长盈精密：公司控股子公司梦启半导体的主要业务为芯片减薄设备

证券之星09-24 17:09

证券之星消息，长盈精密(300115)09月24日在投资者关系平台上答复投资者关心的问题。

投资者提问：贵司半导体设备进入封装企业了吗？年销量多少台？

长盈精密回复：您好。公司控股子公司梦启半导体的主要业务为芯片减薄设备，业务详情您可参考其公司官网。谢谢。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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