德福科技(301511)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

301511 德福科技

已收盘 02-13 15:00:00

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17:37","pubTimestamp":1770889076,"startTime":"0","endTime":"0","summary":"证券之星消息，近日德福科技披露，截至2026年1月31日公司股东户数为6.24万户，较1月20日减少1196.0户，减幅为1.88%。在电池行业个股中，德福科技股东户数高于行业平均水平，截至1月31日，电池行业平均股东户数为5.85万户。从股价来看，2026年1月20日至2026年1月31日，德福科技区间跌幅为3.16%，在此期间股东户数减少1196.0户，减幅为1.88%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026021200028786.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","301511"],"gpt_icon":0},{"id":"2610951109","title":"德福科技：公司目前HVLP系列产品送样测试进展顺利","url":"https://stock-news.laohu8.com/highlight/detail?id=2610951109","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2610951109?lang=zh_cn&edition=full","pubTime":"2026-02-12 09:18","pubTimestamp":1770859087,"startTime":"0","endTime":"0","summary":"证券之星消息，德福科技(301511)02月11日在投资者关系平台上答复投资者关心的问题。投资者提问：请问贵公司的hvlp5铜箔，测试通过了吗？德福科技回复：尊敬的投资者您好，公司目前HVLP系列产品送样测试进展顺利，感谢您的关注。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026021200006612.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","301511"],"gpt_icon":0},{"id":"2610694591","title":"德福科技：载体铜箔可应用于IC封装载板等","url":"https://stock-news.laohu8.com/highlight/detail?id=2610694591","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2610694591?lang=zh_cn&edition=full","pubTime":"2026-02-10 11:36","pubTimestamp":1770694567,"startTime":"0","endTime":"0","summary":"证券之星消息，德福科技(301511)02月09日在投资者关系平台上答复投资者关心的问题。投资者提问：公司的产品有用到存储芯片？还有光模块领域？德福科技回复：尊敬的投资者您好，公司自主研发量产的载体铜箔可应用于IC封装载板、高密度互连技术板、Coreless基板、IC封装制程材料、HDI领域等用途。感谢您的关注。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026021000015233.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"2","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["301511","BK0214"],"gpt_icon":0},{"id":"2610691751","title":"德福科技：公司目前高端产品出货占比持续逐月提升","url":"https://stock-news.laohu8.com/highlight/detail?id=2610691751","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2610691751?lang=zh_cn&edition=full","pubTime":"2026-02-10 11:33","pubTimestamp":1770694390,"startTime":"0","endTime":"0","summary":"证券之星消息，德福科技(301511)02月09日在投资者关系平台上答复投资者关心的问题。投资者提问：前期公司回复说高端电子电路铜箔RTF1-3和HVLP1-4等产品目前已实现批量供应，请问高端产品占总产能多少比例，各自的出货量在是否是增是减，1月的出货量多少？德福科技回复：尊敬的投资者您好，公司目前高端产品出货占比持续逐月提升，感谢您的关注！以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026021000014990.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["301511","BK0214"],"gpt_icon":0},{"id":"2608285878","title":"德福科技：高端电子电路铜箔RTF1-3和HVLP1-4等产品目前均已实现批量供应","url":"https://stock-news.laohu8.com/highlight/detail?id=2608285878","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2608285878?lang=zh_cn&edition=full","pubTime":"2026-02-03 15:36","pubTimestamp":1770104178,"startTime":"0","endTime":"0","summary":"证券之星消息，德福科技(301511)02月02日在投资者关系平台上答复投资者关心的问题。投资者提问：电子铜箔进度如何，开始批量供货了吗？预计高级PCB铜箔今年会对公司业绩有正向作用吗？德福科技回复：尊敬的投资者您好，目前公司高端电子电路铜箔RTF1-3和HVLP1-4等产品目前均已实现批量供应，高端产品占比的持续提升将增厚公司的利润。感谢您的关注。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026020300020914.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","301511"],"gpt_icon":0},{"id":"2608867931","title":"德福科技（301511）披露首次回购公司股份暨回购股份进展公告，2月2日股价下跌3.3%","url":"https://stock-news.laohu8.com/highlight/detail?id=2608867931","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2608867931?lang=zh_cn&edition=full","pubTime":"2026-02-02 22:22","pubTimestamp":1770042143,"startTime":"0","endTime":"0","summary":"截至2026年2月2日收盘，德福科技报收于28.71元，较前一交易日下跌3.3%，最新总市值为180.97亿元。该股当日开盘29.65元，最高29.98元，最低28.66元，成交额达3.8亿元，换手率为3.46%。公司于近日披露《关于首次回购公司股份暨回购股份进展的公告》。本次回购符合相关法律法规及公司董事会审议通过的回购方案。截至2026年1月30日，公司累计回购股份677,000股，支付总金额为20,097,853元。公司后续将根据市场情况继续实施回购计划，并按规定履行信息披露义务。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026020200039262.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["301511","BK0214"],"gpt_icon":0},{"id":"2605149226","title":"德福科技（301511）披露回购股份报告书，1月22日股价上涨0.55%","url":"https://stock-news.laohu8.com/highlight/detail?id=2605149226","media":"证券之星","labels":["shareholding","buyback"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2605149226?lang=zh_cn&edition=full","pubTime":"2026-01-22 22:10","pubTimestamp":1769091026,"startTime":"0","endTime":"0","summary":"截至2026年1月22日收盘，德福科技报收于31.2元，较前一交易日上涨0.55%，最新总市值为196.66亿元。该股当日开盘31.36元，最高31.8元，最低30.9元，成交额达5.75亿元，换手率为4.91%。公司于近日发布公告称，九江德福科技股份有限公司拟使用自有资金和自筹资金，以集中竞价交易方式回购公司股份，用于实施员工持股计划或股权激励。公司已开立回购专用证券账户，并取得银行专项贷款承诺。董事会已审议通过该方案，无需提交股东大会审议。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026012200040547.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding,buyback","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","301511"],"gpt_icon":0},{"id":"2605617280","title":"德福科技(301511.SZ)发预盈，预计2025年度归母净利润9700万元至1.25亿元，扭亏为盈","url":"https://stock-news.laohu8.com/highlight/detail?id=2605617280","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2605617280?lang=zh_cn&edition=full","pubTime":"2026-01-21 16:48","pubTimestamp":1768985302,"startTime":"0","endTime":"0","summary":"智通财经APP讯，德福科技(301511.SZ)披露2025年度业绩预告，公司预计归属于上市公司股东的净利润9700万元至1.25亿元，扭亏为盈;扣除非经常性损益后的净利润7000万元至9300万元。报告期内，下游市场需求显著回暖，公司凭借客户与技术积累，主营产品出货量实现同比显著增长。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1395613.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"2","news_top_title":"德福科技(301511.SZ)发预盈，预计2025年度归母净利润9700万元至1.25亿元，扭亏为盈","news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["301511"],"gpt_icon":0},{"id":"2604162950","title":"德福科技：超薄载体铜箔已实现批量出货","url":"https://stock-news.laohu8.com/highlight/detail?id=2604162950","media":"证券之星","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2604162950?lang=zh_cn&edition=full","pubTime":"2026-01-20 15:04","pubTimestamp":1768892656,"startTime":"0","endTime":"0","summary":"证券之星消息，德福科技(301511)01月20日在投资者关系平台上答复投资者关心的问题。投资者提问：最近半导体市场需求旺盛，公司用于ic封装的载体铜箔经过客户认证后是否实现批量供货。德福科技回复：尊敬的投资者您好，公司自主研发的超薄载体铜箔已实现批量出货。感谢您的关注。以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026012000017980.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["BK0214","301511"],"gpt_icon":0},{"id":"2604394831","title":"德福科技（301511）披露为子公司提供担保的进展公告，1月19日股价下跌0.92%","url":"https://stock-news.laohu8.com/highlight/detail?id=2604394831","media":"证券之星","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2604394831?lang=zh_cn&edition=full","pubTime":"2026-01-19 22:10","pubTimestamp":1768831835,"startTime":"0","endTime":"0","summary":"截至2026年1月19日收盘，德福科技报收于31.34元，较前一交易日下跌0.92%，最新总市值为197.54亿元。该股当日开盘31.45元，最高31.65元，最低31.26元，成交额达5亿元，换手率为4.25%。公司近日发布公告称，九江德福科技股份有限公司于2025年11月27日召开临时股东会，审议通过为子公司提供总额不超过1,323,600万元的担保。上述担保在审批额度范围内，被担保方均非失信被执行人。公司认为担保风险可控，符合整体利益。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://stock.stockstar.com/RB2026011900035518.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stockstar","symbols":["301511","BK0214"],"gpt_icon":0},{"id":"2604920050","title":"海外折戟转向国内布局，190亿巨头德福科技抛新并购谋破局","url":"https://stock-news.laohu8.com/highlight/detail?id=2604920050","media":"市场资讯","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2604920050?lang=zh_cn&edition=full","pubTime":"2026-01-18 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