高通(QCOM.US)未来骁龙旗舰芯片或采用三星2nm工艺台积电(TSM.US)订单面临分流

智通财经09-28

【高通(QCOM.US)未来骁龙旗舰芯片或采用三星2nm工艺台积电(TSM.US)订单面临分流】智通财经APP获悉，高通(QCOM.US)刚刚发布了基于 2nm 制造工艺的骁龙 8 Elite Gen 6 与骁龙 8 Elite Extreme Gen 6 芯片组。此前曾有传闻称，高通会用三星代工(Samsung Foundry)生产其部分高端芯片，但新的芯片组并非出自三星代工。如今据报道，这家芯片制造商透露，正在与三星代工就未来的骁龙移动平台展开合作——这意味着高通即将推出的一些旗舰芯片组，有可能采用三星先进的 2nm 工艺技术制造。

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高通(QCOM.US)未来骁龙旗舰芯片或采用三星2nm工艺 台积电(TSM.US)订单面临分流

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高通(QCOM.US)未来骁龙旗舰芯片或采用三星2nm工艺台积电(TSM.US)订单面临分流