金太阳：以芯片抛光液为抓手切入半导体赛道

证券之星09-23

证券之星消息，金太阳(300606)09月22日在投资者关系平台上答复投资者关心的问题。

投资者提问：贵公司投资以及参股一些公司都是半导体相关，是否可以转型到半导体芯片板块呢？比如收购或者重组等方式，谢谢。

金太阳回复：您好！公司将持续深耕研磨材料主业，以芯片抛光液为抓手切入半导体赛道，加速实现向高端半导体抛光材料/零部件领域转型的平台型公司。感谢您的关注和建议！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：陈思雨

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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