聚和材料最新公告：拟3亿元入伙国聚同辉布局半导体材料领域

证券之星09-14 18:31

聚和材料(688503.SH)公告称，公司拟以自有资金作为有限合伙人入伙上海国聚同辉企业管理咨询合伙企业(有限合伙)并新增认缴出资3亿元。本次增资及认缴出资份额转让完成后，国聚同辉认缴出资总额将增至9.5亿元，其中公司认缴3亿元，占比31.58%。国聚同辉拟重点关注半导体材料相关领域。本次交易构成关联交易，尚需提交股东会审议。

以上内容为证券之星据公开信息整理，仅供参考不构成投资建议。

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