君正股份：公司的3D‑DRAM产品是存储单元器件层面垂直堆叠的DRAM

证券之星09-10 16:18

证券之星消息，君正股份(300223)09月10日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问公司的3D‑DRAM产品，是存储单元器件层面垂直堆叠的DRAM，还是基于传统2D DRAM裸片通过先进封装堆叠实现的方案？

君正股份回复：您好！公司的3D‑DRAM产品是存储单元器件层面垂直堆叠的DRAM。谢谢！

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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