甬硅电子：下半年重点推进2.5D先进封装客户拓展、验证及产品导入

智通财经19:07

【甬硅电子：下半年重点推进2.5D先进封装客户拓展、验证及产品导入】在9月10日的半年度业绩会上，甬硅电子董事长、总经理王顺波介绍，2026年下半年，公司将继续坚持大客户战略，在深化现有核心客户合作的基础上，重点推进海外头部客户和2.5D先进封装客户的拓展、验证及产品导入。同时，公司将稳步推进Bumping、晶圆级封装、FC及2.5D/3D等先进封装产品线建设，持续提升“Bumping＋CP＋FC＋FT”一站式交付能力。

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