国信证券：覆铜板与半导体封装快速迭代硅微粉填料国产化空间巨大

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【国信证券：覆铜板与半导体封装快速迭代硅微粉填料国产化空间巨大】国信证券发布研报称，硅微粉作为一种性能优异的先进无机非金属矿物功能填料，应用广泛，主要应用在覆铜板和芯片封装材料中，市场增速均较快。根据贝哲斯咨询数据，2024年中国硅微粉市场需求量为41.8万吨，预计2025年中国硅微粉需求量将达47.3万吨，同比增13.2%。国内硅微粉企业技术能力快速发展，逐步进入高端球硅市场，高端球硅国产...

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国信证券：覆铜板与半导体封装快速迭代 硅微粉填料国产化空间巨大

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国信证券：覆铜板与半导体封装快速迭代硅微粉填料国产化空间巨大