响亮的厂
01-28
英特尔牛逼的地方还不仅仅是代工！请你们查查，类脑芯片谁领跑全球
报道：供应链消息称，苹果之后，英伟达下一代GPU也将合作英特尔，以取悦特朗普
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11:10","market":"fut","language":"zh","title":"报道：供应链消息称，苹果之后，英伟达下一代GPU也将合作英特尔，以取悦特朗普","url":"https://stock-news.laohu8.com/highlight/detail?id=2606527757","media":"华尔街见闻","summary":"供应链人士透露，英伟达预计在2028年推出的Feynman架构平台将与英特尔合作，英伟达在合作中采用\"量少、低阶、非核心\"的合作策略。除英伟达外，苹果、谷歌、微软、AWS、高通、博通等企业也在与英特尔洽谈合作。分析认为，在政治、供应链韧性与台积电先进封装产能受限的现实下，美国芯片大厂势必启动双代工策略。","content":"<html><head></head><body><blockquote><p>供应链人士透露，英伟达预计在2028年推出的Feynman架构平台将与英特尔合作，英伟达在合作中采用"量少、低阶、非核心"的合作策略。除英伟达外，苹果、谷歌、微软、AWS、高通、博通等企业也在与英特尔洽谈合作。分析认为，在政治、供应链韧性与台积电先进封装产能受限的现实下，美国芯片大厂势必启动双代工策略。</p></blockquote><p>继<a href=\"https://laohu8.com/S/AAPL\">苹果</a>之后，<a href=\"https://laohu8.com/S/NVDA\">英伟达</a>也计划将部分芯片制造业务转向<a href=\"https://laohu8.com/S/INTC\">英特尔</a>代工。英伟达预计在2028年推出的Feynman架构平台将与英特尔合作，这是美国科技巨头在特朗普政府推动"美国制造"目标下调整供应链策略的最新案例。英特尔隔夜涨超3%，夜盘续涨近5%。</p><p class=\"t-img-caption\"><img src=\"https://static.tigerbbs.com/f9163379f1f2f6fb34ab5b05ec19f24f\" tg-width=\"466\" tg-height=\"150\"/></p><p>据DIGITIMES周三报道，<strong>供应链人士透露，英伟达将在与英特尔的合作中采用"量少、低阶、非核心"的合作策略。</strong>GPU核心芯片仍由<a href=\"https://laohu8.com/S/TSM\">台积电</a>代工，而I/O芯片则部分采用英特尔18A或预定2028年量产的14A制程，最后由英特尔EMIB进行先进封装。<strong>按先进封装比重计算，英特尔最高约占25%，台积电约占75%。</strong></p><p>这一转变反映出美国科技企业在政治压力、关税威胁和供应链韧性考量下，不得不从高度集中于台积电的模式转向“多源供应、分散风险”的新策略。除英伟达和苹果外，<a href=\"https://laohu8.com/S/GOOG\">谷歌</a>、<a href=\"https://laohu8.com/S/MSFT\">微软</a>、AWS、<a href=\"https://laohu8.com/S/QCOM\">高通</a>、<a href=\"https://laohu8.com/S/AVGO\">博通</a>、<a href=\"https://laohu8.com/S/SMCI\">超微</a>和<a href=\"https://laohu8.com/S/TSLA\">特斯拉</a>等企业也在与英特尔洽谈合作。</p><p>尽管部分订单分流至英特尔，但业界认为这对台积电"利远大于弊"，有助于降低垄断疑虑、释放政治压力，同时台积电仍有信心稳固高阶芯片代工大单。</p><h2 id=\"id_3992556085\">英伟达Feynman架构部分转向英特尔</h2><p>英伟达在2025年9月宣布斥资50亿美元入股英特尔后，最新规划是在Rubin系列的下一代继任者Feynman架构芯片中与英特尔合作。根据供应链消息，GPU核心芯片仍由台积电代工，I/O芯片则部分采用英特尔18A或14A制程，具体选择取决于14A后续良率量产状况。</p><p>供应链人士表示，在特朗普政府美国制造目标确立与关税压力下，美国芯片大厂早已与英特尔研议合作，但由于18A未达客户期待，合作时间点应在2028年量产的14A。英特尔执行长陈立武日前表示，目前有两家客户正在评估14A制程的具体细节。</p><p>对比14A、18A制程导入风险高，多数业者与英特尔的合作从先进封装EMIB先行。供应链业者分析，美国制造目标面临成本与良率挑战，<strong>但在政治、供应链韧性与台积电先进封装产能受限的现实下，美国芯片大厂势必启动双代工策略。</strong></p><h2 id=\"id_2590994264\">苹果入门级处理器重启英特尔合作</h2><p>苹果与英特尔洽谈多时的合作代工产品，应是MacBook所搭载的"入门级M系列处理器"，目前由台积电代工。苹果Mac系列自2006年起采用英特尔x86处理器，英特尔也在2005年于美国俄勒冈州晶圆厂特为其设立"Apple Group"专属产线。</p><p>2020年6月，苹果正式宣布推出<a href=\"https://laohu8.com/S/ARM\">Arm</a>架构芯片"Apple Silicon"，Mac系列机种2年后全数转采自研芯片。当时苹果主要考量是扩大供应链掌握度以及整合生态系，另一关键是英特尔10纳米制程延迟恐影响Mac新机上市。</p><p>供应链业者透露，苹果3年后重启与英特尔合作的主因，仍是特朗普主导下的美国制造目标与关税冲击，其次是成本、分散单一代工制造风险及产能短缺等因素。</p><h2 id=\"id_2870727608\">台积电三层战略应对客户分流</h2><p>目前观察，苹果、英伟达都以代工风险最低的产品渐进式调整。与英特尔洽谈合作的还有<a href=\"https://laohu8.com/S/GOOGL\">谷歌</a>、微软、AWS、高通、<a href=\"https://laohu8.com/S/600455\">博通</a>、超微与特斯拉等，以及掌握度最高的美国政府标案长约大单。不过，英特尔能否符合早已习惯台积电模式的科技龙头需求，变数仍大。</p><p>对台积电来说，已预见众多客户会另转往英特尔投片，但分析认为实际上"利远大于弊"，至少有三层战略考量：<strong>第一，可降低垄断与监管疑虑；第二，可释放美国政治压力；第三，外溢仅是"非核心"订单，有助于未来议价与供货。</strong></p><p>一方面替台积电在晶圆代工业市占率过高恐牵扯反垄断法的疑虑有所解套，二方面适度释出非核心订单也可减轻来自特朗普政府不断释出各种要求的压力，三方面台积电仍有信心稳固各大厂核心的高阶芯片代工大单。或许试过转单其他晶圆代工厂的客户，才会想念台积电的美好，这对于台积电未来的议价、供货更具优势。</p></body></html>","collect":0,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>报道：供应链消息称，苹果之后，英伟达下一代GPU也将合作英特尔，以取悦特朗普</title>\n<style 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href=\"https://wallstreetcn.com/articles/3764313\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","type":0,"thumbnail":"https://static.tigerbbs.com/c74be4c2a08964ef2daf32217f693b44","relate_stocks":{"LU2168564065.EUR":"AZ ALLOCATION - TREND \"AAZ\" (EUR) ACC","LU1629891620.HKD":"ALLIANZ INCOME AND GROWTH \"AMG2\" (H2-HKD) INC","LU2326559502.SGD":"Natixis Loomis Sayles US Growth Equity P/A SGD-H","LU1935042488.USD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (USD) INC","LU2168563687.JPY":"AZ ALLOCATION - TREND \"AAZ\" (JPYHDG) ACC","LU1935042991.SGD":"MANULIFE GF GLOBAL MULTI-ASSET DIVERSIFIED INCOME \"AA\" (SGDHDG) INC","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","LU1633808545.USD":"ALLIANZ GLOBAL EQUITY GROWTH \"AT\" (USD) ACC","LU2168564149.EUR":"AZ ALLOCATION - TREND \"BAZ\" (EUR) ACC","LU0203202063.USD":"AB SICAV I - ALL MARKET INCOME PORTFOLIO \"A2X\" (USD) ACC","IE000W1ABFV2.USD":"PIMCO BALANCED INCOME AND GROWTH 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ACC","BK4543":"AI"},"source_url":"https://wallstreetcn.com/articles/3764313","is_english":false,"share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","article_id":"2606527757","content_text":"供应链人士透露，英伟达预计在2028年推出的Feynman架构平台将与英特尔合作，英伟达在合作中采用\"量少、低阶、非核心\"的合作策略。除英伟达外，苹果、谷歌、微软、AWS、高通、博通等企业也在与英特尔洽谈合作。分析认为，在政治、供应链韧性与台积电先进封装产能受限的现实下，美国芯片大厂势必启动双代工策略。继苹果之后，英伟达也计划将部分芯片制造业务转向英特尔代工。英伟达预计在2028年推出的Feynman架构平台将与英特尔合作，这是美国科技巨头在特朗普政府推动\"美国制造\"目标下调整供应链策略的最新案例。英特尔隔夜涨超3%，夜盘续涨近5%。据DIGITIMES周三报道，供应链人士透露，英伟达将在与英特尔的合作中采用\"量少、低阶、非核心\"的合作策略。GPU核心芯片仍由台积电代工，而I/O芯片则部分采用英特尔18A或预定2028年量产的14A制程，最后由英特尔EMIB进行先进封装。按先进封装比重计算，英特尔最高约占25%，台积电约占75%。这一转变反映出美国科技企业在政治压力、关税威胁和供应链韧性考量下，不得不从高度集中于台积电的模式转向“多源供应、分散风险”的新策略。除英伟达和苹果外，谷歌、微软、AWS、高通、博通、超微和特斯拉等企业也在与英特尔洽谈合作。尽管部分订单分流至英特尔，但业界认为这对台积电\"利远大于弊\"，有助于降低垄断疑虑、释放政治压力，同时台积电仍有信心稳固高阶芯片代工大单。英伟达Feynman架构部分转向英特尔英伟达在2025年9月宣布斥资50亿美元入股英特尔后，最新规划是在Rubin系列的下一代继任者Feynman架构芯片中与英特尔合作。根据供应链消息，GPU核心芯片仍由台积电代工，I/O芯片则部分采用英特尔18A或14A制程，具体选择取决于14A后续良率量产状况。供应链人士表示，在特朗普政府美国制造目标确立与关税压力下，美国芯片大厂早已与英特尔研议合作，但由于18A未达客户期待，合作时间点应在2028年量产的14A。英特尔执行长陈立武日前表示，目前有两家客户正在评估14A制程的具体细节。对比14A、18A制程导入风险高，多数业者与英特尔的合作从先进封装EMIB先行。供应链业者分析，美国制造目标面临成本与良率挑战，但在政治、供应链韧性与台积电先进封装产能受限的现实下，美国芯片大厂势必启动双代工策略。苹果入门级处理器重启英特尔合作苹果与英特尔洽谈多时的合作代工产品，应是MacBook所搭载的\"入门级M系列处理器\"，目前由台积电代工。苹果Mac系列自2006年起采用英特尔x86处理器，英特尔也在2005年于美国俄勒冈州晶圆厂特为其设立\"Apple Group\"专属产线。2020年6月，苹果正式宣布推出Arm架构芯片\"Apple Silicon\"，Mac系列机种2年后全数转采自研芯片。当时苹果主要考量是扩大供应链掌握度以及整合生态系，另一关键是英特尔10纳米制程延迟恐影响Mac新机上市。供应链业者透露，苹果3年后重启与英特尔合作的主因，仍是特朗普主导下的美国制造目标与关税冲击，其次是成本、分散单一代工制造风险及产能短缺等因素。台积电三层战略应对客户分流目前观察，苹果、英伟达都以代工风险最低的产品渐进式调整。与英特尔洽谈合作的还有谷歌、微软、AWS、高通、博通、超微与特斯拉等，以及掌握度最高的美国政府标案长约大单。不过，英特尔能否符合早已习惯台积电模式的科技龙头需求，变数仍大。对台积电来说，已预见众多客户会另转往英特尔投片，但分析认为实际上\"利远大于弊\"，至少有三层战略考量：第一，可降低垄断与监管疑虑；第二，可释放美国政治压力；第三，外溢仅是\"非核心\"订单，有助于未来议价与供货。一方面替台积电在晶圆代工业市占率过高恐牵扯反垄断法的疑虑有所解套，二方面适度释出非核心订单也可减轻来自特朗普政府不断释出各种要求的压力，三方面台积电仍有信心稳固各大厂核心的高阶芯片代工大单。或许试过转单其他晶圆代工厂的客户，才会想念台积电的美好，这对于台积电未来的议价、供货更具优势。","news_type":1,"symbols_score_info":{"INTC":2}},"isVote":1,"tweetType":1,"viewCount":543,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":["SOXS","INTC","SMH","SOXX"],"verified":2,"subType":0,"readableState":1,"langContent":"CN","currentLanguage":"CN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":60,"optionInvolvedFlag":false,"xxTargetLangEnum":"ZH_CN"},"commentList":[],"isCommentEnd":true,"isTiger":false,"isWeiXinMini":false,"url":"/m/post/526886520590584"}
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