台积电(TSM)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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TSM 台积电

休市中 09-06 16:00:00 EDT

156.82

-6.88

-4.20%

盘后156.75

-0.07-0.04%

19:59 EDT

最高165.41	最低156.01	成交量1,496万
今开164.89	昨收163.70	日振幅5.74%
总市值8,133亿	流通市值7,582亿	总股本51.86亿
成交额23.67亿	换手率0.31%	流通股本48.35亿
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

北京优虎网络科技有限公司

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Kochpatcharin表示，两家公司正在开发无缓冲的HBM4芯片。分析人士表示，如果三星和台积电合作开发无缓冲HBM4芯片，这将是双方在AI芯片领域的首次合作。消息人士称，三星与台积电的合作将从尖端的第六代HBM4芯片开始，这家韩国公司计划于明年下半年开始量产该芯片。为巩固HBM领导地位，未从事代工业务的SK海力士于今年4月宣布与台积电合作生产HBM4芯片，计划在2026年量产。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024090613113495e67325&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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70旗舰手机发布前遇生产困境","url":"https://stock-news.laohu8.com/highlight/detail?id=1197708912","media":"华尔街洞察","labels":["analysis"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1197708912?lang=zh_cn&edition=full","pubTime":"2024-09-06 08:14","pubTimestamp":1725581671,"startTime":"0","endTime":"0","summary":"尽管如此，华为仍有可能在下周宣布Mate 70的发布，但可能会推出数量有限的现货手机，并允许客户预订并等待交付。去年，华为在推出Mate 60时采取了类似的策略。报告还提到，华为可能会将Mate 70系列的发布推迟到11月或更晚。去年8月，华为悄然推出了Mate 60 Pro，这一举动引发了美国对其芯片来源的担忧。除了Mate 70，华为还计划推出全球首款双折叠手机以及Aito电动车等其他新产品。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"analysis","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["IE00B1BXHZ80.USD","IE000ITXATA3.USD","IE00BLSP4452.SGD","LU1282649067.USD","00981","BK4501","SMSN.UK","IE000YTNTUN2.SGD","BK4505","LU0348723411.USD","TSM","AAPL","688981","IE0009356076.USD","BK4503","LU0011850046.USD","LU0384037296.USD","BK4141","LU0488056044.USD","IE0009G5SDU7.USD"],"gpt_icon":0},{"id":"1186811691","title":"台积电供应商称AI芯片将推动行业增长","url":"https://stock-news.laohu8.com/highlight/detail?id=1186811691","media":"华尔街洞察","labels":["analysis"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1186811691?lang=zh_cn&edition=full","pubTime":"2024-09-06 07:46","pubTimestamp":1725580007,"startTime":"0","endTime":"0","summary":"$台积电$的主要供应商之一Scientech的首席执行官许明智表示，人工智能芯片的需求将推动整个半导体行业的增长，尽管市场对增长放缓有所担忧。许明智在接受彭博社采访时表示：“AI行业的繁荣才刚刚开始。我们出售给最知名公司的设备可能在一年内增加了两到三倍。”他还预计，Scientech将在今年下半年实现季度销售的持续增长。此外，半导体行业协会本周早些时候报告称，7月份全球芯片销售额达到531亿美元，较前一个月增长近3%，同比增长近19%。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"analysis","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["IE00B3M56506.USD","LU0541501648.USD","LU1211504680.USD","LU2491050071.SGD","TWmain","LU0878005551.USD","LU0572940350.SGD","LU1712237335.SGD","LU0143863198.USD","BK4588","LU1623119135.USD","LU0143863784.USD","SG9999004220.SGD","LU2491049909.HKD","BK4591","LU0348723411.USD","LU1868837722.USD","TSM","LU0889565833.HKD","BK4550","LU2491050154.USD","BK4585","LU2458330243.SGD","LU0823421333.USD","BK4512","BK4581","LU2133065610.SGD","LU2458330169.SGD","BK4534","IE00B5TLWC47.USD","LU0889566641.SGD","BK4533","LU2125154778.USD","LU2054465674.USD","LU2360032135.SGD","LU0823421416.USD"],"gpt_icon":0},{"id":"2465154011","title":"五年后先进封装市场规模或达890亿美元，谁能挑战台积电？","url":"https://stock-news.laohu8.com/highlight/detail?id=2465154011","media":"21财经网","labels":["Product Release"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2465154011?lang=zh_cn&edition=full","pubTime":"2024-09-05 22:00","pubTimestamp":1725544853,"startTime":"0","endTime":"0","summary":"台积电的CoWoS先进封装技术是当前AI及高性能芯片厂商的主流选择。据市场研究机构Yole Group，先进封装行业的市场规模在2023年达到378亿美元，预计到2029年将达到891亿美元，2023年到2029年的复合增长率为11%。众多企业如今纷纷入局先进封装，技术创新与迭代异常活跃。台积电已宣布成立FOPLP团队，并规划建立小量产线。相关行业的格局可能将发生变化，企业需努力迎接挑战。能否挑战台积电？因此，中国大陆得以在先进封装领域与境外站在同一起点展开竞逐。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409052200559ee2efb1&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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并创下新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2465545990","media":"TechWeb.com.cn","labels":["Business Data"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2465545990?lang=zh_cn&edition=full","pubTime":"2024-09-05 17:02","pubTimestamp":1725526946,"startTime":"0","endTime":"0","summary":"而考虑到8月份是苹果秋季即将推出的新一代iPhone大量生产的时节，台积电采用他们最先进制程工艺代工的芯片也在大量出货，因而在7月份同比大增并创下新高之后，台积电的营收在8月份有望再创新高。就台积电在官网公布的月度营收来看，他们8月份的营收在多个年份都高于7月份。但至于台积电8月份的营收能否延续同比大幅增长的势头并再创新高，在他们公布之后就将揭晓。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20240905170226a1d8a374&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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台积电(TSM)盘前走高，暂升1.21%，报162.81美元。据悉，台积电正在加紧开发下一代硅光子解决方案，目标是在未来3至5年内使该技术投入生产。硅光子学是一种用于制备光子集成电路的技术，通常用于产生、检测、传输和处理光。另外，台积电计划将InFO-SoW与SoIC结合，形成CoW-SoW，将存储器或逻辑芯片堆叠在晶圆上，并预计在2027年开始量产。","market":"hk","thumbnail":"https://static.szfiu.com/news/20210625/NzNiZjRmZDM5NGRiODIwMzA3NTA2OTY0NQ==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20210625/NzNiZjRmZDM5NGRiODIwMzA3NTA2OTY0NQ==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"isJumpTheme":false,"source_url":"279591","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"Product 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预计2027年实现CoW-SoW量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2465548471","media":"市场资讯","labels":["Product Release","movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2465548471?lang=zh_cn&edition=full","pubTime":"2024-09-05 16:26","pubTimestamp":1725524760,"startTime":"0","endTime":"0","summary":"台积电(TSM.US)盘前涨1.11%，报162.66美元。消息面上，为了应对大芯片趋势及AI负载对更多HBM的需求，台积电计划将InFO-SoW与SoIC结合，形成CoW-SoW，将存储器或逻辑芯片堆叠在晶圆上，并预计在2027年开始量产。\n\n\n\n海量资讯、精准解读，尽在新浪财经APP\n\n责任编辑：郭明煜","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina","url":"https://finance.sina.com.cn/stock/bxjj/2024-09-05/doc-incnaxxn5715247.shtml","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, 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Release","Business Data"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2465560286?lang=zh_cn&edition=full","pubTime":"2024-09-05 11:09","pubTimestamp":1725505761,"startTime":"0","endTime":"0","summary":"数据显示，目前台积电3纳米晶圆的月产能正从10万片逐步上升到约12.5万片。此外，位于台南科技园和高雄的2nm晶圆厂产能预计将达到每月12万至13万片。据估计，每片3nm制程晶圆的成本接近2万美元，该产品的收入占台积电今年第二季度总收入的15%，约合31.4亿美元。据报道，台积电5nm和4nm芯片的产能利用率自从今年年初以来也一直保持在100%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202409051114119ee165aa&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Release"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2465562210?lang=zh_cn&edition=full","pubTime":"2024-09-05 10:42","pubTimestamp":1725504136,"startTime":"0","endTime":"0","summary":"CoWoS-L 可兼容于各式各样的高效能顶级芯片，例如先进逻辑、SoIC 和HBM。不过，台积电目前的SoW是借助台积电成熟的InFO技术来扩展新一代数据中心所需的算力，而基于CoWoS的SoW将计划在2027年推出，它将集成先进的SoC或SoIC、HBM及其他元件。从事液晶面板和半导体产品的自动化生产设备研发和制造的均豪集团董事长陈政兴则表示，台积电今、明年CoWoS产能有望连续翻倍成长，伴随日月光投控也积极拓展先进封装产能，均豪将通吃两大半导体厂扩产订单。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2024090510542195e37a87&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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