中瓷电子：高散热ALN陶瓷基板可用于存储芯片的封装

证券之星08-27

证券之星消息，中瓷电子(003031)08月27日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好：请问贵公司陶瓷外壳/基板目前是否可以用于存储芯片的封装散热场景？公司在先进封装领域有哪些布局？

中瓷电子回复：您好，我司研发生产的高散热ALN陶瓷基板，高密布线基板可用于存储芯片的封装。市场技术路线多样，我方会持续关注多元技术路线，强化前瞻布局与技术储备。谢谢您的关心。

本文数据来源于深圳证券交易所互动易，仅供参考不构成投资建议。

责任编辑：刘浩然

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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