平头哥发布国内最强AI芯片，将于2027年第一季度上市

深圳商报·读创09-22 13:13

9月22日，在2026杭州云栖大会上，平头哥发布新一代训推一体AI芯片真武V900，性能是真武M890的三倍，这是目前算力性能最强的中国自研AI芯片，可满足万亿级参数大模型的训练和推理需求。该芯片将于2027年第一季度量产售卖。　　记者从大会获悉，真武V900基于自研并行计算架构设计，搭载216GB大容量显存，片间互联带宽达1200GB/s，单芯片性能是真武M890的3倍。该芯片原生支持FP8、...

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K3等超2万亿参数规模模型。　　据平头哥透露，真武系列芯片已服务超650家企业客户，覆盖智驾、金融、大模型、具身智能、能源、制造等千行百业，是场景应用最广的中国自研AI芯片之一。阿里巴巴集团CEO吴泳铭表示：“由于平头哥芯片产品线的成熟和客户的广泛应用，平头哥AI芯片的年出货量将大幅提升。”　　Agent产品正在爆发，其任务规划、状态管理、工具调用等环节极其依赖CPU，同时海量数据的预处理、编排与吞吐也需要CPU完成。因此，Agent不仅需要高AI算力支撑，还需要单核性能强、内存带宽高，并与GPU紧耦合的CPU，以提升Agent的运行效率。　　大会现场，平头哥首次公布倚天服务器CPU的规划，2027年将推出倚天720和倚天730两代服务器CPU。据介绍，倚天720将实现单核性能、核密度与能效的全面提升；倚天730将首次基于平头哥全自研CPU微架构设计，单核SPECint2017/GHz性能将最高提升至倚天710的1.4倍。　　平头哥透露，未来几年将持续升级自研CPU微架构，基于第二代自研核的倚天750，将支持平头哥自研ICN片间互联总线协议，倚天CPU与真武AI芯片之间可通过ICN总线直接互联，进一步提升CPU与AI芯片的协同效率。　　目前，平头哥已推出真武系列AI芯片、倚天系列服务器CPU、ICN Switch互联芯片、磐脉系列智能网卡、镇岳系列存储主控芯片等数据中心核心芯片，实现算力、网力和存力的全栈自研，并实现全栈高效协同，为广泛的AI场景提供强大算力。（文章来源：深圳商报·读创）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":false,"editions":null,"column":"","sentiment":"2","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":1,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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