联发科抢先高通(QCOM.US)发布首款2nm手机芯片天玑9600 Pro，端侧AI性能大增

智通财经09-15 18:53

【联发科抢先高通(QCOM.US)发布首款2nm手机芯片天玑9600 Pro，端侧AI性能大增】智通财经APP获悉，联发科(MediaTek)周二发布了一款采用台积电(TSM.US)最先进制造工艺打造的新智能手机芯片，目标直指高端手机市场——其半导体产品能够让更多 AI 功能直接在设备端运行。此举是联发科向美国竞争对手高通(QCOM.US)争夺高端手机市场的整体战略的一部分。在这个市场，价格更高的设备与 AI 功能能为芯片厂商带来更好的利润率。

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