机构：AI芯片封装突破光罩极限，CoWoS-L稳居先进封装主流至2028年

智通财经09-18 14:48

【机构：AI芯片封装突破光罩极限，CoWoS-L稳居先进封装主流至2028年】根据TrendForce集邦咨询最新半导体先进封装产业研究，随着GPU厂商、超大型云端服务供应商持续开发更强大、功能多元的AI芯片，2.5D封装技术的一项发展重点在于扩大封装面积。其中，TSMCCoWoS-L尽管面临IntelEMIB-T的竞争，但凭借其技术成熟度与良率优势，预计至2028年仍将是AI芯片的主流封装方案。

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