英伟达瞄准玻璃基板，芯片速度或提升40%，功耗减半

经纬科创09-27 13:09

据外媒报道，英伟达正考虑采用玻璃基板，并与德国设备制造商SCHMID及其他公司合作，以期将人工智能芯片的性能提升到一个新水平。　　韩媒《首尔经济日报》24日报道称，英伟达该战略旨在通过增加可安装的高带宽内存（HBM）容量，大幅提高数据处理速度。　　《首尔经济日报》援引Investing报道，SCHMID在最近一次上半年财报发布会上披露，该公司正与英特尔、英伟达和AMD各自供应链中的关键供应商...

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