pubTime":"2026-07-22 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