量产计划顺利进行 Intel：18A工艺缺陷密度创下新低！

快科技2025-10-10

快科技10月10日消息，Intel在Tech Tour活动中透露了其18A工艺的最新进展，Intel表示18A工艺的缺陷密度已降至历史最低水平，这意味着该工艺已准备好进入大规模量产阶段。缺陷密度是衡量芯片制造工艺成熟度的关键指标之一，它指的是芯片晶圆单位面积上的缺陷数量，较高的缺陷密度可能导致芯片功能异常，影响晶体管、互连和通孔的正常工作。而对于像18A这样旨在支持大规模芯片封装的工艺来说，低缺陷...

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咸鱼突刺
2025-10-10
咸鱼突刺
都以为因特尔不行了，结果还能搞出2nm……

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href=\"https://laohu8.com/S/TSM\">台积电</a>的N2或三星的SF2展开竞争。</p><img src=\"https://e.thsi.cn/img/b692d9928f1417a0\"/></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>量产计划顺利进行 Intel：18A工艺缺陷密度创下新低！</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ 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}\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n量产计划顺利进行 Intel：18A工艺缺陷密度创下新低！\n</h2>\n\n<h4 class=\"meta\">\n\n\n2025-10-10 12:03 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010130827a6b29a70&s=b><strong>快科技</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>快科技10月10日消息，Intel在Tech Tour活动中透露了其18A工艺的最新进展，Intel表示18A工艺的缺陷密度已降至历史最低水平，这意味着该工艺已准备好进入大规模量产阶段。缺陷密度是衡量芯片制造工艺成熟度的关键指标之一，它指的是芯片晶圆单位面积上的缺陷数量，较高的缺陷密度可能导致芯片功能异常，影响晶体管、互连和通孔的正常工作。而对于像18A这样旨在支持大规模芯片封装的工艺来说，低缺陷...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010130827a6b29a70&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","INTC":"英特尔","BK4554":"元宇宙及AR概念","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","BK4512":"苹果概念","BK4527":"明星科技股","BK4543":"AI","BK4585":"ETF&股票定投概念","BK4534":"瑞士信贷持仓","BK4141":"半导体产品","BK4533":"AQR资本管理(全球第二大对冲基金)","BK4529":"IDC概念","BK4602":"量子计算概念","BK4575":"芯片概念","LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","BK4535":"淡马锡持仓","BK4612":"AI芯片","BK4515":"5G概念","BK4579":"人工智能","BK4550":"红杉资本持仓","BK4588":"碎股","BK4605":"半导体精选"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010130827a6b29a70&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2574836149","content_text":"快科技10月10日消息，Intel在Tech Tour活动中透露了其18A工艺的最新进展，Intel表示18A工艺的缺陷密度已降至历史最低水平，这意味着该工艺已准备好进入大规模量产阶段。缺陷密度是衡量芯片制造工艺成熟度的关键指标之一，它指的是芯片晶圆单位面积上的缺陷数量，较高的缺陷密度可能导致芯片功能异常，影响晶体管、互连和通孔的正常工作。而对于像18A这样旨在支持大规模芯片封装的工艺来说，低缺陷密度是确保高产量和大规模生产的必要条件。据Intel在ITT主题演讲中披露，18A工艺的缺陷密度已降至历史最低水平，量产计划已按计划进行，预计在2025年第四季度。此外低缺陷密度不仅意味着更高的产量，还为Intel提供了更大的芯片设计灵活性，使其能够满足HPC等市场的需求。虽然缺陷密度并不能反映18A工艺的全部情况，但它是一个重要的指标，这表明该工艺有望在大规模生产中实现高产量和高性能。这一不仅为Intel在芯片制造领域的竞争力提供了有力支持，还使其能够与其他先进工艺，如台积电的N2或三星的SF2展开竞争。","news_type":1,"symbols_score_info":{"INTC":1.5}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"CN"}],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":1,"repostSize":1,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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