晶盛机电：开发12英寸减薄抛光机等先进封装设备

证券之星09-18 16:27

证券之星消息，晶盛机电(300316)09月18日在投资者关系平台上答复投资者关心的问题。

投资者提问：AI推动先进封装设备放量，贵公司在先进封装领域有哪些业务或产品布局？如键合设备、封装设备等

晶盛机电回复：尊敬的投资者，您好。在先进封装端，公司开发了12英寸减薄抛光机、12英寸减薄抛光清洗一体机、超快紫外激光开槽设备，依托差异化工艺技术，向客户提供相应产品和服务。公司持续关注先进封装行业机遇，稳步推进相关设备研发及市场拓展，相关进展请以公司公告为准。感谢您的关注。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

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责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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