平头哥发布训推一体AI芯片真武V900，计划2027年一季度量产｜直击2026云栖大会

国际金融报09-22 17:01

9月22日，在2026杭州云栖大会上，平头哥发布新一代训推一体AI芯片真武V900。平头哥称，该芯片单芯片性能为真武M890的三倍，可满足万亿级参数大模型的训练和推理需求，将于2027年第一季度量产售卖。　　据平头哥介绍，真武V900基于自研并行计算架构设计，搭载216GB大容量显存，片间互联带宽达1200GB/s。该芯片原生支持FP8、FP4低精度计算，可在大幅提升算力密度的同时降低推理成本，...

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