胜宏科技：成功攻克30层10阶HDI、36层14阶HDI核心制造工艺

证券之星09-08 20:53

证券之星消息，胜宏科技(300476)09月07日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，海外新一代全液冷高端AI算力平台，PCB向M8/M9高速材料、26层以上高阶HDI、超细线路演进，单机柜PCB价值量大幅提升。请问：1、公司对应上述高端算力场景的高速高阶PCB，技术验证、客户导入、量产落地进度如何？MSAP工艺产线能否满足超细线路制造要求？2、面对45℃进水高温液冷的长期工作环境，公司PCB产品相关可靠性测试完成情况？3、公司惠州新建高端产线以及海外基地，产能规划

胜宏科技回复：尊敬的投资者，您好！公司成功攻克30层10阶HDI、36层14阶HDI核心制造工艺，高端高阶PCB制程能力迈上新台阶。积极推进70层以上铜浆烧结、垂直供电埋容高多阶HDI以及COWOP先进封装基板技术落地，满足AI算力服务器、高端通讯领域的高阶PCB量产需求。公司已布局mSAP产线，用于1.6T光模块产品工艺需求。目前公司相关扩产项目均按计划有序推进，随着各项目陆续投产、爬坡并贡献业绩，公司对后续盈利能力充满信心。谢谢关注。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

相关 ETF

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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