思瑞浦：全系列光通信模拟芯片方案亮相相关方案已完成客户验证

智通财经09-10

【思瑞浦：全系列光通信模拟芯片方案亮相相关方案已完成客户验证】思瑞浦官微消息，9月9日—11日，思瑞浦参加第27届中国国际光电博览会，展示面向光通信领域的模拟与数模混合芯片创新解决方案。展品覆盖800G/1.6T可插拔高速光模块方案、CPO/NPO共封装光学与ELSFP外置光源量产级配套方案、OCS全光交换成套控制方案以及相干光模块与EDFA光放大全链路方案。其中，针对下一代高密度光电集成技术发展方向，思瑞浦CPO/NPO共封装光学、ELSFP外置光源两套完整方案均已完成客户验证，有效帮助客户压缩产品研发周期，加快产品推向市场。

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思瑞浦：全系列光通信模拟芯片方案亮相 相关方案已完成客户验证

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思瑞浦：全系列光通信模拟芯片方案亮相相关方案已完成客户验证