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TSM 台积电
盘前交易 04-25 05:45:13 EDT
132.97
-0.46
-0.34%
盘前
133.15
+0.18
+0.14%
05:43 EDT
最高
136.29
最低
131.54
成交量
1,556万
今开
136.09
昨收
133.43
日振幅
3.56%
总市值
6,897亿
流通市值
6,430亿
总股本
51.87亿
成交额
20.80亿
换手率
0.32%
流通股本
48.36亿
市净率
--
ROE
--
每股收益
0.00
52周最高
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52周最低
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市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
北京优虎网络科技有限公司
资讯
新帖
简况
美国员工评台积电为最差雇主:工作时间长、等级制度严格
快科技 · 29分钟前
美国员工评台积电为最差雇主:工作时间长、等级制度严格
台积电宣布背面供电版 N2 制程 2025 下半年向客户推出,2026年量产
金融界 · 13:11
台积电宣布背面供电版 N2 制程 2025 下半年向客户推出,2026年量产
除了台积电,“强”美元还“飙”了哪些对美出口公司?
智通财经网 · 11:48
除了台积电,“强”美元还“飙”了哪些对美出口公司?
台积电1.6nm技术A16首次公开!2026年开始量产
快科技官方 · 10:27
台积电1.6nm技术A16首次公开!2026年开始量产
台积电公布新型芯片制造技术“A16” 预计2026年量产
CNMO · 09:00
台积电公布新型芯片制造技术“A16” 预计2026年量产
SK海力士季报全面超预期!扩大资本开支,3月量产HBM3E,与台积电签署HBM4开发协议
华尔街见闻 · 08:59
SK海力士季报全面超预期!扩大资本开支,3月量产HBM3E,与台积电签署HBM4开发协议
台积电(TSM)首度发布A16新型芯片制造技术,预计2026年量产
金吾财讯 · 08:51
台积电(TSM)首度发布A16新型芯片制造技术,预计2026年量产
台积电宣布“A16”芯片制造技术将于2026 年量产,剑指芯片性能王座
IT之家 · 08:47
台积电宣布“A16”芯片制造技术将于2026 年量产,剑指芯片性能王座
更新版 1-台积电称其“A16”芯片制造技术将于2026年投产,与英特尔一决高下
Reuters · 07:30
更新版 1-台积电称其“A16”芯片制造技术将于2026年投产,与英特尔一决高下
更新版 1-台积电称 "A16 "芯片制造技术将于 2026 年问世,与英特尔一决高下
Reuters · 06:45
更新版 1-台积电称 "A16 "芯片制造技术将于 2026 年问世,与英特尔一决高下
台积电称 "A16 "芯片制造技术将于 2026 年底投产
Reuters · 01:46
台积电称 "A16 "芯片制造技术将于 2026 年底投产
大摩:忘掉英伟达吧!英特尔AI芯片崭露头角,三大半导体股票或迎飙升!
金十数据 · 04-24 15:11
大摩:忘掉英伟达吧!英特尔AI芯片崭露头角,三大半导体股票或迎飙升!
苹果将开发用于AI服务器的定制芯片:采用台积电3nm工艺,2025H2量产
砍柴网 · 04-24 13:32
苹果将开发用于AI服务器的定制芯片:采用台积电3nm工艺,2025H2量产
港股异动 | 芯片股早盘集体回暖 台积电指引AI需求持续强劲 传统消费电子领域复苏在望
智通财经网 · 04-24 10:42
港股异动 | 芯片股早盘集体回暖 台积电指引AI需求持续强劲 传统消费电子领域复苏在望
港股异动 | 芯片股早盘集体回暖 台积电指引AI需求持续强劲 传统消费电子领域复苏在望
智通财经 · 04-24 10:42
港股异动 | 芯片股早盘集体回暖 台积电指引AI需求持续强劲 传统消费电子领域复苏在望
曝11月上旬将有多款骁龙8 Gen4新机发布 做等等党?
CNMO · 04-24 09:00
曝11月上旬将有多款骁龙8 Gen4新机发布 做等等党?
苹果据悉正在使用台积电的3nm工艺开发自己的AI服务器处理器
金融界 · 04-23 22:47
苹果据悉正在使用台积电的3nm工艺开发自己的AI服务器处理器
消息称SK海力士HBM4内存基础裸片有望采用台积电7nm制程
IT之家 · 04-23 16:57
消息称SK海力士HBM4内存基础裸片有望采用台积电7nm制程
看跌期权飙升至三个月来新高,台积电跌势“未完待续”?
智通财经 · 04-23 15:21
看跌期权飙升至三个月来新高,台积电跌势“未完待续”?
台湾花莲再地震 台积电回复“不预期对营运造成影响”
第一财经 · 04-23 13:49
台湾花莲再地震 台积电回复“不预期对营运造成影响”
暂无数据
公司概况
公司名称:
台积电
所属市场:
NYSE
上市日期:
--
主营业务:
台湾积体电路制造股份有限公司设立于1987年2月21日。主要从事于有关积体电路及其他半导体装置之制造、销售、封装测试与电脑辅助设计及光罩制造等代工业务。公司注册地及业务主要营运据点为新竹科学园区力行6路8号。
发行价格:
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17:16","pubTimestamp":1714036616,"startTime":"0","endTime":"0","summary":"本月初的时候台积电承诺将在美国建第三家先进芯片工厂,然而目前台积电在亚利桑那的一期工厂进度仍严重滞后,量产时间已经推迟到了2025年。但工作文化的巨大反差还是产生了隔阂,美国员工不理解台积电严格的等级制度和过长的工作时间,总部员工则觉得美国同事们拿得多、下班早。有数十位美国新员工培训还没结束就离职,一位已经离职员工甚至直言,台积电是这个地球上最糟糕的雇主。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8Z4YFZzoLxI","is_publish_highlight":false,"gpt_icon":0},{"id":"2430563442","title":"台积电宣布背面供电版 N2 制程 2025 下半年向客户推出,2026年量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2430563442","media":"金融界","top":-1,"share":"https://www.laohu8.com/m/news/2430563442?lang=zh_cn&edition=full","pubTime":"2024-04-25 13:11","pubTimestamp":1714021919,"startTime":"0","endTime":"0","summary":"台积电在近日公布的2023年报中表示,其背面供电版N2制程节点定于2025下半年向客户推出,2026年实现正式量产。台积电表示其N2制程将引入其GAA技术实现——纳米片结构,在性能和能效方面都提升一个时代,预计于2025年启动量产。台积电在先进制程代工领域的两大对手也在积极布局背面供电技术。其中英特尔将在今年上半年的Intel20A节点导入背面供电;另据IT之家以往报道,三星也有望在2025年的SF2节点应用此技术。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042513153787ad9746&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042513153787ad9746&s=b","is_publish_highlight":false,"gpt_icon":0},{"id":"2430836446","title":"除了台积电,“强”美元还“飙”了哪些对美出口公司?","url":"https://stock-news.laohu8.com/highlight/detail?id=2430836446","media":"智通财经网","top":-1,"share":"https://www.laohu8.com/m/news/2430836446?lang=zh_cn&edition=full","pubTime":"2024-04-25 11:48","pubTimestamp":1714016892,"startTime":"0","endTime":"0","summary":"至少有一类企业将受益于美元走强,即向美国出口的企业,主要受益者包括重量级的亚洲芯片制造商和欧洲工业及制药公司。","market":"us","thumbnail":"https://img.zhitongcaijing.com/image/20240425/20240425112746_24022.png?x-oss-process=image/format,jpg/quality,Q_80/resize,w_250","type":0,"news_type":0,"thumbnails":["https://img.zhitongcaijing.com/image/20240425/20240425112746_24022.png?x-oss-process=image/format,jpg/quality,Q_80/resize,w_250"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1109553.html","is_publish_highlight":false,"gpt_icon":0},{"id":"2430273446","title":"台积电1.6nm技术A16首次公开!2026年开始量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2430273446","media":"快科技官方","top":-1,"share":"https://www.laohu8.com/m/news/2430273446?lang=zh_cn&edition=full","pubTime":"2024-04-25 10:27","pubTimestamp":1714012076,"startTime":"0","endTime":"0","summary":"在论坛上,台积电首次公开了名为TSMC A16的制程技术。据介绍,A16将结合台积电的超级电轨构架与纳米片晶体管,预计于2026年量产。台积电表示,相较于N2P制程,A16芯片密度提升高达1.10倍,在相同工作电压下,速度增快8-10%;在相同速度下,功耗降低15-20%。除了A16外,台积电还宣布将推出N4C技术,N4C延续了N4P技术,晶粒成本降低高达8.5%且采用门槛低,预计于2025年量产。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20240425/178/w600h378/20240425/cc76-6c6d9f75cbb33aa17a62c6bdf0270fad.jpg/w120h90l50t1700.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20240425/178/w600h378/20240425/cc76-6c6d9f75cbb33aa17a62c6bdf0270fad.jpg/w120h90l50t1700.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2024-04-25/detail-inasziaa6112860.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2024-04-25/detail-inasziaa6112860.d.html?vt=4","is_publish_highlight":false,"gpt_icon":0},{"id":"2430149854","title":"台积电公布新型芯片制造技术“A16” 预计2026年量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2430149854","media":"CNMO","top":-1,"share":"https://www.laohu8.com/m/news/2430149854?lang=zh_cn&edition=full","pubTime":"2024-04-25 09:00","pubTimestamp":1714006800,"startTime":"0","endTime":"0","summary":"台积电公布新型芯片制造技术“A16” 预计2026年量产在近日于美国加州圣克拉拉举行的北美技术论坛上,全球领先的半导体制造企业台积电宣布了一项名为TSMC A16的新型芯片制造技术,并计划于2026年实现量产。这一技术结合了领先的纳米片电晶体和创新的背面电轨解决方案,预计将大幅提升逻辑密度及效能。N4C技术延续了台积电现有的N4P技术,不仅晶粒成本降低了高达8.5%,而且采用门槛更低,预计将于2025年实现量产。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20240425/138/w600h338/20240425/c218-a501ebe29ed3be7333cda217618e0dcf.jpg/w120h90l50t12f6.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20240425/138/w600h338/20240425/c218-a501ebe29ed3be7333cda217618e0dcf.jpg/w120h90l50t12f6.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2024-04-25/detail-inaszaua7011451.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2024-04-25/detail-inaszaua7011451.d.html?vt=4","is_publish_highlight":false,"gpt_icon":0},{"id":"2430419852","title":"SK海力士季报全面超预期!扩大资本开支,3月量产HBM3E,与台积电签署HBM4开发协议","url":"https://stock-news.laohu8.com/highlight/detail?id=2430419852","media":"华尔街见闻","top":-1,"share":"https://www.laohu8.com/m/news/2430419852?lang=zh_cn&edition=full","pubTime":"2024-04-25 08:59","pubTimestamp":1714006768,"startTime":"0","endTime":"0","summary":"AI服务器催化HBM需求爆发,SK海力士一季度营收猛增,增长超一倍,创历史同期新高,预计存储芯片市场全面回暖,今年资本支出将略高于计划水平。","market":"us","thumbnail":"https://wpimg-wscn.awtmt.com/213bad8a-aec9-473d-9624-0de3fcf7ad64.jpeg","type":0,"news_type":0,"thumbnails":["https://wpimg-wscn.awtmt.com/213bad8a-aec9-473d-9624-0de3fcf7ad64.jpeg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3713555","is_publish_highlight":false,"gpt_icon":0},{"id":"2430541935","title":"台积电(TSM)首度发布A16新型芯片制造技术,预计2026年量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2430541935","media":"金吾财讯","top":-1,"share":"https://www.laohu8.com/m/news/2430541935?lang=zh_cn&edition=full","pubTime":"2024-04-25 08:51","pubTimestamp":1714006305,"startTime":"0","endTime":"0","summary":"金吾财讯 | 当地时间4月24日,台积电(TSM)在美国加州圣克拉拉举行的北美技术论坛上,发布了一项名为TSMC A16的新型芯片制造技术,预计于2026年量产。据悉,台积电这次首度发布TSMC A16技术,结合领先的纳米片电晶体及创新的背面电轨(backsidepower rail)解决方案以大幅提升逻辑密度及效能,预计于2026年量产。","market":"sh","thumbnail":"https://static.szfiu.com/news/20210625/NzQ0MDFhN2VhZDk5MjYwZWE0ZjgxMTYyNDYwMDUxODg2NQ==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20210625/NzQ0MDFhN2VhZDk5MjYwZWE0ZjgxMTYyNDYwMDUxODg2NQ==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"275231","is_publish_highlight":false,"gpt_icon":0},{"id":"2430415092","title":"台积电宣布“A16”芯片制造技术将于2026 年量产,剑指芯片性能王座","url":"https://stock-news.laohu8.com/highlight/detail?id=2430415092","media":"IT之家","top":-1,"share":"https://www.laohu8.com/m/news/2430415092?lang=zh_cn&edition=full","pubTime":"2024-04-25 08:47","pubTimestamp":1714006040,"startTime":"0","endTime":"0","summary":"IT之家 4 月 25 日消息,台积电周三宣布其名为“A16”的全新芯片制造技术将于 2026 下半年投入量产,标志着台积电与长期竞争对手英特尔之间关于谁将能够制造出全球最快芯片的较量再次升级。 ...","market":"sh","thumbnail":"https://community-static.tradeup.com/news/af4cbca46e03b627bc789b293008a62f","type":0,"news_type":0,"thumbnails":["https://community-static.tradeup.com/news/af4cbca46e03b627bc789b293008a62f"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","isJumpTheme":false,"source_url":"https://m.ithome.com/html/764029.htm","is_publish_highlight":true,"gpt_icon":1},{"id":"2430490095","title":"更新版 1-台积电称其“A16”芯片制造技术将于2026年投产,与英特尔一决高下","url":"https://stock-news.laohu8.com/highlight/detail?id=2430490095","media":"Reuters","top":-1,"share":"https://www.laohu8.com/m/news/2430490095?lang=zh_cn&edition=full","pubTime":"2024-04-25 07:30","pubTimestamp":1714001406,"startTime":"0","endTime":"0","summary":" 路透加利福尼亚州圣克拉拉4月24日 - 台积电 周三表示,“A16”新型芯片制造技术将于2026年下半年投入生产。台积电还披露了一项从芯片背面为计算机芯片供电的新技术,该技术有助于加快人工智能芯片的速度,并将于2026年面世。分析人士表示,台积电公布的这些信息让人对英特尔声称将重新夺回世界芯片制造桂冠的说法产生质疑。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://api.rkd.refinitiv.com/api/News/News.svc/REST/News_1/RetrieveStoryML_1","is_publish_highlight":false,"gpt_icon":0},{"id":"2430849761","title":"更新版 1-台积电称 \"A16 \"芯片制造技术将于 2026 年问世,与英特尔一决高下","url":"https://stock-news.laohu8.com/highlight/detail?id=2430849761","media":"Reuters","top":-1,"share":"https://www.laohu8.com/m/news/2430849761?lang=zh_cn&edition=full","pubTime":"2024-04-25 06:45","pubTimestamp":1713998748,"startTime":"0","endTime":"0","summary":") Stephen Nellis 路透社加利福尼亚州圣克拉拉4月24日 - 台湾积体电路制造股份有限公司周三表示,一种名为 \"A16 \"的新型芯片制造技术将于2026年下半年投入生产,从而与长期竞争对手英特尔就谁能制造出世界上最快的芯片展开对决。台积电还透露了一种从芯片背面为计算机芯片供电的新技术,它有助于加快人工智能芯片的速度,并将于2026年面世。分析人士表示,这些公告让人对英特尔声称将重新夺回世界芯片制造桂冠的说法产生质疑。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://api.rkd.refinitiv.com/api/News/News.svc/REST/News_1/RetrieveStoryML_1","is_publish_highlight":false,"gpt_icon":0},{"id":"2430230461","title":"台积电称 \"A16 \"芯片制造技术将于 2026 年底投产","url":"https://stock-news.laohu8.com/highlight/detail?id=2430230461","media":"Reuters","top":-1,"share":"https://www.laohu8.com/m/news/2430230461?lang=zh_cn&edition=full","pubTime":"2024-04-25 01:46","pubTimestamp":1713980768,"startTime":"0","endTime":"0","summary":" 路透社加利福尼亚州圣克拉拉4月24日 - 台湾积体电路制造股份有限公司 周三表示,一种名为 \"A16 \"的新型芯片制造技术将于2026年下半年投入生产。台积电是全球最大的芯片合约制造商,为英伟达 等公司生产芯片,目前生产全球最快的芯片。今年 3 月,英特尔表示,它预计将在 2026 年超越 台积电,利用英特尔的 \"14A \"技术制造速度更快的芯片。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://api.rkd.refinitiv.com/api/News/News.svc/REST/News_1/RetrieveStoryML_1","is_publish_highlight":false,"gpt_icon":0},{"id":"2430644195","title":"大摩:忘掉英伟达吧!英特尔AI芯片崭露头角,三大半导体股票或迎飙升!","url":"https://stock-news.laohu8.com/highlight/detail?id=2430644195","media":"金十数据","top":-1,"share":"https://www.laohu8.com/m/news/2430644195?lang=zh_cn&edition=full","pubTime":"2024-04-24 15:11","pubTimestamp":1713942714,"startTime":"0","endTime":"0","summary":"摩根士丹利的最新研究指出,英特尔最新推出的人工智能芯片可能会带动全球半导体市场的巨大变革。Gaudi 3芯片的制造将由台积电负责,采用其最新一代的5纳米工艺,而Alchip预计将成为半导体供应链的主要受益者,为Gaudi2和Gaudi 3提供设计服务。Wistron预计将成为主要的基板供应商。摩根士丹利在报告中重申了对Alchip和台积电的增持评级,认为它们是人工智能半导体需求的长期赢家。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042415115587a99211&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042415115587a99211&s=b","is_publish_highlight":false,"gpt_icon":0},{"id":"2429095681","title":"苹果将开发用于AI服务器的定制芯片:采用台积电3nm工艺,2025H2量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2429095681","media":"砍柴网","top":-1,"share":"https://www.laohu8.com/m/news/2429095681?lang=zh_cn&edition=full","pubTime":"2024-04-24 13:32","pubTimestamp":1713936759,"startTime":"0","endTime":"0","summary":"苹果在2020年推出了首款用于Mac的定制芯片,称为M1。据Wccftech报道,苹果正在开发一种定制芯片,旨在为人工智能 服务器提供动力。传闻苹果已选择台积电的3nm制程节点来制造这款芯片,预计2025年下半年量产。有传言称,苹果已经将注意力转向生成式AI,希望能够为业务找到新的增长动力。传闻苹果打算投入巨资将人工智能引入到旗下产品,打算在整个Mac产品线提供人工智能硬件加速。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042413351887a92e62&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042413351887a92e62&s=b","is_publish_highlight":false,"gpt_icon":0},{"id":"2429174647","title":"港股异动 | 芯片股早盘集体回暖 台积电指引AI需求持续强劲 传统消费电子领域复苏在望","url":"https://stock-news.laohu8.com/highlight/detail?id=2429174647","media":"智通财经网","top":-1,"share":"https://www.laohu8.com/m/news/2429174647?lang=zh_cn&edition=full","pubTime":"2024-04-24 10:42","pubTimestamp":1713926571,"startTime":"0","endTime":"0","summary":"天风证券指出,台积电发布1Q24业绩,指引AI需求持续强劲,预计全年半导体产业温和复苏,下调行业展望,对汽车行业半导体需求谨慎;联想发布AIPC新品,或带动新一轮换机,产业链值得关注;对存储板块一季度业绩乐观,看好后续价格趋势。AI大模型的持续优化及多样化AI应用终端的入市商用将会持续提升全球算力需求,推动新一轮AI基础设施建设的开启。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1108239.html","is_publish_highlight":false,"gpt_icon":0},{"id":"2429174641","title":"港股异动 | 芯片股早盘集体回暖 台积电指引AI需求持续强劲 传统消费电子领域复苏在望","url":"https://stock-news.laohu8.com/highlight/detail?id=2429174641","media":"智通财经","top":-1,"share":"https://www.laohu8.com/m/news/2429174641?lang=zh_cn&edition=full","pubTime":"2024-04-24 10:42","pubTimestamp":1713926571,"startTime":"0","endTime":"0","summary":"天风证券指出,台积电发布1Q24业绩,指引AI需求持续强劲,预计全年半导体产业温和复苏,下调行业展望,对汽车行业半导体需求谨慎;联想发布AIPC新品,或带动新一轮换机,产业链值得关注;对存储板块一季度业绩乐观,看好后续价格趋势。AI大模型的持续优化及多样化AI应用终端的入市商用将会持续提升全球算力需求,推动新一轮AI基础设施建设的开启。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042410465787a8a934&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042410465787a8a934&s=b","is_publish_highlight":false,"gpt_icon":0},{"id":"2429173360","title":"曝11月上旬将有多款骁龙8 Gen4新机发布 做等等党?","url":"https://stock-news.laohu8.com/highlight/detail?id=2429173360","media":"CNMO","top":-1,"share":"https://www.laohu8.com/m/news/2429173360?lang=zh_cn&edition=full","pubTime":"2024-04-24 09:00","pubTimestamp":1713920400,"startTime":"0","endTime":"0","summary":"4月23日,CNMO了解到,据数码博主“贾敬华”透露,多方消息已证实,预计11月上旬将有多款搭载骁龙8 Gen4移动平台的新机发布,并有望赶上双11大促。也就是说,相较于去年,今年各大品牌的旗舰机型发布时间将有所提前。据悉,骁龙8 Gen4移动平台将首次采用台积电的先进3nm工艺技术,标志着安卓智能手机正式迈入3nm技术新纪元。","market":"hk","thumbnail":"https://k.sinaimg.cn/n/spider20240423/143/w600h343/20240423/4663-0e1451bf70f3aa6d02b6024a51ead489.png/w120h90l50t16c7.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20240423/143/w600h343/20240423/4663-0e1451bf70f3aa6d02b6024a51ead489.png/w120h90l50t16c7.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2024-04-24/detail-inasvfmy8035639.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, .j_article_wbreco","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://tech.sina.cn/mobile/xp/2024-04-24/detail-inasvfmy8035639.d.html?vt=4","is_publish_highlight":false,"gpt_icon":0},{"id":"2429119576","title":"苹果据悉正在使用台积电的3nm工艺开发自己的AI服务器处理器","url":"https://stock-news.laohu8.com/highlight/detail?id=2429119576","media":"金融界","top":-1,"share":"https://www.laohu8.com/m/news/2429119576?lang=zh_cn&edition=full","pubTime":"2024-04-23 22:47","pubTimestamp":1713883642,"startTime":"0","endTime":"0","summary":"4月23日消息,据市场消息,苹果正在使用台积电的3nm工艺开发自己的AI服务器处理器,目标是在2025年下半年量产。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042322554487a69102&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024042322554487a69102&s=b","is_publish_highlight":false,"gpt_icon":0},{"id":"2429165459","title":"消息称SK海力士HBM4内存基础裸片有望采用台积电7nm制程","url":"https://stock-news.laohu8.com/highlight/detail?id=2429165459","media":"IT之家","top":-1,"share":"https://www.laohu8.com/m/news/2429165459?lang=zh_cn&edition=full","pubTime":"2024-04-23 16:57","pubTimestamp":1713862674,"startTime":"0","endTime":"0","summary":"IT之家 4 月 23 日消息,韩媒 The Elec 在报道中表示,预测 SK 海力士将在 HBM4 内存的基础裸片部分采用台积电 7nm 制程。SK 海力士上周同台积电签署了 HBM 内存合作谅解备忘录,双方的首个合作重点就是 HBM 基础逻辑芯片的性能改善。SK 海力士此前在 HBM 产品中采用存储半导体工艺制造基础裸片;而在 HBM4 中,台积电将采用先进逻辑工艺为 SK 海力士代工,以实现更丰富的功能和更加优异的功效,有助于满足客户对定制化 HBM 的需求。SK 海力士目标到 2026 年实现 HBM4 内存投产。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8Z1Bn4HfwVw","is_publish_highlight":false,"gpt_icon":0},{"id":"2429159904","title":"看跌期权飙升至三个月来新高,台积电跌势“未完待续”?","url":"https://stock-news.laohu8.com/highlight/detail?id=2429159904","media":"智通财经","top":-1,"share":"https://www.laohu8.com/m/news/2429159904?lang=zh_cn&edition=full","pubTime":"2024-04-23 15:21","pubTimestamp":1713856904,"startTime":"0","endTime":"0","summary":"投资者正押注$台积电$股价在经历两位数的跌幅后,可能还有更大的下跌空间。自4月11日以来,台积电股价已累计下跌超13%,这场抛售使其市值蒸发逾1000亿美元。根据汇编数据,该股的看跌期权上周五飙升至三个月来的最高水平,这表明更多投资者押注下跌将持续。尽管如此,市场对台积电的投机热情仍普遍高涨。晨星分析师Phelix Lee在一份报告中写道,谨慎的资本支出和行业前景抑制了对台积电的信心。","market":"hk","thumbnail":"https://static.tigerbbs.com/b98f9e740cb6fb06990004c4ea7eae84","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/b98f9e740cb6fb06990004c4ea7eae84"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1107419.html","is_publish_highlight":true,"gpt_icon":1},{"id":"2429158296","title":"台湾花莲再地震 台积电回复“不预期对营运造成影响”","url":"https://stock-news.laohu8.com/highlight/detail?id=2429158296","media":"第一财经","top":-1,"share":"https://www.laohu8.com/m/news/2429158296?lang=zh_cn&edition=full","pubTime":"2024-04-23 13:49","pubTimestamp":1713851370,"startTime":"0","endTime":"0","summary":"4月3日的地震已使台积电部分设备受损,预估造成30亿新台币损失。4月23日,台积电回复第一财经记者称,地震均未达到外部疏散标准,厂务及工安系统皆正常,目前不预期对营运造成影响。台积电、联电回应4月23日2时26分在台湾花莲县海域发生6.3级地震。目前不预期对营运造成影响。联电则回复此次地震“没有影响”。多家台湾半导体企业也已公布4月3日花莲地震的影响。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202404231351088b490147&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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