Cambria Global Asset Allocation ETF(GAA)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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GAA Cambria Global Asset Allocation ETF

交易中 12-15 14:01:04 EST

32.58

-0.03

-0.10%

最高32.98	最低32.58	成交量5,116
今开32.98	昨收32.62	日振幅1.22%
总市值6,027万	流通市值6,027万	总股本185.00万
成交额16.79万	换手率0.28%	流通股本185.00万
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

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制程晶圆价格定为每片约3万美元，并对所有客户实行统一价格。此外，台积电收到的2nm工艺流片数量是5nm工艺的四倍，显示出市场对2nm工艺的强烈需求。进入2nm工艺时代后，三星能否成为台积电强有力的对手仍需观望。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250928175341a6a3d5b5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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2600的细节。对比Exynos 2500的s5e9955，推测其有可能是 Exynos 2600 旗舰处理器。在此基础上，Exynos 2600 的 Geekbench 6 单核跑分有望达到 2950，多核跑分有望达到 10200。至于搭载这颗芯片的手机产品，现有的爆料显示，三星 Galaxy S26 手机有可能会搭载 Exynos 2600 处理器，但不会在所有市场销售。综合来看，新一代的Exynos 2600 芯片正在推进之中，距离正式到来已经越来越近了。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250726214028a464c22b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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GAA晶圆。这也是最尖端逻辑制程从“三足鼎立”走向“四厂争霸”道路上的关键里程碑。Rapidus于2023年9月1日举行了其首座晶圆厂IIM-1的奠基仪式、2024年12月完成了洁净室准备，2025年4月1日实现了初始图案的曝光与显影，到2025年6月完成了由200多个制造单元构成的生产线。▲ IIM-1Rapidus正在开发与其2nm工艺兼容的PDK，计划2026年一季度结束前向客户交付。该企业2027年实现2nm量产的计划没有改变。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8l5bFD0oOe9","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"ifeng_tech","symbols":["GAA"],"gpt_icon":0},{"id":"2549314375","title":"消息称三星启动新战略，6个月内将2纳米GAA工艺良率提升至60%-70%","url":"https://stock-news.laohu8.com/highlight/detail?id=2549314375","media":"市场资讯","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2549314375?lang=zh_cn&edition=full","pubTime":"2025-07-07 19:32","pubTimestamp":1751887920,"startTime":"0","endTime":"0","summary":"据 Chosun最新报道，三星已经开始实施一项“选择与集中”战略，其主要目标是将 2 纳米 GAA 技术的良率提升至 60% 至 70%。据报道，三星电子商业支持特别工作组和三星全球研究院正在推进提升 2 纳米 GAA 良率的战略。尽管如此，三星并未放弃努力，据悉其已完成了第二代 2 纳米工艺的基本设计，并计划在未来两年内推出第三代技术，即“SF2P+”。报道称三星高管已为其各部门设定了六个月的期限，以实现上述目标。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-07-07/doc-infesafa9555978.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["GAA"],"gpt_icon":0},{"id":"2549312760","title":"1.4nm，再生变数！","url":"https://stock-news.laohu8.com/highlight/detail?id=2549312760","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2549312760?lang=zh_cn&edition=full","pubTime":"2025-07-05 12:15","pubTimestamp":1751688946,"startTime":"0","endTime":"0","summary":"作为1.4nm赛道的三大玩家，台积电、英特尔与三星堪称大型的“三国志”，在性能与工艺的博弈中各自布局。原定今年第二季度动工的 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纳米及其衍生工艺上。","market":"us","thumbnail":"https://k.sinaimg.cn/n/spider20250701/443/w728h515/20250701/445e-5b0b9f42f55c1344d284f633cf501c7e.jpg/w120h90l50t1e80.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250701/443/w728h515/20250701/445e-5b0b9f42f55c1344d284f633cf501c7e.jpg/w120h90l50t1e80.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-07-01/detail-infcypri5286120.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, 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Exynos 2500 处理器发布：3nm GAA 工艺，3.3GHz 十核 CPU","url":"https://stock-news.laohu8.com/highlight/detail?id=2545999054","media":"市场资讯","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2545999054?lang=zh_cn&edition=full","pubTime":"2025-06-23 16:43","pubTimestamp":1750668180,"startTime":"0","endTime":"0","summary":"IT之家 6 月 23 日消息，三星 Exynos 2500 旗舰处理器今日在官网正式发布。Exynos 2500 配备基于 AI 的图像处理功能，并支持最高 3.2 亿像素的超高分辨率摄像头，同时允许以 60 fps 和 30 fps 进行 8K 视频录制和播放。Exynos 2500 通过改进各个模块的功耗降低架构，以及最新的制造工艺和封装技术，带来更高的电源效率。Exynos 2500 还配备了内置 GNSS 模块，并支持最新的连接功能接口，例如蓝牙 5.4 和 Wi-Fi 7。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-06-23/doc-infcaafh9456864.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["GAA"],"gpt_icon":0},{"id":"2505356580","title":"晶圆厂，大砍资本支出","url":"https://stock-news.laohu8.com/highlight/detail?id=2505356580","media":"虎嗅","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505356580?lang=zh_cn&edition=full","pubTime":"2025-01-23 10:01","pubTimestamp":1737597660,"startTime":"0","endTime":"0","summary":"基于上述种种考虑，出现了前文所谈到的三星削减资本支出计划。韩媒指出，三星晶圆厂将2025年的设施投资预算设定为5万亿韩元左右，较2024年的10万亿韩元投资范围大幅下降。联电大砍37.93％资本支出作为行业领先的另一家晶圆代工厂，联电在2024年全年每股盈余为3.79元，相比2023年的4.93元减少，创近4年新低。展望未来，2025年资本支出预算规划18亿美元，低于去年的29亿美元，年减37.93％，联电预期本季毛利率将降至逾25％水准，同步下探4年新低。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250123104237987000a9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Rapidus与IBM合作成功制造GAA晶体管原型晶圆","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758108","media":"ZOL中关村在线","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758108?lang=zh_cn&edition=full","pubTime":"2025-01-21 15:21","pubTimestamp":1737444094,"startTime":"0","endTime":"0","summary":"1月21日，据外媒报道，日本先进半导体制造商Rapidus与IBM合作在美国纽约州奥尔巴尼的纳米技术综合体制造了2nm GAA（全环绕栅极）晶体管原型晶圆。此次展示表明Rapidus和IBM具备制备2nm先进工艺芯片的实力。然而，从技术验证成功到商业化量产还面临长期而困难的过程。值得一提的是，Rapidus于2024年12月18日接收了首台在日本本土使用的EUV光刻机ASML NXE:3800E。试生产将在今年4月开始，在其位于北海道千岁市的IIM-1晶圆厂进行。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftrwv8523534.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: 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GAA 原型晶圆亮相，在日试产 4 月启动","url":"https://stock-news.laohu8.com/highlight/detail?id=2505758173","media":"IT之家","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2505758173?lang=zh_cn&edition=full","pubTime":"2025-01-21 14:45","pubTimestamp":1737441936,"startTime":"0","endTime":"0","summary":"IT之家 1 月 21 日消息，据日媒 EE Times Japan 报道，日本先进半导体制造商 Rapidus在 2024 年 12 月 11~13 日举行的 SEMICON Japen 2024 上，展示了其与 IBM 合作在美国纽约州奥尔巴尼纳米技术综合体制造的 2nm GAA 晶体管原型晶圆。该晶圆的出现对外表明 Rapidus 与 IBM 这对技术伙伴的确具备制得 2nm 先进制程晶圆的实力，不过从制程技术验证成功到商业化量产尚需相当漫长而困难的一段爬坡之路。","market":"us","thumbnail":"https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg","type":0,"news_type":0,"thumbnails":["https://k.sinaimg.cn/n/spider20250121/732/w1920h1212/20250121/f8ff-0f01881f4d85a0c8390a5acf38385b91.jpg/w120h90l50t1475.jpg"],"rights":{"source":"sina_tech","url":"https://tech.sina.cn/mobile/xp/2025-01-22/detail-ineftmqz7996480.d.html?vt=4","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}.weibo_user{#sourceStyle#; margin-bottom: 0; display: inline-block;}.weibo_time{#sourceStyle#};","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action, .j_float_wbro, 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