龙腾虎乐
10-10
只有新概念是远远不够的
[财迷]
大家都很看重净利润还能否大幅提升
[财迷]
[财迷]
英伟达欲加码玻璃基板决战AI先进封装 A股相关企业抢先布局
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</p></body></html>","text":"只有新概念是远远不够的[财迷] 大家都很看重净利润还能否大幅提升[财迷] [财迷]","highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/616748510908864","repostId":2674615178,"repostType":2,"repost":{"id":"2674615178","kind":"news","pubTimestamp":1791575736,"share":"https://www.laohunote.com/m/news/2674615178?lang=zh_CN&edition=full","pubTime":"2026-10-10 03:55","market":"sh","language":"zh","title":"英伟达欲加码玻璃基板决战AI先进封装 A股相关企业抢先布局","url":"https://stock-news.laohu8.com/highlight/detail?id=2674615178","media":"中国经营网","summary":"英伟达正在加码玻璃基板，试图为下一代GPU找到新的封装底座。日前，有消息称英伟达正在评估玻璃基板方案，并与德国设备厂商SCHMID及其他企业推进相关设备开发，还希望韩国、日本等国的面板厂商在两年内完成玻璃基板开发。","content":"<div>\n<p>英伟达正在加码玻璃基板，试图为下一代GPU找到新的封装底座。 日前，有消息称英伟达正在评估玻璃基板方案，并与德国设备厂商SCHMID及其他企业推进相关设备开发，还希望韩国、日本等国的面板厂商在两年内完成玻璃基板开发。而SCHMID在财报会上也披露，其正与英伟达、英特尔、AMD供应链中的核心企业共同开发玻璃基板设备，但SCHMID高管指出，玻璃通孔（TGV）的金属化环节仍存在技术难点，客户认证尚未...</p>\n\n<a 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ETF"},"source_url":"http://finance.eastmoney.com/a/202610103891624763.html","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2674615178","content_text":"英伟达正在加码玻璃基板，试图为下一代GPU找到新的封装底座。 日前，有消息称英伟达正在评估玻璃基板方案，并与德国设备厂商SCHMID及其他企业推进相关设备开发，还希望韩国、日本等国的面板厂商在两年内完成玻璃基板开发。而SCHMID在财报会上也披露，其正与英伟达、英特尔、AMD供应链中的核心企业共同开发玻璃基板设备，但SCHMID高管指出，玻璃通孔（TGV）的金属化环节仍存在技术难点，客户认证尚未完成。 《中国经营报》记者注意到，虽然两种表述并不完全等同，但也明确释放出一个信号：头部客户正在拉动玻璃基板工艺成熟，尤其是大尺寸封装、TGV以及面板级制造。然而，玻璃基板仍存在技术“卡点”，难以量产。 “面板厂对玻璃基板材料的特性掌握度较佳，因此在切入这个领域时具备一定优势，但这并不代表能够立即提供相关材料给客户。”行业分析机构TrendForce集邦咨询分析师范博毓表示。 “我们只能说相关产品还处于研发阶段。”此前，国内一家玻璃基板公司高管赵鸣（化名）对记者表示，半导体封装用玻璃基板和显示面板用玻璃基板在制造上没有特别之处，TGV是前者的核心壁垒。 华创证券近期发布的一份研报指出，全球玻璃基板正由技术验证加速迈向中试、客户认证及量产导入，海外厂商产业化进度领先，国内部分设备、材料及加工企业已由研发进一步进入送样、中试、客户验证乃至小批量生产阶段。 制造极难台积电推迟量产 玻璃基板，毋庸置疑是今年材料科技的热门赛道之一。 本报此前已报道，玻璃基板是英伟达和台积电“严选”的下一代算力芯片的先进封装介质，基于此台积电和英伟达联合定义了下一代先进封装技术平台CoPoS（Chip-on-Panel-on-Substrate，面板级芯片封装）化圆为方，将传统的圆形晶圆（直径300mm）改为矩形面板（规格如310mm×310mm），突破传统圆形晶圆的面积与成本限制，核心承载由传统的ABF有机载板或硅中介层换成玻璃基板。 根据集邦科技的相关分析，台积电的CoPoS量产表如下：短期聚焦310mm×310mm基板尺寸，2026年是设备与材料商的验证关键期，2027年预计进入试产，2028年下半年正式量产。 此外，英特尔、AMD、苹果、三星电机、SK海力士等也在布局玻璃基板。 其中，英特尔是最早布局玻璃基板的公司。早在2013年，该公司就开始做“用玻璃替代有机基板”的预研，2023年正式发布玻璃芯基板（Glass Core Substrate）先进封装路线图；今年1月，英特尔首款采用玻璃基板技术的产品Xeon 6+“Clearwater Forest”处理器在2026年国际消费电子展（CES）上首次亮相。 值得注意的是，华创证券研报指出，面向半导体先进封装的玻璃芯基板长期发展空间巨大，除AI/HPC（高性能计算）与HBM（高带宽内存）以外，面板级封装趋势有望进一步放大玻璃在大尺寸、高平整度及低翘曲方面的适配优势，CPO（光电共封装）及高频RF则有望持续打开新的应用边界。 在CPO领域，上海易卜半导体有限公司总经理李文启表示，台积电的CoPoS工艺基本上已经做到了光电合封性能上的极致，但问题是制造极端困难，良品率极低。 “台积电原来雄心勃勃说今年要进入量产，但最近几个星期我拿到的信息是他们已经推迟到2028年量产。”李文启表示，尽管推迟了两年，但也相当不容易。 国内优先在CPO落地 虽然英特尔是最早把玻璃基板做成工程样的厂商，但至今也没有全面实现量产。根据业界消息，英特尔正拓展MicroLED基板先进封装赛道，并传出与MicroLED厂商友达展开合作，共同开发CPO与高密度算力芯片整合方案。 “由于面板与半导体产业在许多标准上存在很大差异，若要符合半导体客户的需求，仍需持续进行投资及规格推进，同时也需要花较长时间与客户沟通。”范博毓表示，面板厂须取得半导体客户的信任，证明其具备稳定供应玻璃基板材料的能力。 而在国内方面，多个厂商持续推进玻璃基板中试线建设、客户验证及小批量出货，TGV成孔、金属化、RDL等环节国产配套逐步完善。 在京东方年度活动IPC 2026开幕式上，京东方（000725.SZ）董事长陈炎顺表示，公司正准备投资半导体玻璃基板载板量产线。 据悉，在玻璃基封装载板领域，京东方拥有玻璃基封装载板的全流程工艺，已在TGV开孔、深孔填铜、增层布线等核心制程上实现技术突破；20层大尺寸玻璃基载板样品已通过六项半导体级信赖性测试，送样国内头部AI芯片厂商，部分客户进入技术测试阶段。 7月底，蓝思科技（300433.SZ、06613.HK）公告称，全资子公司蓝思国际（香港）有限公司与英特尔签署合作备忘录，双方将就玻璃基板穿孔成型、高精度激光加工、金属化通孔沉积及多层互连布线等关键工艺（包括但不限于上述内容）相关的潜在合作进行讨论和评估。 而沃格光电（603773.SH）方面近日披露，公司在TGV玻璃基线路板业务领域深耕多年，正积极推进相关领域玻璃基产品开发和送样验证；此外，该公司湖北一期年产10万平方米TGV产线2026年上半年完成多家客户认证，进入小批量供货阶段。 今年7月，凯盛科技（600552.SH）公告投资1.5亿元在蚌埠建设TGV先进封装玻璃中试线，开展关键工艺优化、产品试制与客户验证。 另外，TCL科技（000100.SZ）6月出资5亿元设立深圳市云启新材料（持股51%），专攻TGV配套特种涂层、低热膨胀介质胶膜等封装材料。 在产业链配套（设备/材料）方面，国产化加速，关键环节已出货。 比如帝尔激光（300776.SZ）实现晶圆级、面板级TGV激光微孔技术全面覆盖，面板级玻璃基板通孔设备已实现出货，2026年实现海外销售并拿到小批量复购订单；捷佳伟创推出TGV玻璃基板专用气泡清洗设备与全自动填孔电镀设备，完成全流程测试并出货。 有分析认为，国内具备显示玻璃产业的产能与工艺基础，叠加AI算力产业链的本土需求牵引，随着设备与材料国产化推进，当前国内玻璃基板产业在光模块/CPO场景落地进度领先，AI芯片先进封装仍以客户送样验证为主。（文章来源：中国经营网）","news_type":1,"symbols_score_info":{"TTEQ":0.6,"CMAG":0.6,"CNEQ":0.6,"NVYY":0.6,"NVDO":0.6,"NVC":0.6,"JGRO":0.6,"ILDR":0.6,"DIPS":0.6,"SMHX":0.6,"SOXQ":0.6,"SPTE":0.6,"09788":0.6,"CLSE":0.6,"NVD3.UK":0.6,"SOXX":0.6,"NVDQ":0.6,"NVDW":0.6,"SNVDAmain":0.6,"NVDS.UK":0.6,"USD":0.6,"AIPI":0.6,"THMR":0.6,"NVDU":0.6,"ANV":0.6,"NVDL":0.6,"CHPX":0.6,"ABFL":0.6,"SMH":0.6,"2NVD.UK":0.6,"SOXY":0.6,"IXN":0.6,"NVII":0.6,"NVD2.UK":0.6,"ESUM":0.6,"09388":0.6,"EFIV":0.6,"AIFD":0.6,"GAMR":0.6,"WISE":0.6,"TEK":0.6,"NVIW.SI":0.6,"TTXU":0.6,"FDTX":0.6,"METV":0.6,"NVDS":0.6,"SNVD.UK":0.6,"NVDB":0.6,"LFGY":0.6,"FAI":0.6,"3NVD.UK":0.6,"IETC":0.6,"ROM":0.6,"VT":0.6,"XLK":0.6,"NVD":0.6,"ESLG":0.6,"SNPE":0.6,"USXF":0.6,"07388":0.6,"TYLG":0.6,"SHOC":0.6,"07788":0.6,"AGOX":0.6,"NVDX":0.6,"VGT":0.6,"NVDA":1.91,"TRFK":0.6,"NVDY":0.6,"NULC":0.6,"NVDG":0.6,"NVDD":0.6,"FTEC":0.6}},"isVote":1,"tweetType":1,"viewCount":367,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":72,"optionInvolvedFlag":false,"subscribersOnly":false,"subscribersOnlyAccessible":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/616748510908864"}
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