AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应

芯界研习社2024-12-28

AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。...

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精彩评论

Alex_0099
2024-12-31
Alex_0099
真的干掉CUDA，AMD十倍起步
付鹏的小迷弟
2024-12-30
付鹏的小迷弟
能承认自己的不错就成功了一半。加油，继续保持仓位挺你。
悟空的花果山
2024-12-30
悟空的花果山
苏姐的魅力，承认问题并知道改善就好，加仓
- 马虎恶魔号:
  苏妈苏妈苏妈
- MichaelJacky:
  越是常识，越是事实。跟进

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{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2494156213?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2024-12-28 19:00","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2494156213","market":"us","top_or_hot":-1,"title":"AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应","media":"芯界研习社","content":"<div>\n<p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-12-28 19:00 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b><strong>芯界研习社</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"IE0009356076.USD","symbol_name":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b","article_id":"2494156213","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2494156213","pubTimestamp":1735383642,"columns":[{"name":"产品发布","id":31,"label_key":"productRelease"}],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","BK4573":"虚拟现实","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","GFS":"GLOBALFOUNDRIES Inc.","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","BK4512":"苹果概念","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","AMD":"美国超微公司","BK4585":"ETF&股票定投概念","BK4141":"半导体产品","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","BK4529":"IDC概念","BK4566":"资本集团","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","NVDA":"英伟达","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","BK4575":"芯片概念","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1880398471.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) INC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","BK4588":"碎股","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0082616367.USD":"摩根大通美国科技A（dist）"},"translate_title":"AMD MI300X AI chip has software flaws, CEO Su Zifeng responds","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1,"GFS":1,"NVDA":0.9},"content_text":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。即便在硬件规格上优于竞争对手，如英伟达的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。内容来源于电子工程专辑","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[{"id":387430377111832,"gmtCreate":1735618072113,"gmtModify":1735622023880,"author":{"id":"3535535770162265","authorId":"3535535770162265","name":"Alex_0099","avatar":"https://static.tigerbbs.com/5f1a58594ee71017c239db9e4dfea780","vip":1,"crmLevel":1,"crmLevelSwitch":0,"authorIdStr":"3535535770162265","idStr":"3535535770162265"},"htmlText":"真的干掉CUDA，AMD十倍起步","listText":"真的干掉CUDA，AMD十倍起步","text":"真的干掉CUDA，AMD十倍起步","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/387430377111832","repostId":2494156213,"repostType":2,"repost":{"id":"2494156213","kind":"news","pubTimestamp":1735383642,"share":"https://www.laohu8.com/m/news/2494156213?lang=zh_CN&edition=full","pubTime":"2024-12-28 19:00","market":"us","language":"zh","title":"AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应","url":"https://stock-news.laohu8.com/highlight/detail?id=2494156213","media":"芯界研习社","summary":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。","content":"<html><body><article><p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20241228190247406v206bmvskxoayyv\"/><p>SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。</p><p>在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。</p><p>即便在硬件规格上优于竞争对手，如<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。</p><p>SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。</p><p>MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。</p><p>SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。</p><p>SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。</p><p>对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。</p><p>苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。</p><p>苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。</p><p>尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。</p><p>内容来源于电子工程专辑</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-12-28 19:00 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b><strong>芯界研习社</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","BK4573":"虚拟现实","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","GFS":"GLOBALFOUNDRIES Inc.","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","BK4512":"苹果概念","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","AMD":"美国超微公司","BK4585":"ETF&股票定投概念","BK4141":"半导体产品","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","BK4529":"IDC概念","BK4566":"资本集团","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","NVDA":"英伟达","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","BK4575":"芯片概念","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1880398471.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) INC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","BK4588":"碎股","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0082616367.USD":"摩根大通美国科技A（dist）"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2494156213","content_text":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。即便在硬件规格上优于竞争对手，如英伟达的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。内容来源于电子工程专辑","news_type":1,"symbols_score_info":{"AMD":1,"GFS":1,"NVDA":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"CN"},{"id":387191048020168,"gmtCreate":1735559640426,"gmtModify":1735563302889,"author":{"id":"4192875789494972","authorId":"4192875789494972","name":"付鹏的小迷弟","avatar":"https://community-static.tradeup.com/news/default-avatar.jpg","vip":1,"crmLevel":2,"crmLevelSwitch":0,"authorIdStr":"4192875789494972","idStr":"4192875789494972"},"htmlText":"能承认自己的不错就成功了一半。加油，继续保持仓位挺你。","listText":"能承认自己的不错就成功了一半。加油，继续保持仓位挺你。","text":"能承认自己的不错就成功了一半。加油，继续保持仓位挺你。","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":2,"commentSize":0,"repostSize":0,"link":"https://laohu8.com/post/387191048020168","repostId":2494156213,"repostType":2,"repost":{"id":"2494156213","kind":"news","pubTimestamp":1735383642,"share":"https://www.laohu8.com/m/news/2494156213?lang=zh_CN&edition=full","pubTime":"2024-12-28 19:00","market":"us","language":"zh","title":"AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应","url":"https://stock-news.laohu8.com/highlight/detail?id=2494156213","media":"芯界研习社","summary":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。","content":"<html><body><article><p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20241228190247406v206bmvskxoayyv\"/><p>SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。</p><p>在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。</p><p>即便在硬件规格上优于竞争对手，如<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。</p><p>SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。</p><p>MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。</p><p>SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。</p><p>SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。</p><p>对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。</p><p>苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。</p><p>苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。</p><p>尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。</p><p>内容来源于电子工程专辑</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-12-28 19:00 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b><strong>芯界研习社</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","BK4573":"虚拟现实","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","GFS":"GLOBALFOUNDRIES Inc.","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","BK4512":"苹果概念","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","AMD":"美国超微公司","BK4585":"ETF&股票定投概念","BK4141":"半导体产品","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","BK4529":"IDC概念","BK4566":"资本集团","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","NVDA":"英伟达","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","BK4575":"芯片概念","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1880398471.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) INC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","BK4588":"碎股","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0082616367.USD":"摩根大通美国科技A（dist）"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2494156213","content_text":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。即便在硬件规格上优于竞争对手，如英伟达的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。内容来源于电子工程专辑","news_type":1,"symbols_score_info":{"AMD":1,"GFS":1,"NVDA":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"CN"},{"id":387171965452576,"gmtCreate":1735542588802,"gmtModify":1735542591043,"author":{"id":"3441692941897723","authorId":"3441692941897723","name":"悟空的花果山","avatar":"https://static.tigerbbs.com/628f19802db29c1c1a827452d3fe4cb3","vip":1,"hat":"https://static.tigerbbs.com/f84d87792f02cf78e80ee34979fd31e5","crmLevel":7,"crmLevelSwitch":1,"authorIdStr":"3441692941897723","idStr":"3441692941897723"},"htmlText":"苏姐的魅力，承认问题并知道改善就好，加仓","listText":"苏姐的魅力，承认问题并知道改善就好，加仓","text":"苏姐的魅力，承认问题并知道改善就好，加仓","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":2,"commentSize":2,"repostSize":0,"link":"https://laohu8.com/post/387171965452576","repostId":2494156213,"repostType":2,"repost":{"id":"2494156213","kind":"news","pubTimestamp":1735383642,"share":"https://www.laohu8.com/m/news/2494156213?lang=zh_CN&edition=full","pubTime":"2024-12-28 19:00","market":"us","language":"zh","title":"AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应","url":"https://stock-news.laohu8.com/highlight/detail?id=2494156213","media":"芯界研习社","summary":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。","content":"<html><body><article><p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。</p><img src=\"https://fid-75186.picgzc.qpic.cn/20241228190247406v206bmvskxoayyv\"/><p>SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。</p><p>在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。</p><p>即便在硬件规格上优于竞争对手，如<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。</p><p>SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。</p><p>MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。</p><p>SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。</p><p>SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。</p><p>对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。</p><p>苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。</p><p>苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。</p><p>尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。</p><p>内容来源于电子工程专辑</p></article></body></html>","source":"tencent","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>AMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nAMD MI300X AI芯片存在软件缺陷，CEO苏姿丰回应\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-12-28 19:00 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b><strong>芯界研习社</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","BK4573":"虚拟现实","LU0979878070.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"A\" (USD) ACC","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","BK4554":"元宇宙及AR概念","BK4532":"文艺复兴科技持仓","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","GFS":"GLOBALFOUNDRIES Inc.","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","BK4512":"苹果概念","LU0198837287.USD":"UBS (LUX) EQUITY SICAV - USA GROWTH \"P\" (USD) ACC","AMD":"美国超微公司","BK4585":"ETF&股票定投概念","BK4141":"半导体产品","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","BK4529":"IDC概念","BK4566":"资本集团","LU2054465674.USD":"UBS (LUX) KEY SELEC SICAV DIGITAL TRANSFORMATION T \"P\" (USD) ACC","LU0823421333.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) ACC","NVDA":"英伟达","LU0390134368.USD":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","BK4575":"芯片概念","LU1303367103.USD":"摩根大通多经理另类基金 A (acc)","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","LU0823421416.USD":"BNP PARIBAS DISRUPTIVE TECHNOLOGY \"C\" (USD) INC","LU2098885051.SGD":"JPMorgan Funds - Multi-Manager Alternatives A (acc) SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU1880398471.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) ACC","LU1880398554.USD":"AMUNDI FUNDS GLOBAL EQUITY \"A2\" (USD) INC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU0109392836.USD":"富兰克林科技股A","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","LU1064131342.USD":"Fullerton Lux Funds - Global Absolute Alpha A Acc USD","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","BK4588":"碎股","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU1988902786.USD":"FULLERTON LUX FUNDS GLOBAL ABSOLUTE ALPHA \"I\" (USD) ACC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","LU1951200564.SGD":"Natixis Thematics AI & Robotics Fund R/A SGD","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0082616367.USD":"摩根大通美国科技A（dist）"},"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20241228190258ab95ce83&s=b","is_english":false,"share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","article_id":"2494156213","content_text":"AMD在AI芯片市场中面临来自NVIDIA的激烈竞争，而MI300X芯片因软件缺陷未能充分发挥硬件性能，引发了广泛关注。近日，芯片顾问机构Semianalysis的报告称，花了五个月时间才弄清AMD的AI芯片 MI300X ，理论上，MI300X 在规格和总拥有成本 (TCO) 方面应该比 Nvidia 的 H100 和 H200 具有巨大优势，然而，实际情况是，该芯片的实际性能未达预期。SemiAnalysis指出，尽管MI300X在硬件配置上具有显著优势，如高达1307 TeraFLOPS的FP16精度算力和192GB的HBM3内存，但其软件层面的问题却使其难以发挥应有的性能。这些软件缺陷包括但不限于AI模型训练的复杂调试需求、开箱即用体验差以及环境变量的复杂性。在开箱问题上，MI300X的开箱即用体验非常糟糕，用户需要投入大量时间和精力进行手动调试才能正常使用。相比之下，NVIDIA的CUDA技术提供了更高的稳定性和易用性，用户可以轻松上手并开展工作。即便在硬件规格上优于竞争对手，如英伟达的H100和H200，MI300X的实际性能却未能达到市场预期。SemiAnalysis通过多项基准测试发现，MI300X在实际应用中表现不如理论值，特别是在AI模型训练过程中，性能受限于软件问题。SemiAnalysis指出，MI300X难以突破NVIDIA的“CUDA护城河”，这使得其在与NVIDIA的竞争中处于不利地位。MI300X需要大量调试才能使用，SemiAnalysis的研究表明，MI300X在未经大量调试的情况下几乎无法进行AI模型训练。这一问题导致用户在实际使用中面临诸多困难，进一步限制了其市场竞争力。SemiAnalysis对AMD MI300X的性能缺陷进行了全面分析，指出其软件层面的问题是主要瓶颈。尽管硬件配置强大，但软件生态的不足使得MI300X难以在AI芯片市场中与NVIDIA竞争。SemiAnalysis建议AMD增加对软件开发和测试的投入，特别是通过自动化测试和优化默认设置来简化环境变量，提升用户体验。此外，AMD需要学习NVIDIA的做法，持续推出新功能和工具库以巩固市场地位。对此，AMD CEO苏姿丰表示，AMD非常感谢Semianalysis等机构提供的建设性反馈，并承认公司在软件开发和测试方面确实存在不足。为了改善这一状况，AMD已经投入大量资源进行优化，包括配置数千颗MI300X芯片进行全面的自动化测试，以简化复杂的环境变量并实现“开箱即用”的便捷性。苏姿丰与Semianalysis首席分析师Dylan Patel进行了长达1.5小时的深入讨论，探讨了AMD在软件领域的不足及未来的改进方向。她坦言，尽管AMD在硬件性能上取得了显著进步，但在软件层面的优化和稳定性仍需加强。苏姿丰表示，“感谢Dylan与我进行了具有建设性的对话。即便是批评性的反馈，也是一份宝贵的礼物。”她还提到，2025年AMD将推出多项涉及AI领域的重大计划，显示出公司对未来发展的信心和决心。尽管AMD在硬件方面具有一定的优势，但软件生态系统的不完善仍然是制约其市场竞争力的关键因素。业界普遍认为，AI芯片不仅需要强大的硬件支持，更需要高质量的软件配合。只有通过改善软件体验，AMD才能在竞争激烈的AI芯片市场中崭露头角。内容来源于电子工程专辑","news_type":1,"symbols_score_info":{"AMD":1,"GFS":1,"NVDA":0.9}},"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"comments":[{"id":387178448302184,"gmtCreate":1735556603471,"gmtModify":1735556607356,"authorId":3458349567571181,"author":{"id":3458349567571181,"idStr":"3458349567571181","authorId":3458349567571181,"name":"马虎恶魔号","avatar":"https://static.tigerbbs.com/5309b4545d61bcba8ee06c42836bf26f","vip":1,"currentWearingBadge":{"badgeId":"3f8f4b8c193b4343a88817ce07587dbd-1","templateUuid":"3f8f4b8c193b4343a88817ce07587dbd","name":"星级创作者","description":"累计发表精华帖>=3（或有料帖>=10），且30天内发表过至少一篇精华帖（或4篇有料帖）并参与过评论","bigImgUrl":"https://static.tigerbbs.com/1866dcf97a73be1c330f85862546aedc","smallImgUrl":"https://static.tigerbbs.com/4f5c5fa8e2c7683bb5a7fce8753ee456","redirectLinkEnabled":1,"redirectLink":"https://www.laohu8.com/activity/market/2023/star-contributors/","hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2023.07.04","individualDisplayEnabled":0,"individualDisplaySort":0,"categoryType":2007},"crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[{"badgeId":"3f8f4b8c193b4343a88817ce07587dbd-1","templateUuid":"3f8f4b8c193b4343a88817ce07587dbd","name":"星级创作者","description":"累计发表精华帖>=3（或有料帖>=10），且30天内发表过至少一篇精华帖（或4篇有料帖）并参与过评论","bigImgUrl":"https://static.tigerbbs.com/1866dcf97a73be1c330f85862546aedc","smallImgUrl":"https://static.tigerbbs.com/4f5c5fa8e2c7683bb5a7fce8753ee456","redirectLinkEnabled":1,"redirectLink":"https://www.laohu8.com/activity/market/2023/star-contributors/","hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2026.03.22","individualDisplayEnabled":1,"backgroundColor":{"dark":"#675a37","tint":"#f9ebc2"},"fontColor":{"dark":"#ffffff","tint":"#ab7a0e"},"individualDisplaySort":1,"categoryType":2007}]},"repliedAuthorId":0,"objectId":387171965452576,"type":1,"supId":0,"prevId":0,"content":"苏妈苏妈苏妈","text":"苏妈苏妈苏妈","html":"苏妈苏妈苏妈"},{"id":387178747973840,"gmtCreate":1735544351665,"gmtModify":1735544355614,"authorId":3489022338988536,"author":{"id":3489022338988536,"idStr":"3489022338988536","authorId":3489022338988536,"name":"MichaelJacky","avatar":"https://static.tigerbbs.com/99a8576905a6b008c9ff1b340dbf7ff0","vip":2,"currentWearingBadge":{"badgeId":"228c86a078844d74991fff2b7ab2428d-1","templateUuid":"228c86a078844d74991fff2b7ab2428d","name":"投资经理虎","description":"证券账户累计交易金额达到10万美元","bigImgUrl":"https://static.tigerbbs.com/c8dfc27c1ee0e25db1c93e9d0b641101","smallImgUrl":"https://static.tigerbbs.com/f43908c142f8a33c78f5bdf0e2897488","grayImgUrl":"https://static.tigerbbs.com/82165ff19cb8a786e8919f92acee5213","redirectLinkEnabled":0,"hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2026.01.06","exceedPercentage":"60.56%","individualDisplayEnabled":0,"individualDisplaySort":0,"categoryType":1101},"crmLevel":5,"crmLevelSwitch":1,"individualDisplayBadges":[]},"repliedAuthorId":0,"objectId":387171965452576,"type":1,"supId":0,"prevId":0,"content":"越是常识，越是事实。跟进","text":"越是常识，越是事实。跟进","html":"越是常识，越是事实。跟进"}],"langContent":"CN"}],"isCommentEnd":false,"newsSizeData":{"likeSize":2,"commentSize":3,"repostSize":4,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.37.0","shortVersion":"4.37.0","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2494156213","isCrawlerRequest":true}