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ASX 日月光半导体
盘后交易 04-02 16:01:02 EDT
22.27
-0.21
-0.93%
盘后
22.28
+0.01
+0.04%
16:00 EDT
最高
22.52
最低
21.73
成交量
489.83万
今开
21.82
昨收
22.48
日振幅
3.54%
总市值
495.18亿
流通市值
375.30亿
总股本
22.24亿
成交额
1.09亿
换手率
0.29%
流通股本
16.85亿
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
资讯
新帖
简况
异动解读 | 阿斯麦EUV技术突破提振，日月光半导体盘中大涨6.64%
异动解读 · 02-25
异动解读 | 阿斯麦EUV技术突破提振，日月光半导体盘中大涨6.64%
异动解读 | 阿斯麦EUV技术突破，日月光半导体盘前大涨5.41%
异动解读 · 02-24
异动解读 | 阿斯麦EUV技术突破，日月光半导体盘前大涨5.41%
盘前异动｜VIR暴涨超50%，KEYS涨17%，芯片制造概念股拉升
老虎资讯综合 · 02-24
盘前异动｜VIR暴涨超50%，KEYS涨17%，芯片制造概念股拉升
【2月15日】字节跳动芯片量产在即,AMD借力Arista进军AI集群
芯域 · 02-18
【2月15日】字节跳动芯片量产在即,AMD借力Arista进军AI集群
日月光首条CoWoS生产线，今年底亮相
半导体新知道 · 02-09
日月光首条CoWoS生产线，今年底亮相
异动解读 | 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂
异动解读 · 02-06
异动解读 | 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂
日月光首条CoWoS落地高雄，台积电“后院”被攻破？
未来半导体 · 02-05
日月光首条CoWoS落地高雄，台积电“后院”被攻破？
机构：2030年先进封装市场规模将达近800亿美元
满天芯 · 02-02
机构：2030年先进封装市场规模将达近800亿美元
先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长
爱集微 · 02-01
先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长
财报前瞻 ｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观
财报Agent · 01-29
财报前瞻 ｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观
先进封装，全速扩产
半导体行业观察 · 01-18
先进封装，全速扩产
瑞银：艾马克技术飙涨已反映算力增长预期，下调评级以权衡成本风险
智通财经 · 01-14
瑞银：艾马克技术飙涨已反映算力增长预期，下调评级以权衡成本风险
日月光投控斥资28亿扩产 旗下硅品购入联合再生竹南厂房
维库电子市场网 · 01-14
日月光投控斥资28亿扩产 旗下硅品购入联合再生竹南厂房
先进封装火了，2026谁吃香？
半导体产业纵横 · 01-05
先进封装火了，2026谁吃香？
纳斯达克中国金龙指数涨0.86% 热门中概股涨多跌少 禾赛涨3.9%
金吾财讯 · 2025-12-12
纳斯达克中国金龙指数涨0.86% 热门中概股涨多跌少 禾赛涨3.9%
台积电、日月光、Amkor及联电等加速扩产CoWoS
格隆汇 · 2025-12-10
台积电、日月光、Amkor及联电等加速扩产CoWoS
纳斯达克中国金龙指数升幅扩至0.38% 热门中概股多数走高 日月光半导体升4.47%
金吾财讯 · 2025-12-08
纳斯达克中国金龙指数升幅扩至0.38% 热门中概股多数走高 日月光半导体升4.47%
台积电先进封装订单大爆满 扩大委外释单 日月光大赢家
爱集微 · 2025-12-08
台积电先进封装订单大爆满 扩大委外释单 日月光大赢家
纳斯达克中国金龙指数升逾0.5% 热门中概股普升 霸王茶姬涨4.1%
金吾财讯 · 2025-11-28
纳斯达克中国金龙指数升逾0.5% 热门中概股普升 霸王茶姬涨4.1%
美国住房市场困境加剧，James Hardie Industries跌13%
环球市场播报 · 2025-11-06
美国住房市场困境加剧，James Hardie Industries跌13%
暂无数据
公司概况
公司名称：
日月光半导体
所属市场：
NYSE
上市日期：
--
主营业务：
日月光投资控股股份有限公司成立于1984年3月23日，是一家根据(中国台湾)公司法成立的股份有限公司，位于中国台湾高雄南泽出口加工区。根据2012年的收入，该公司是全球最大的半导体封装和测试服务独立提供商。该公司的服务包括半导体封装、互连材料生产、前端工程测试、晶圆探测、最终测试服务以及与计算机、外围设备、通信、工业、汽车、存储和服务器应用相关的电子制造服务的集成解决方案。
发行价格：
--
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