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04335 英特尔-T
休市中 12-05 16:00:00
300.000
+0.000
0.00%
最高
300.000
最低
300.000
成交量
0.00
今开
300.000
昨收
300.000
日振幅
0.00%
总市值
1.43万亿
流通市值
1.43万亿
总股本
47.70亿
成交额
0.00
换手率
0.00%
流通股本
47.70亿
市净率
--
ROE
--
每股收益
0.00
52周最高
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52周最低
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市盈率
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股息
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股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
免责声明:香港交易所资讯服务有限公司、其控股公司及/或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度,但不能保证其绝对准确和可靠,且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任(不管是否侵权法下的责任或合约责任又或其它责任)
资讯
新帖
简况
英特尔18A工艺良率显著提升,先进封装成代工业务破局关键
未来半导体 · 12-05 17:32
英特尔18A工艺良率显著提升,先进封装成代工业务破局关键
消息称英特尔14A制程已获两家客户好评,预计2027年量产节点进展顺利
砍柴网 · 12-03
消息称英特尔14A制程已获两家客户好评,预计2027年量产节点进展顺利
英特尔股价下跌,回吐分析师其与苹果合作预期带来的涨幅
老虎资讯综合 · 12-02
英特尔股价下跌,回吐分析师其与苹果合作预期带来的涨幅
再次进入“果链”!英特尔或将为苹果代工芯片
元力社 · 12-01
再次进入“果链”!英特尔或将为苹果代工芯片
Intel或于2027年采用18A-P工艺节点代工苹果M系列芯片
PConline太平洋... · 12-01
Intel或于2027年采用18A-P工艺节点代工苹果M系列芯片
取代GPU 量子计算是AI泡沫的终结者
快科技 · 12-01
取代GPU 量子计算是AI泡沫的终结者
电子行业研究周报:GEMINI3.0强化TPU降本逻辑 AI眼镜有望迈向起量元年
开源证券 · 11-30
电子行业研究周报:GEMINI3.0强化TPU降本逻辑 AI眼镜有望迈向起量元年
科技行业2026年展望:AI算法迭代扩容算力底座,生态繁荣重塑增长边界
浦银国际研究 · 11-28
科技行业2026年展望:AI算法迭代扩容算力底座,生态繁荣重塑增长边界
CoWOS迎来劲敌
电子时代 · 11-27
CoWOS迎来劲敌
美满电子、联发科,英特尔EMIB迎来新客户?
半导体产业纵横 · 11-24
美满电子、联发科,英特尔EMIB迎来新客户?
英特尔CEO陈立武否认新聘高管窃取台积电技术传闻:这纯属谣言和猜测,毫无根据!我们尊重知识产权
格隆汇 · 11-21
英特尔CEO陈立武否认新聘高管窃取台积电技术传闻:这纯属谣言和猜测,毫无根据!我们尊重知识产权
英特尔副总裁:下一代AI PC正在研发
DoNews · 11-20
英特尔副总裁:下一代AI PC正在研发
传台积电75岁退休老将携2nm机密回到“老东家”英特尔担任研发副总裁,带走了“20多箱”涉及台积电先进工艺技术的机密资料
格隆汇 · 11-20
传台积电75岁退休老将携2nm机密回到“老东家”英特尔担任研发副总裁,带走了“20多箱”涉及台积电先进工艺技术的机密资料
英特尔:1.8纳米制程工艺AI PC平台已投入量产
澎湃新闻 · 11-19
英特尔:1.8纳米制程工艺AI PC平台已投入量产
全球科技行业周报:0penAl发布GPT-5.1系列模型,阿里启动“千问”项目
华安证券 · 11-16
全球科技行业周报:0penAl发布GPT-5.1系列模型,阿里启动“千问”项目
英特尔确认Nova Lake支持AVX10,包括桌面和移动系列
PChome科技 · 11-14
英特尔确认Nova Lake支持AVX10,包括桌面和移动系列
人工智能,引起硬盘短缺
半导体芯闻 · 11-10
人工智能,引起硬盘短缺
英特尔中国,大调整!
半导体封测 · 11-09
英特尔中国,大调整!
英特尔“Bartlett Lake S 12P”处理器参数曝光,旗舰型号锁定125W功耗
DoNews · 11-06
英特尔“Bartlett Lake S 12P”处理器参数曝光,旗舰型号锁定125W功耗
部分Windows设备更新后或触发BitLocker恢复模式
DoNews · 11-05
部分Windows设备更新后或触发BitLocker恢复模式
公司概况
公司名称:
英特尔-T
所属市场:
SEHK
上市日期:
--
主营业务:
英特尔公司从事半导体的设计和制造。该公司运营三个分部。英特尔产品分部包括客户端计算事业部(CCG)、数据中心和人工智能(DCAI)、网络和边缘(NEX)。CCG从事实现个人计算机体验的长期操作系统、系统架构、硬件和应用程序集成。DCAI部门为云服务提供商和企业客户提供工作负载优化的解决方案,以及为通信服务提供商提供硅片设备。NEX部门帮助网络和边缘计算系统从不灵活的固定功能硬件转变为在可编程硬件上运行云原生软件的通用计算、加速和网络设备。英特尔代工厂分部包括代工厂技术开发、代工厂制造和供应链以及代工厂服务组织。所有其他分部包括Altera、Mobileye和其他。
发行价格:
--
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PDK,他听到的评价仍相当积极,且 14A 是在 18A 量产经验基础上进一步演进。英特尔此前披露,其单季已处理逾 3 万片晶圆,并在某些关键层的工艺步骤上从 40 道减少至不足 10 道,使制程周期明显缩短。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251203110751a72078cd&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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年首次宣布采用英特尔处理器以来,苹果与英特尔的关系经历了起伏。上周,英特尔还卷入了台积电提起的一项诉讼。","market":"us","thumbnail":"https://static.tigerbbs.com/c74be4c2a08964ef2daf32217f693b44","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/c74be4c2a08964ef2daf32217f693b44"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"-1","news_top_title":"英特尔股价下跌,回吐分析师其与苹果合作预期带来的涨幅","news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["INTC","04335"],"gpt_icon":1},{"id":"2588822772","title":"再次进入“果链”!英特尔或将为苹果代工芯片","url":"https://stock-news.laohu8.com/highlight/detail?id=2588822772","media":"元力社","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2588822772?lang=zh_cn&edition=full","pubTime":"2025-12-01 17:45","pubTimestamp":1764582352,"startTime":"0","endTime":"0","summary":"11月28日,知名分析师郭明透露消息,英特尔预计最快在2027年为苹果代工最低端的M系列处理器,这意味着英特尔在时隔多年后将再次进入“果链”。自2020年苹果全面转向自研的Apple Silicon芯片,放弃英特尔x86处理器后,双方的合作曾一度宣告结束。英特尔不再负责芯片设计,而是转型成为苹果的晶圆代工伙伴,负责生产入门款M系列处理器,这些处理器将应用于MacBook Air、iPad Air及iPad Pro等设备。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251201174806a4c57f42&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":"7722eafa4f2e24ca1036ab2cb5cec86e","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251201174806a4c57f42&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["04335","BK1163"],"gpt_icon":1},{"id":"2588728217","title":"Intel或于2027年采用18A-P工艺节点代工苹果M系列芯片","url":"https://stock-news.laohu8.com/highlight/detail?id=2588728217","media":"PConline太平洋...","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2588728217?lang=zh_cn&edition=full","pubTime":"2025-12-01 11:56","pubTimestamp":1764561374,"startTime":"0","endTime":"0","summary":"苹果供应链资深分析师郭明透露,Intel有望在2027年为苹果代工先进的M系列芯片。此外有消息称,苹果正等待Intel在2026年第一季度推出18A-P工艺的1.0或1.1 版本PDK,该版本发布后,苹果将率先将其用于MacBook Air与iPad Pro设备所搭载的入门级M系列芯片。Intel代工业务计划在2027年实现收支平衡,而拿下苹果这类大客户无疑将进一步巩固其市场地位。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251201115829a4c4d125&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Global,从而深入接触量子计算领域。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251201095117a71bb272&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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AI眼镜有望迈向起量元年","url":"https://stock-news.laohu8.com/highlight/detail?id=2587794509","media":"开源证券","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2587794509?lang=zh_cn&edition=full","pubTime":"2025-11-30 00:00","pubTimestamp":1764432000,"startTime":"0","endTime":"0","summary":"行业速递:Gemini 3.0 强化TPU 逻辑,AI 眼镜有望迈向“元年”终端:AI 眼镜进入新品密集发布期。海外方面,XREAL 宣布将在12 月发布与谷歌合作的AR 眼镜Project Aura。综合来看,2025 年有望成为AI 眼镜元年,2026 年AI 眼镜则有望快速起量。沐曦股份注册也已获批,预计将于12 月2 日询价,5 日申购。美光明年的HBM3E和HBM4 供货已全部售罄,HBM4 将于明年第二季度开始出货。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251130193645a71abe6b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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ASIC客户考虑范围。在此情况下,英特尔EMIB技术成替代方案。其中,EMIB 技术系列在芯片互连领域取得了重要突破。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251124181347a70e1811&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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