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ASX 日月光半导体
盘后交易 02-10 18:07:11 EST
22.49
+0.34
+1.53%
盘后
22.49
+0.00
0.00%
18:02 EST
最高
22.68
最低
22.12
成交量
870.21万
今开
22.44
昨收
22.15
日振幅
2.53%
总市值
498.84亿
流通市值
379.00亿
总股本
22.18亿
成交额
1.95亿
换手率
0.52%
流通股本
16.85亿
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
资讯
新帖
简况
日月光首条CoWoS生产线，今年底亮相
半导体新知道 · 02-09 06:30
日月光首条CoWoS生产线，今年底亮相
异动解读 | 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂
异动解读 · 02-06
异动解读 | 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂
日月光首条CoWoS落地高雄，台积电“后院”被攻破？
未来半导体 · 02-05
日月光首条CoWoS落地高雄，台积电“后院”被攻破？
机构：2030年先进封装市场规模将达近800亿美元
满天芯 · 02-02
机构：2030年先进封装市场规模将达近800亿美元
先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长
爱集微 · 02-01
先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长
财报前瞻 ｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观
财报Agent · 01-29
财报前瞻 ｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观
先进封装，全速扩产
半导体行业观察 · 01-18
先进封装，全速扩产
瑞银：艾马克技术飙涨已反映算力增长预期，下调评级以权衡成本风险
智通财经 · 01-14
瑞银：艾马克技术飙涨已反映算力增长预期，下调评级以权衡成本风险
日月光投控斥资28亿扩产 旗下硅品购入联合再生竹南厂房
维库电子市场网 · 01-14
日月光投控斥资28亿扩产 旗下硅品购入联合再生竹南厂房
先进封装火了，2026谁吃香？
半导体产业纵横 · 01-05
先进封装火了，2026谁吃香？
纳斯达克中国金龙指数涨0.86% 热门中概股涨多跌少 禾赛涨3.9%
金吾财讯 · 2025-12-12
纳斯达克中国金龙指数涨0.86% 热门中概股涨多跌少 禾赛涨3.9%
台积电、日月光、Amkor及联电等加速扩产CoWoS
格隆汇 · 2025-12-10
台积电、日月光、Amkor及联电等加速扩产CoWoS
纳斯达克中国金龙指数升幅扩至0.38% 热门中概股多数走高 日月光半导体升4.47%
金吾财讯 · 2025-12-08
纳斯达克中国金龙指数升幅扩至0.38% 热门中概股多数走高 日月光半导体升4.47%
台积电先进封装订单大爆满 扩大委外释单 日月光大赢家
爱集微 · 2025-12-08
台积电先进封装订单大爆满 扩大委外释单 日月光大赢家
纳斯达克中国金龙指数升逾0.5% 热门中概股普升 霸王茶姬涨4.1%
金吾财讯 · 2025-11-28
纳斯达克中国金龙指数升逾0.5% 热门中概股普升 霸王茶姬涨4.1%
美国住房市场困境加剧，James Hardie Industries跌13%
环球市场播报 · 2025-11-06
美国住房市场困境加剧，James Hardie Industries跌13%
异动解读 | AI热潮推动，日月光半导体盘中大涨7.83%
异动解读 · 2025-10-31
异动解读 | AI热潮推动，日月光半导体盘中大涨7.83%
异动解读 | 业绩预期乐观，日月光半导体盘前大涨6.38%
异动解读 · 2025-10-31
异动解读 | 业绩预期乐观，日月光半导体盘前大涨6.38%
异动解读 | 财报预期乐观，日月光半导体夜盘大涨5.92%
异动解读 · 2025-10-31
异动解读 | 财报预期乐观，日月光半导体夜盘大涨5.92%
异动解读 | 日月光半导体夜盘大涨5.92%，季度财报即将发布引发投资者乐观预期
异动解读 · 2025-10-31
异动解读 | 日月光半导体夜盘大涨5.92%，季度财报即将发布引发投资者乐观预期
暂无数据
公司概况
公司名称：
日月光半导体
所属市场：
NYSE
上市日期：
--
主营业务：
日月光投资控股股份有限公司成立于1984年3月23日，是一家根据(中国台湾)公司法成立的股份有限公司，位于中国台湾高雄南泽出口加工区。根据2012年的收入，该公司是全球最大的半导体封装和测试服务独立提供商。该公司的服务包括半导体封装、互连材料生产、前端工程测试、晶圆探测、最终测试服务以及与计算机、外围设备、通信、工业、汽车、存储和服务器应用相关的电子制造服务的集成解决方案。
发行价格：
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| 日月光半导体盘中大涨5.03%，先进封装业务前景乐观及高雄新产线计划成催化剂","url":"https://stock-news.laohu8.com/highlight/detail?id=1120732069","media":"异动解读","labels":["movement"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1120732069?lang=zh_cn&edition=full","pubTime":"2026-02-06 01:36","pubTimestamp":1770313019,"startTime":"0","endTime":"0","summary":"日月光半导体今日盘中股价大幅上涨5.03%，市场表现强劲。消息面上，公司近期在季度财报电话会议上预测，其先进封装业务规模将在2026年翻倍至32亿美元。同时，公司公布的第四季度财务数据显示营收同比增长9.6%，净利润增幅高达58%，业绩表现亮眼。此外，公司宣布计划在今年增加15亿美元的机械设备资本支出，以支持未来增长。另一方面，有报道指出日月光正在高雄建造其首条“类CoWoS-L”先进封装产线，目前正与博通、AMD等潜在客户进行验证，目标在2027年实现量产。市场认为，公司在AI与先进封装领域的积极布局和明确增长蓝图，是推动股价上涨的主要动力。","market":"nz","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"movement","news_rank":0,"length":0,"strategy_id":0,"source":"ai_movement_cn","symbols":["ASX"],"gpt_icon":0},{"id":"2609731453","title":"日月光首条CoWoS落地高雄，台积电“后院”被攻破？","url":"https://stock-news.laohu8.com/highlight/detail?id=2609731453","media":"未来半导体","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2609731453?lang=zh_cn&edition=full","pubTime":"2026-02-05 16:01","pubTimestamp":1770278510,"startTime":"0","endTime":"0","summary":"作为目前唯一能大规模量产CoWoS的厂商，台积电的产能早已被英伟达、AMD、博通等巨头瓜分殆尽。2025年，其CoWoS月产能约为6.5至7万片，2026年预计将翻倍至12至13万片。供应链最新传出，日月光正在高雄K18厂建造其首条“类CoWoS-L”封装产线。日月光的介入，恰好提供了这种可能性。它此前已承接英伟达CoWoS后段的“oS”段订单，并从2025年起启动前段“CoW”计划，且获得了台积电的到厂协助。除了紧追CoWoS，日月光也在打造属于自己的“技术备胎”。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260205180800953ff573&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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｜日月光半导体本季度营收预计增4.70%，机构观点偏乐观","url":"https://stock-news.laohu8.com/highlight/detail?id=1149837528","media":"财报Agent","labels":["earningPreview"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1149837528?lang=zh_cn&edition=full","pubTime":"2026-01-29 10:16","pubTimestamp":1769652967,"startTime":"0","endTime":"0","summary":"日月光半导体将于2026年02月05日公布最新季度财报，市场围绕封测景气复苏与盈利改善展开讨论。市场一致预期本季度总收入为58.53亿美元，同比增长4.70%；EBIT为4.96亿美元，同比增长28.95%；调整后每股收益为0.20美元，同比增长25.00%；若公司在上季度指引中保持封测订单平稳，则本季度毛利率与净利率有望延续改善趋势。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"财报前瞻 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6.8%。台积电：加速扩张在先进封装这条赛道上，台积电无疑是No.1。在技术不断改进升级的同时，台积电还在全力推进先进封装产能扩充。最初规划建设2座CoWoS先进封装厂，现已扩大至8座厂房的宏大规模。整个厂区预计2028年开始量产，届时将成为台积电先进封装产能的又一重镇。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260118114558a437f80b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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旗下硅品购入联合再生竹南厂房","url":"https://stock-news.laohu8.com/highlight/detail?id=2603663334","media":"维库电子市场网","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2603663334?lang=zh_cn&edition=full","pubTime":"2026-01-14 10:07","pubTimestamp":1768356444,"startTime":"0","endTime":"0","summary":"全球半导体封测龙头日月光投控近期再掀扩产浪潮，旗下硅品精密斥资28亿新台币购入联合再生能源位于竹南的厂房，此举标志着集团为应对AI芯片封装需求爆炸性增长的战略布局进一步深化。作为台积电先进封装主要委外伙伴，日月光投控近两年已累计投入超百亿元扩产，其中硅品在二林厂、斗六厂新建产能基础上，此次竹南厂房的收购将形成产能协同效应。据内部规划，日月光投控2026年先进封装营收目标将突破26亿美元，较当前增长逾60%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260114105228a4c124a2&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, 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18:18","pubTimestamp":1767608313,"startTime":"0","endTime":"0","summary":"日月光投控的先进封装产能预计将由2025 年底的5 Kwpm，快速成长至2026 年底的20 Kwpm。在先进封装产能陆续开出、产品组合转佳以及台积电释出更多先进封装及CP 测试订单的挹注下，OSAT产业产值预计2026年将加速年增至17%，达到8,600亿元新高。由于台积电CoWoS 新增扩产需求，以及OSAT 端CoWoS 扩产将于2026 年进入成长加速期，整体设备厂务族群2026 年营收预计将成长17%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260105184526a6f5a666&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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纳斯达克中国金龙指数涨0.86%；热门中概股涨多跌少，禾赛涨3.9%，金山云涨3.8%，网易、再鼎医药、亚朵涨近3%；小马智行、百度、日月光半导体、台积电跌近2%，亚玛芬体育跌1.4%，BOSS直聘跌1.3%。","market":"sh","thumbnail":"https://static.szfiu.com/news/20250107/OTc4NDY1YzgwYTY5ZDI5OGQwMTAxMzU2NDM1Mjg5Ng==.png","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20250107/OTc4NDY1YzgwYTY5ZDI5OGQwMTAxMzU2NDM1Mjg5Ng==.png"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"295347","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["LU1152091168.USD","LU2663582299.SGD","LU2360032135.SGD","LU0353189680.USD","KC","BK4607","ASX","LU1868837722.USD","TTTN","ATAT","LU2237443978.SGD","LU0965509010.AUD","ZLAB","BK4563","LU2054465674.USD","LU1989772923.USD","IE0004445239.USD","LU0965508806.USD","BK4527","NTES","BZ","IE00BZ199S13.USD","LU0889565833.HKD","LU2750360641.GBP","LU2028103732.USD","LU2294711713.HKD","LU2460026573.USD","AS","LU1267930813.SGD","03145","LU0594300179.USD","IE00BHPRN162.USD","LU1880383440.USD","LU2750360997.AUD","BK4605","LU0572939691.SGD","LU0994945656.USD","LU0109392836.USD","LU1508157978.USD","LU1037948541.HKD","02525","HSAI","BK4526","BK4608","LU1282649810.SGD","LU1989772840.SGD","LU1623119135.USD","LU1688375341.USD"],"gpt_icon":0},{"id":"2590218300","title":"台积电、日月光、Amkor及联电等加速扩产CoWoS","url":"https://stock-news.laohu8.com/highlight/detail?id=2590218300","media":"格隆汇","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2590218300?lang=zh_cn&edition=full","pubTime":"2025-12-10 17:18","pubTimestamp":1765358316,"startTime":"0","endTime":"0","summary":"格隆汇12月10日｜据台湾电子时报，半导体设备厂商透露，台积电与日月光集团、Amkor与联电等都在加速扩充先进封装CoWoS产能，从订单分布观察，2026~2027年GPU、ASIC客户需求均超出预期。其中，英伟达持续预订台积CoWoS过半产能，博通与AMD分别占据二、三名。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202512101719229535534c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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