这篇文章不错，转发给_老虎社区_美港股上老虎 - 老虎社区

这篇文章不错，转发给大家看看

三星电机与高通共同开发有机桥 2.1D 封装技术

免责声明：上述内容仅代表发帖人个人观点，不构成本平台的任何投资建议。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"detailType":1,"isChannel":false,"data":{"magic":2,"id":608011416319264,"tweetId":"608011416319264","gmtCreate":1789463875463,"gmtModify":1789463877649,"author":{"id":3546249304196282,"idStr":"3546249304196282","authorId":3546249304196282,"authorIdStr":"3546249304196282","name":"火火兔爸","avatar":"https://static.tigerbbs.com/1914631c23e50a7645217a36cc9d9598","vip":1,"userType":1,"introduction":"","boolIsFan":false,"boolIsHead":false,"hat":"https://static.tigerbbs.com/9fbaa680ff01ef22199d81a0f09ea1d9","crmLevel":9,"crmLevelSwitch":1,"currentWearingBadge":{"badgeId":"35ec162348d5460f88c959321e554969-3","templateUuid":"35ec162348d5460f88c959321e554969","name":"传说交易员","description":"证券或期货账户累计交易次数达到300次","bigImgUrl":"https://static.tigerbbs.com/656db16598a0b8f21429e10d6c1cb033","smallImgUrl":"https://static.tigerbbs.com/03f10910d4dd9234f9b5702a3342193a","grayImgUrl":"https://static.tigerbbs.com/0c767e35268feb729d50d3fa9a386c5a","redirectLinkEnabled":0,"hasAllocated":1,"isWearing":1,"stampPosition":0,"hasStamp":0,"allocationCount":1,"allocatedDate":"2021.12.21","exceedPercentage":"93.98%","individualDisplayEnabled":0},"individualDisplayBadges":[],"wearingBadges":[{"categoryType":1100,"badgeId":"35ec162348d5460f88c959321e554969-3","name":"传说交易员","description":"证券或期货账户累计交易次数达到300次","smallImgUrl":"https://static.tigerbbs.com/03f10910d4dd9234f9b5702a3342193a","bigImgUrl":"https://static.tigerbbs.com/656db16598a0b8f21429e10d6c1cb033","isScarce":0,"effectEnabled":0,"redirectLinkEnabled":0,"redirectLinkValidityFrom":0,"redirectLinkValidityTo":9223372036854776000,"sortingWeight":0,"wearable":0}],"fanSize":487,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"title":"","html":"<html><head></head><body>这篇文章不错，转发给大家看看</body></html>","htmlText":"<html><head></head><body>这篇文章不错，转发给大家看看</body></html>","text":"这篇文章不错，转发给大家看看","highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://laohu8.com/post/608011416319264","repostId":2667508406,"repostType":2,"repost":{"id":"2667508406","kind":"highlight","weMediaInfo":{"introduction":"链捕手ChainCatcher 成立于 2018 年，是一家领先的中文 Web3 媒体及数据服务商。","home_visible":1,"media_name":"链捕手","id":"1041503808","head_image":"https://community-static.tradeup.com/news/64f0784cc29a0d0070f6e968ef6ec7f5"},"pubTimestamp":1789382293,"share":"https://www.laohunote.com/m/news/2667508406?lang=zh_CN&edition=full","pubTime":"2026-09-14 18:38","market":"sh","language":"zh","title":"三星电机与高通共同开发有机桥 2.1D 封装技术","url":"https://stock-news.laohu8.com/highlight/detail?id=2667508406","media":"链捕手","summary":" ChainCatcher 消息，三星电机与高通正在共同开发用于 2.1D 封装的有机桥技术，相关开发与验证已进行一年以上。有机桥类似英特尔 EMIB 所用硅桥，但采用有机材料并以基板工艺制作，用于连接同一封装内的多颗半导体芯片。三星电机在带凹槽的 FC-BGA 基板中埋入有机桥，连接高通芯片并评估性能与可靠性。高通正考虑将其用于数据中心大型多芯片半导体，并于 2024 年 10 月申请相关专利。三星电机还与多家其他客户并行开发该技术。有机桥目标为 5 至 7 层再布线层，线宽与间距 1.5 至 2 微米、过孔 4 至 5 微米，芯片间图案密度达每毫米 500 至 1000 个。三星电机自行试制评估样品，同时评估外部供应，并与三星电子晶圆代工厂合作进行封装评估。 ","content":"<html><body><p>ChainCatcher 消息，<a href=\"https://laohu8.com/S/SMSN.UK\">三星</a>电机与高通正在共同开发用于 2.1D 封装的有机桥技术，相关开发与验证已进行一年以上。有机桥类似英特尔 EMIB 所用硅桥，但采用有机材料并以基板工艺制作，用于连接同一封装内的多颗半导体芯片。</p><p>三星电机在带凹槽的 FC-BGA 基板中埋入有机桥，连接高通芯片并评估性能与可靠性。高通正考虑将其用于数据中心大型多芯片半导体，并于 2024 年 10 月申请相关专利。三星电机还与多家其他客户并行开发该技术。</p><p>有机桥目标为 5 至 7 层再布线层，线宽与间距 1.5 至 2 微米、过孔 4 至 5 微米，芯片间图案密度达每毫米 500 至 1000 个。三星电机自行试制评估样品，同时评估外部供应，并与<a href=\"https://laohu8.com/S/SSNLF\">三星电子</a>晶圆代工厂合作进行封装评估。</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>三星电机与高通共同开发有机桥 2.1D 封装技术</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n三星电机与高通共同开发有机桥 2.1D 封装技术\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1041503808\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/64f0784cc29a0d0070f6e968ef6ec7f5);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">链捕手 </p>\n<p class=\"h-time\">2026-09-14 18:38</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html><body><p>ChainCatcher 消息，<a href=\"https://laohu8.com/S/SMSN.UK\">三星</a>电机与高通正在共同开发用于 2.1D 封装的有机桥技术，相关开发与验证已进行一年以上。有机桥类似英特尔 EMIB 所用硅桥，但采用有机材料并以基板工艺制作，用于连接同一封装内的多颗半导体芯片。</p><p>三星电机在带凹槽的 FC-BGA 基板中埋入有机桥，连接高通芯片并评估性能与可靠性。高通正考虑将其用于数据中心大型多芯片半导体，并于 2024 年 10 月申请相关专利。三星电机还与多家其他客户并行开发该技术。</p><p>有机桥目标为 5 至 7 层再布线层，线宽与间距 1.5 至 2 微米、过孔 4 至 5 微米，芯片间图案密度达每毫米 500 至 1000 个。三星电机自行试制评估样品，同时评估外部供应，并与<a href=\"https://laohu8.com/S/SSNLF\">三星电子</a>晶圆代工厂合作进行封装评估。</p></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"","relate_stocks":{"LU1069344957.HKD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (HKD) INC","BK4612":"AI芯片","BK4515":"5G概念","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","SG9999015945.SGD":"LionGlobal Disruptive Innovation Fund A SGD","BK4579":"人工智能","SG9999015986.USD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (USD) ACC","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","LU1066051225.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AC\" (USD) ACC","BK4605":"半导体精选","LU1066051498.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (USD) INC","LU1035775433.USD":"AB SICAV I - AMERICAN GROWTH PORTFOLIO \"AD\" (USD) INC","LU0868494708.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) INC","LU1066053197.SGD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM3\" (SGDHDG) INC","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU1823568750.SGD":"Fidelity Global Technology A-ACC SGD","BK4585":"ETF&股票定投概念","LU1084165304.USD":"FIDELITY WORLD \"A\" (USD) ACC","QCMD":"1倍做空QCOM ETF-Direxion","BK4598":"佩洛西持仓","LU1917777945.USD":"安联专题基金Cl AT Acc","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","QCOM":"高通","BK4573":"虚拟现实","QCML":"2倍做多QCOM ETF-GraniteShares","BK4588":"碎股","SG9999002232.USD":"Allianz Global High Payout USD","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","BK4604":"机器人概念","BK4532":"文艺复兴科技持仓","SG9999015952.SGD":"LIONGLOBAL DISRUPTIVE INNOVATION \"I\" (SGD) ACC","LU1119994496.HKD":"FIDELITY WORLD \"A\" (HKD) ACC","BK4554":"元宇宙及AR概念","SG9999002224.SGD":"Allianz Global High Payout SGD","QCMU":"2倍做多QCOM ETF-Direxion","BK4581":"高盛持仓","LU0942090050.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD)  INC","BK4527":"明星科技股","BK4512":"苹果概念","TDV":"ProShares S&P Technology Dividend Aristocrats ETF","LU1066051811.HKD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (HKD) INC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","LU0079474960.USD":"联博美国增长基金A","FTXL":"First Trust Nasdaq Semiconductor ETF","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","BK4534":"瑞士信贷持仓","BK4141":"半导体产品","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","IE00BVYPNQ40.USD":"GUINNESS ASIAN EQUITY INCOME \"C\" (USD) ACC","BK4561":"索罗斯持仓","SG9999015978.USD":"利安颠覆性创新基金A","LU1496350502.SGD":"FRANKLIN DIVERSIFIED DYNAMIC \"A\" (SGDHDG) ACC","SG9999001424.SGD":"United E-Commerce Fund SGD","IE00BVYPNP33.GBP":"GUINNESS ASIAN EQUITY INCOME \"C\" (GBP) ACC","BK4575":"芯片概念","LU2247934214.USD":"FIDELITY FUNDS SUSTAINABLE FUTURE CONNECTIVITY \"A\" (USD) ACC","LU1261432733.SGD":"Fidelity World A-ACC-SGD","IE00BSNM7G36.USD":"NEUBERGER BERMAN SYSTEMATIC GLOBAL SUSTAINABLE VALUE \"A\" (USD) ACC","LU1046421795.USD":"富达环球科技A-ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","IE00BGHQDM52.EUR":"GUINNESS ASIAN EQUITY INCOME \"C\" (EUR) ACC"},"source_url":"https://www.chaincatcher.com/article/2289662","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2667508406","content_text":"ChainCatcher 消息，三星电机与高通正在共同开发用于 2.1D 封装的有机桥技术，相关开发与验证已进行一年以上。有机桥类似英特尔 EMIB 所用硅桥，但采用有机材料并以基板工艺制作，用于连接同一封装内的多颗半导体芯片。三星电机在带凹槽的 FC-BGA 基板中埋入有机桥，连接高通芯片并评估性能与可靠性。高通正考虑将其用于数据中心大型多芯片半导体，并于 2024 年 10 月申请相关专利。三星电机还与多家其他客户并行开发该技术。有机桥目标为 5 至 7 层再布线层，线宽与间距 1.5 至 2 微米、过孔 4 至 5 微米，芯片间图案密度达每毫米 500 至 1000 个。三星电机自行试制评估样品，同时评估外部供应，并与三星电子晶圆代工厂合作进行封装评估。","news_type":1,"symbols_score_info":{"QCML":0.6,"FTXL":0.6,"QCOM":1.91,"QCMD":0.6,"TDV":0.6,"QCMU":0.6,"SQCOMmain":0.6}},"isVote":1,"tweetType":1,"viewCount":47,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":[],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":27,"optionInvolvedFlag":false,"subscribersOnly":false,"subscribersOnlyAccessible":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/608011416319264"}